JP2006192465A - System and method for working and carrying-out product - Google Patents

System and method for working and carrying-out product Download PDF

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JP2006192465A
JP2006192465A JP2005006426A JP2005006426A JP2006192465A JP 2006192465 A JP2006192465 A JP 2006192465A JP 2005006426 A JP2005006426 A JP 2005006426A JP 2005006426 A JP2005006426 A JP 2005006426A JP 2006192465 A JP2006192465 A JP 2006192465A
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product
processing
plate material
unloading
conveyor
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JP4871510B2 (en
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Masataka Kashiro
政孝 鍛代
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Amada Co Ltd
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Amada Co Ltd
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<P>PROBLEM TO BE SOLVED: To eliminate an additional working process for a micro-joint, etc. by successively carrying out products or produced scraps. <P>SOLUTION: A system 1 for working a sheet material W and carrying-out a product comprises a working section for working the sheet material, a product carrying-out section C for carrying out the worked product, and a control unit S for controlling the working section and the product carrying-out section C. The working section comprises a laser machining section B for laser machining at least the positioned sheet material W. The product carrying-out section C has a conveyor table 27 for loading the member cut off from the sheet material W thereon, and an elevating means for elevating the conveyor table 27. The control unit S lowers the conveyor table 27, on which the products are loaded, based on the blanking data preliminarily determined for the sheet material W, and after that, successively carries out the products by driving the conveyor. When scraps have been produced in working the products, the scraps also are successively carried out. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は製品の加工・搬出システム及びその方法に関し、さらに詳細には、板材をXY方向に移動して位置決めし、板材に対してパンチ加工を行うパンチ加工部と、板材に対してレーザ加工を行うレーザ加工部とを備えたパンチ・レーザ複合加工機において製品の搬出を制御すると共に桟(前記製品以外の残材をいう。例えば製品と製品との間の部材)の搬出の制御を行う製品の加工・搬出システム及びその方法に関する。   TECHNICAL FIELD The present invention relates to a product processing / unloading system and method, and more specifically, a punch processing unit that moves and positions a plate material in the XY directions and performs punch processing on the plate material, and performs laser processing on the plate material. A product that controls the unloading of a product and controls the unloading of a crosspiece (referred to as a remaining material other than the product, for example, a member between the products) in a punch / laser combined processing machine equipped with a laser processing unit to perform The present invention relates to a processing / unloading system and method thereof.

従来、パンチ・レーザ複合機での製品の搬出方法は、ミクロジョイントによる母材との一体取り出し、シュータによる取り出し、又はテイクアウトによる吸着取り出しが一般的である。   Conventionally, as a method for carrying out a product in a punch / laser complex machine, integral take-out with a base material by a micro joint, take-out by a shooter, or suction take-out by take-out is generally performed.

すなわち、1つの板材から複数の製品が切り出される。そして、切断した製品を完全に分離することなくミクロジョイントにより製品を板材に支持して加工が完了した後に、このミクロジョイントを切断し各製品を分離することが行われている。   That is, a plurality of products are cut out from one plate material. Then, after processing is completed by supporting the product on a plate material by a micro joint without completely separating the cut product, the micro joint is cut to separate each product.

また、切り離し加工を行う受け部に、ヒンジ結合によって下方へ開閉自在なシュータを適数設け、対象製品の大きさに従って製品を搬出する。   In addition, an appropriate number of shooters that can be opened and closed downward by hinge coupling are provided in the receiving portion that performs the separation process, and the product is carried out according to the size of the target product.

さらに、製品や端材を搬出する方法として、クランプ装置、マグネット装置、バキュームパット吸着装置を備えたテイクアウトローダが提案されている。   Furthermore, a take-out loader including a clamp device, a magnet device, and a vacuum pad suction device has been proposed as a method for carrying out products and scraps.

特許文献1〜3参照。
特開平8−243964号公報 特開2001−259946号公報 特開2001−30028号公報
See Patent Documents 1 to 3.
JP-A-8-243964 JP 2001-259946 A Japanese Patent Laid-Open No. 2001-30028

このような従来の方法では、以下のような問題があった。すなわち、ミクロジョイントによる母材との一体取り出しは搬送後にバラシの手間が必要となり、また、外周に分離後の突起が残るという問題がある。   Such a conventional method has the following problems. That is, there is a problem that integral removal with the base material by the microjoint requires troublesomeness after conveyance, and the separated protrusions remain on the outer periphery.

また、シュータを用いる装置では、製品等の取り出しのためにシュータを十分に傾動させる必要があり、その開閉に時間が掛かって生産性が低下するという問題がある。また、製品等をシュータ上を滑らせて取り出すので、引っかかりを生じて円滑に取り出せない場合がある。   In addition, in a device using a shooter, it is necessary to tilt the shooter sufficiently for taking out a product or the like, and there is a problem that it takes time to open and close and the productivity is lowered. In addition, since the product or the like is taken out by sliding on the shooter, it may be caught and cannot be taken out smoothly.

テイクアウトによる吸着取り出しはプログラムが煩雑となり、取り出しも不確実、取り出し時間が掛かり生産性が低下するという問題がある。例えば、テイクアウトローダを切り出された製品や端材の上に移動させてクランプや吸着を行うので、作業工程が複雑でプログラム化が難しい。また取り出し作業の確実性が十分でなく、作業に時間を要し、生産性が低下する。   There is a problem that the take-out sucking and taking out requires a complicated program, taking out uncertainly, taking out taking time, and reducing productivity. For example, since the take-out loader is moved onto the cut out product or end material to perform clamping and suction, the work process is complicated and programming is difficult. Moreover, the reliability of the taking-out work is not sufficient, and the work takes time, and the productivity is lowered.

本発明は、前述のごとき問題に鑑みてなされたもので請求項1に係る発明は、板材を加工し製品の搬出を行う製品の加工・搬出システムにおいて、前記板材を加工する加工部と、加工された製品の搬出を行う製品搬出部と、これらの制御を行う制御部とを備え、前記加工部は少なくとも位置決めされた板材にレーザ加工を行うレーザ加工部を備え、前記製品搬出部は、前記板材から切り離された部材を載置するコンベアテーブルと、前記コンベアテーブルを昇降する昇降手段とを有し、前記制御部は、予め板材に板取りされた板取りデータに基づき、前記製品を載置した前記コンベアテーブルを下降させた後、コンベアを作動させ前記製品を逐次搬出し、前記製品の加工中に桟が生成した場合に前記桟も逐次搬出させる製品の加工・搬出システムである。   The present invention has been made in view of the above-described problems. The invention according to claim 1 is a product processing / unloading system for processing a plate material and carrying out the product, and a processing section for processing the plate material, A product unloading unit that unloads the manufactured product, and a control unit that performs these controls, the processing unit includes a laser processing unit that performs laser processing on at least the positioned plate material, and the product unloading unit includes A conveyor table for placing a member separated from the plate material; and a lifting means for raising and lowering the conveyor table; and the control unit places the product on the basis of plate cutting data that has been plated in advance on the plate material. After the conveyor table is lowered, the conveyor is operated to sequentially carry out the product, and when a crosspiece is generated during the processing of the product, the crosspiece is also sequentially taken out. It is a non.

請求項2に係る発明は、前記制御部は、予め板材に板取りされた板取りデータに基づき、前記板材のY方向より製品取りを行い前記製品を逐次搬出する制御を行う請求項1記載の製品の加工・搬出システムである。   The invention according to claim 2 is characterized in that the control unit performs control to take out the product from the Y direction of the plate material and sequentially carry out the product based on the plate cutting data pre-cut into the plate material. Product processing / unloading system.

請求項3に係る発明は、前記制御部は、予め板材に板取りされた板取りデータに基づき、前記板材のX方向より製品取りを行い前記製品を逐次搬出する制御を行う請求項1記載の製品の加工・搬出システムである。   The invention according to claim 3 is the control device according to claim 1, wherein the control unit performs control to take out the product from the X direction of the plate and sequentially carry out the product based on the plate data that has been cut into the plate in advance. Product processing / unloading system.

請求項4に係る発明は、板材を加工し製品の搬出を行う製品の加工・搬出方法において、前記板材を加工する加工工程と、加工された製品の搬出を行う製品搬出工程とを含み、前記加工工程は少なくとも位置決めされた板材にレーザ加工を行うレーザ加工工程を含み、前記製品搬出工程は、コンベアテーブルに前記板材から切り離された部材を載置し、前記製品を載置した前記コンベアテーブルを下降させた後、コンベアを作動させ前記製品を逐次搬出し、前記製品の加工中に桟が生成した場合に前記桟も逐次搬出させる製品の加工・搬出方法である。   The invention according to claim 4 includes a processing step of processing the plate material and a product unloading step of unloading the processed product in a product processing / unloading method of processing a plate material and discharging the product, The processing step includes at least a laser processing step for performing laser processing on the positioned plate material, and the product carry-out step places a member separated from the plate material on a conveyor table, and the conveyor table on which the product is placed This is a product processing / unloading method in which, after being lowered, the conveyor is operated to sequentially carry out the product, and when the crosspiece is generated during the processing of the product, the crosspiece is also sequentially carried out.

上述の如く本発明によれば、加工された製品は逐次板材の桟の下を通過したり、そのまま搬出されるため、余計な桟加工(例えばミクロジョイント加工)をする必要が無くプログラムの容易化、加工効率の向上が図れるという効果がある。   As described above, according to the present invention, since the processed product sequentially passes under the plate bars or is transported as it is, it is not necessary to perform extra beam processing (for example, micro joint processing), thereby facilitating the program. There is an effect that the processing efficiency can be improved.

また、桟が生成した場合にも、逐次そのまま搬出される為、板材の加工が終了した後は製品と桟が全て仕分けされている。さらに、余分な桟(例えばミクロジョイント)が無いため板材の歩留まりが向上するという効果がある。   Further, even when the crosspieces are generated, they are sequentially carried out as they are, so that the products and the crosspieces are all sorted after the processing of the plate material is completed. Further, since there is no extra beam (for example, a micro joint), the yield of the plate material is improved.

本発明の実施の形態を、図面を参照して説明する。図1に示すように、製品の加工・搬出システム(例えばレーザ・パンチ複合機)1は、パンチ加工部A、レーザ加工部B、製品搬出部C、および制御部Dを備えている。   Embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1, a product processing / unloading system (for example, a laser / punch combined machine) 1 includes a punching section A, a laser processing section B, a product unloading section C, and a control section D.

そして、ベース(図示しない)上に門形のフレーム3が立設され、このフレーム3には回転可能な上部タレット5が、ベース上に配置された下部タレット7と対向して設けられている。この上部タレット5、下部タレット7には、それぞれ周方向に適宜な間隔で相対向した複数のパンチP、ダイDが装着されパンチ加工部Aが構成されている。   A gate-shaped frame 3 is erected on a base (not shown), and a rotatable upper turret 5 is provided on the frame 3 so as to face a lower turret 7 disposed on the base. A plurality of punches P and dies D facing each other at appropriate intervals in the circumferential direction are mounted on the upper turret 5 and the lower turret 7 to form a punching portion A.

上部タレット5、下部タレット7は同期して回転し、加工を行うパンチP、ダイDが加工位置Kに割り出される。加工位置Kにおいて、ストライカ(図示しない)を上下動させることにより、加工位置Kに位置決めされた板材WにパンチPとダイDとの協働でパンチング加工が行われる。   The upper turret 5 and the lower turret 7 rotate in synchronization, and the punch P and the die D for processing are indexed to the processing position K. By punching up and down a striker (not shown) at the processing position K, punching is performed on the plate material W positioned at the processing position K in cooperation with the punch P and the die D.

ベース上には、製品の加工・搬出システム1の機械全幅にほぼ等しい長さを持つキャレッジベース11が駆動モータ、ボールねじ(図示しない)によってY軸方向に移動自在に設けられている。キャレッジベース11には駆動モータ、ボールねじ(図示しない)によってX方向へ移動自在なキャレッジ13が設けられ、このキャレッジ13には板材Wをクランプする複数の板材クランプ15が設けられている。   On the base, a carriage base 11 having a length substantially equal to the entire machine width of the product processing / unloading system 1 is provided so as to be movable in the Y-axis direction by a drive motor and a ball screw (not shown). The carriage base 11 is provided with a carriage 13 that can be moved in the X direction by a drive motor and a ball screw (not shown), and the carriage 13 is provided with a plurality of plate clamps 15 for clamping the plate member W.

また、製品の加工・搬出システム1は板材WをX,Y方向へ移動して、パンチ加工部A、レーザ加工部Bに板材Wを位置決めし製品を加工後、製品を搬出する製品搬出部Cを備えている。   In addition, the product processing / unloading system 1 moves the plate material W in the X and Y directions, positions the plate material W in the punching section A and the laser processing section B, processes the product, and then unloads the product. It has.

前記製品の加工・搬出システム1には、製品の搬出側(加工位置Kに対して左側)の位置に、レーザ加工ヘッド17が駆動モータ、ボールねじ(図示しない)によってY軸方向へ移動自在に設けられ、レーザ加工部Bを構成している。レーザ加工ヘッド17はパンチ加工位置KよりX方向へ距離X0だけオフセットされたレーザ加工位置LにおいてY軸方向に所定範囲移動する。   In the product processing / unloading system 1, the laser processing head 17 is movable in the Y-axis direction by a drive motor and a ball screw (not shown) at a position on the product unloading side (left side with respect to the processing position K). The laser processing part B is provided. The laser processing head 17 moves by a predetermined range in the Y-axis direction at a laser processing position L offset by a distance X0 from the punching position K in the X direction.

製品の加工・搬出システム1はレーザ発振器19を備え、前記レーザ発振器19からレーザビームをレーザ加工ヘッド17に導くビームガイド手段が設けられている。ビームガイド手段は、レーザ加工位置Lの脇の第1のベンドミラー21およびレーザ加工ヘッド17上部に設置された第2のベンドミラー23を有している。レーザ加工ヘッド17がY方向の任意の位置に移動しても、レーザ発振器19で出力されたレーザビームLBは、ベンドミラー21,23を経てレーザ加工ヘッド17に案内され、レーザ加工ヘッド17に備えられた集光レンズで集光された後、板材Wへ向けて照射される。   The product processing / unloading system 1 includes a laser oscillator 19, and beam guide means for guiding a laser beam from the laser oscillator 19 to a laser processing head 17 is provided. The beam guide means includes a first bend mirror 21 on the side of the laser processing position L and a second bend mirror 23 installed on the upper part of the laser processing head 17. Even if the laser processing head 17 is moved to an arbitrary position in the Y direction, the laser beam LB output from the laser oscillator 19 is guided to the laser processing head 17 via the bend mirrors 21 and 23 and provided in the laser processing head 17. After being condensed by the collected condenser lens, it is irradiated toward the plate material W.

レーザ加工を行う際は、レーザ加工ヘッド17を板材Wの加工開始位置に位置合わせした後、レーザビームを照射しつつ、キャレッジ13をX方向へ移動させて板材WをX軸方向へ移動させると共に、レーザ加工ヘッド17をY方向へ移動させる。このようにして、板材Wの所望位置にレーザ加工を行う。   When performing laser processing, after aligning the laser processing head 17 with the processing start position of the plate material W, while moving the carriage 13 in the X direction while irradiating the laser beam, the plate material W is moved in the X axis direction. The laser processing head 17 is moved in the Y direction. In this way, laser processing is performed on a desired position of the plate material W.

ベース上には、板材Wを載置するフロントテーブル25が設けられており、このフロントテーブルには板材Wに傷はつかないようにするためにテーブル面にブラシが植設されている。   On the base, a front table 25 on which the plate material W is placed is provided, and a brush is implanted on the table surface of the front table so that the plate material W is not damaged.

一方、レーザ加工位置Lより左側の板材搬出には、主にレーザ加工の際の加工テーブルであり、かつX方向に板材並びに製品を搬出する製品搬送部Cであるコンベアテーブル27が設けられている。このコンベアテーブル27は、この実施の形態では、4つのコンベアセグメントCS1〜CS4がY方向に並列して配置されている。しかしながら、4つのセグメントに拘わることなく、複数または一体した単体でも可なることは言うまでもない。   On the other hand, the plate material unloading on the left side from the laser processing position L is provided with a conveyor table 27 that is a processing table mainly used for laser processing and is a product conveying unit C for unloading the plate material and products in the X direction. . In this embodiment, the conveyor table 27 has four conveyor segments CS1 to CS4 arranged in parallel in the Y direction. However, it goes without saying that a plurality or a single unit can be used regardless of the four segments.

図2を参照する。それぞれのコンベアセグメントCS1〜CS4は、X方向の両側に設けられた2つのコンベア31,33と、これら2つのコンベア31,33の間に掛け渡されて配置されたフリーブラシローラ35とを備えている。また、レーザ加工位置Lの下方に当たる場所には、レーザビームを逃がし、加工に伴って生成する溶融金属(ドロス)等を排出する開口部37が設けられている。   Please refer to FIG. Each of the conveyor segments CS1 to CS4 includes two conveyors 31 and 33 provided on both sides in the X direction, and a free brush roller 35 arranged between the two conveyors 31 and 33. Yes. In addition, an opening 37 is provided at a position below the laser processing position L to allow the laser beam to escape and to discharge molten metal (dross) generated by the processing.

各コンベアセグメントCS1〜CS4の両側のコンベア31,33は、それぞれベース上に立設された支持台39上に、昇降用アクチュエータ(例えば油圧シリンダ)41を介して取り付けられ、図2(b)に示すように、これらの油圧シリンダ41,41を作動させることによって、1列のコンベアセグメントCS1〜CS4を個別に昇降させることができる。また、各コンベア31,33は、ブラシ付きコンベアベルトがテーブルフレーム43に軸支された一対のローラに循環走行回転するように巻回されており、それぞれのコンベア用モータ(図示しない)により独立にX軸方向に走行可能となっている。各コンベアセグメントCS1〜CS4の排出側には、製品や端材を収納収容ボックス45が設けられている。なお、レーザ加工の際に板材WがX方向に移動する場合には、コンベア用モータはコンベアテーブル27がキャレッジ13と連動するように制御部Sが制御する。   The conveyors 31 and 33 on both sides of each conveyor segment CS1 to CS4 are respectively mounted on a support base 39 erected on a base via an elevating actuator (for example, a hydraulic cylinder) 41, as shown in FIG. As shown, by operating these hydraulic cylinders 41, 41, one row of conveyor segments CS1-CS4 can be raised and lowered individually. Each of the conveyors 31 and 33 is wound so that a conveyor belt with a brush circulates and rotates on a pair of rollers that are pivotally supported by the table frame 43, and is independently driven by each conveyor motor (not shown). The vehicle can travel in the X-axis direction. On the discharge side of each conveyor segment CS1 to CS4, a product storage box 45 is provided for storing products and mill ends. When the plate material W moves in the X direction during laser processing, the control unit S controls the conveyor motor so that the conveyor table 27 is interlocked with the carriage 13.

図3を参照し、レーザ加工部Bの動作を説明する。板材Wはクランプ15により把持されている。前記クランプ15はキャレッジ13によりX軸方向に移動自在である。   The operation of the laser processing part B will be described with reference to FIG. The plate material W is held by the clamp 15. The clamp 15 is movable in the X-axis direction by a carriage 13.

一方、レーザ加工ヘッド17はY軸移動レーザ加工ヘッド後端位置Laと、Y軸移動レーザ加工ヘッド前端位置Lbの範囲において、レーザ加工点LでY軸方向に移動する。これにより、板材WをXY方向自在に加工を行うことができる。なお、加工の際に発生する溶融金属等は開口部37から排出される。   On the other hand, the laser processing head 17 moves in the Y-axis direction at the laser processing point L in the range of the Y-axis moving laser processing head rear end position La and the Y-axis moving laser processing head front end position Lb. Thereby, the board | plate material W can be processed XY direction freely. Note that molten metal or the like generated during processing is discharged from the opening 37.

図4〜図7を参照し板材Wの加工方法について説明する。初めに概略説明する。フロントテーブルをコンベアテーブルとする。そして、レーザ切断終了後、切断製品下部のコンベアテーブルが下降、切断製品が母材より分離するとコンベアが駆動し製品を外部へ搬出する。桟有り加工の場合、製品は母材の桟の下を通過する。また、桟無し加工の場合は、レーザ切断終了後、直ちに製品搬出が行われる。この場合、余計な桟加工を行うことなく、製品取り出しを行うものである。   A method for processing the plate material W will be described with reference to FIGS. First, a brief description will be given. The front table is a conveyor table. Then, after the laser cutting is finished, the conveyor table below the cut product descends, and when the cut product is separated from the base material, the conveyor is driven to carry the product to the outside. In the case of processing with a crosspiece, the product passes under the base metal crosspiece. Further, in the case of crosspiece processing, the product is carried out immediately after the end of laser cutting. In this case, the product is taken out without performing unnecessary crosspiece processing.

すなわち、図4(a)に示すように、予め板材Wに板取りされた製品の加工を行う。板材のXY方向に格子状に整列した製品をY方向より製品取りする方法である。レーザ最終切断経路Leの位置まで加工を行い製品S1を加工し板材Wから切り離す。その後、製品S1を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し製品S1を搬出する。   That is, as shown in FIG. 4 (a), a product that has been previously cut into a plate material W is processed. This is a method in which products arranged in a grid in the XY direction of a plate material are taken from the Y direction. Processing is performed up to the position of the laser final cutting path Le, the product S1 is processed and separated from the plate material W. Thereafter, the conveyor table 27 is lowered while the product S1 is placed. Subsequently, the conveyors 31 and 33 rotate to carry out the product S1.

図4(b)を参照する。Y方向の次の製品S2を加工を行う。レーザ最終切断経路Leの位置まで加工を行い製品S2を加工し板材Wから切り離す。その後、製品S2を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し製品S2を搬出する。   Reference is made to FIG. The next product S2 in the Y direction is processed. Processing is performed up to the position of the laser final cutting path Le, the product S2 is processed and separated from the plate material W. Thereafter, the conveyor table 27 is lowered with the product S2 placed thereon. Subsequently, the conveyors 31 and 33 rotate to carry out the product S2.

図4(c)を参照する。Y軸方向の1列の加工が終了した後、余分な桟の切離し加工を行う。レーザ最終切断経路Leの位置の加工を行い桟S3を板材Wから切り離す。その後、桟S3を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し桟S3を搬出する。   Reference is made to FIG. After the processing of one row in the Y-axis direction is completed, extra crosspieces are cut off. The position of the laser final cutting path Le is processed to cut the crosspiece S3 from the plate material W. Thereafter, the conveyor table 27 is lowered while the crosspiece S3 is placed. Subsequently, the conveyors 31 and 33 rotate to carry out the crosspiece S3.

図4(d)を参照する。製品の加工が全て終了すると、クランプ15の板材Wの把持する部分が桟S4として残る。クランプ15を解除し、桟S4を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し桟S4を搬出する。   Reference is made to FIG. When all the processing of the product is completed, the portion of the clamp 15 that is gripped by the plate material W remains as a crosspiece S4. The clamp 15 is released, and the conveyor table 27 is lowered while the crosspiece S4 is placed. Subsequently, the conveyors 31 and 33 rotate to carry out the crosspiece S4.

このように、Y方向に製品取りを行い製品と桟とを逐次搬出することにより、製品が桟に引っ掛かることが無くなる。   In this way, by taking the product in the Y direction and sequentially carrying out the product and the crosspiece, the product is not caught on the crosspiece.

図5(a)を参照する。予め板材Wに板取りされた製品の加工を行う。板材WのXY方向に格子状に整列した製品をX方向より製品取りする方法である。レーザ最終切断経路Leの位置まで加工を行い製品S5を加工し板材Wから切り離す。その後、製品S5を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し製品S5を搬出する。   Reference is made to FIG. A product that has been previously plated on a plate material W is processed. In this method, the products arranged in a grid pattern in the XY direction of the plate material W are removed from the X direction. Processing is performed up to the position of the laser final cutting path Le, the product S5 is processed and separated from the plate material W. Thereafter, the conveyor table 27 is lowered while the product S5 is placed. Subsequently, the conveyors 31 and 33 are rotated to carry out the product S5.

図5(b)を参照する。X方向の次の製品S6を加工を行う。レーザ最終切断経路Leの位置まで加工を行い製品S6を加工し板材Wから切り離す。その後、製品S6を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し製品S6を搬出する。   Reference is made to FIG. The next product S6 in the X direction is processed. Processing is performed up to the position of the laser final cutting path Le, the product S6 is processed and separated from the plate material W. Thereafter, the conveyor table 27 is lowered with the product S6 placed thereon. Subsequently, the conveyors 31 and 33 are rotated to carry out the product S6.

図5(c)を参照する。X軸方向の1列の加工が終了した後、余分な桟の切離し加工を行う。レーザ最終切断経路Leの位置の加工を行い桟S7を板材Wから切り離す。その後、桟S7を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し桟S7を搬出する。   Reference is made to FIG. After the processing of one row in the X-axis direction is completed, extra crosspieces are cut off. The position of the laser final cutting path Le is processed to cut the crosspiece S7 from the plate material W. Thereafter, the conveyor table 27 is lowered while the rail S7 is placed. Subsequently, the conveyors 31 and 33 rotate to carry out the crosspiece S7.

図5(d)を参照する。製品の加工が全て終了すると、クランプ15の板材Wの把持する部分が桟S8として残る。クランプ15を解除し、桟S8を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し桟S8を搬出する。   Reference is made to FIG. When all the processing of the product is completed, the portion of the clamp 15 that is gripped by the plate material W remains as a crosspiece S8. The clamp 15 is released, and the conveyor table 27 is lowered while the crosspiece S8 is placed. Subsequently, the conveyors 31 and 33 rotate to carry out the crosspiece S8.

このように、X方向に製品取りを行い製品と桟とを逐次搬出することにより、板材Wがクランプ15に与える力を早めに緩和することができる。   In this way, by taking the product in the X direction and sequentially carrying out the product and the crosspiece, the force applied to the clamp 15 by the plate material W can be eased early.

図6(a)を参照する。この例では、製品と製品との間の桟が無い場合を想定する。予め板材Wに板取りされた製品の加工を行う。板材のXY方向に格子状に整列した製品をY方向より製品取りする方法である。レーザ最終切断経路Leの位置まで加工を行い製品S9を加工し板材Wから切り離す。その後、製品S9を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し製品S9を搬出する。   Reference is made to FIG. In this example, it is assumed that there is no crosspiece between products. A product that has been previously plated on a plate material W is processed. This is a method in which products arranged in a grid in the XY direction of a plate material are taken from the Y direction. Processing is performed up to the position of the laser final cutting path Le, the product S9 is processed and separated from the plate material W. Thereafter, the conveyor table 27 is lowered while the product S9 is placed. Subsequently, the conveyors 31 and 33 are rotated to carry out the product S9.

図6(b)を参照する。Y方向の次の製品S10を加工を行う。レーザ最終切断経路Leの位置まで加工を行い製品S10を加工し板材Wから切り離す。その後、製品S10を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し製品S10を搬出する。   Reference is made to FIG. The next product S10 in the Y direction is processed. Processing is performed up to the position of the laser final cutting path Le, the product S10 is processed and separated from the plate material W. Thereafter, the conveyor table 27 is lowered with the product S10 placed thereon. Subsequently, the conveyors 31 and 33 are rotated to carry out the product S10.

図6(c)を参照する。Y方向の次の製品S11を加工を行う。レーザ最終切断経路Leの位置まで加工を行い製品S11を加工し板材Wから切り離す。その後、製品S11を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し製品S10を搬出する。   Reference is made to FIG. The next product S11 in the Y direction is processed. Processing is performed up to the position of the laser final cutting path Le, the product S11 is processed and separated from the plate material W. Thereafter, the conveyor table 27 is lowered while the product S11 is placed. Subsequently, the conveyors 31 and 33 are rotated to carry out the product S10.

図6(d)を参照する。製品の加工が全て終了すると、クランプ15の板材Wの把持する部分が桟S12として残る。クランプ15を解除し、桟S12を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し桟S12を搬出する。   Reference is made to FIG. When all the processing of the product is completed, the portion of the clamp 15 that is gripped by the plate material W remains as a crosspiece S12. The clamp 15 is released, and the conveyor table 27 is lowered while the rail S12 is placed. Subsequently, the conveyors 31 and 33 rotate to carry out the crosspiece S12.

図7(a)を参照する。この例でも、製品と製品との間の桟が無い場合を想定する。予め板材Wに板取りされた製品の加工を行う。板材のXY方向に格子状に整列した製品をX方向より製品取りする方法である。レーザ最終切断経路Leの位置まで加工を行い製品S13を加工し板材Wから切り離す。その後、製品S13を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し製品S13を搬出する。   Reference is made to FIG. Also in this example, it is assumed that there is no cross between products. A product that has been previously plated on a plate material W is processed. This is a method in which products arranged in a grid in the XY direction of a plate material are taken from the X direction. Processing is performed up to the position of the laser final cutting path Le, the product S13 is processed and separated from the plate material W. Thereafter, the conveyor table 27 is lowered while the product S13 is placed. Subsequently, the conveyors 31 and 33 are rotated to carry out the product S13.

図7(b)を参照する。X方向の次の製品S14を加工を行う。レーザ最終切断経路Leの位置まで加工を行い製品S14を加工し板材Wから切り離す。その後、製品S14を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し製品S14を搬出する。   Reference is made to FIG. The next product S14 in the X direction is processed. Processing is performed to the position of the laser final cutting path Le, the product S14 is processed and separated from the plate material W. Thereafter, the conveyor table 27 is lowered with the product S14 placed thereon. Subsequently, the conveyors 31 and 33 are rotated to carry out the product S14.

図7(c)を参照する。X方向の次の製品S15を加工を行う。レーザ最終切断経路Leの位置まで加工を行い製品S15を加工し板材Wから切り離す。その後、製品S15を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し製品S15を搬出する。   Reference is made to FIG. The next product S15 in the X direction is processed. Processing is performed up to the position of the laser final cutting path Le, the product S15 is processed and separated from the plate material W. Thereafter, the conveyor table 27 is lowered with the product S15 placed thereon. Subsequently, the conveyors 31 and 33 rotate to carry out the product S15.

図7(d)を参照する。製品の加工が全て終了すると、クランプ15の板材Wの把持する部分が桟S16として残る。クランプ15を解除し、桟S16を載置したままコンベアテーブル27が下降する。続いて、コンベア31,33が回転し桟S16を搬出する。   Reference is made to FIG. When all the processing of the product is completed, the portion of the clamp 15 that is gripped by the plate material W remains as a crosspiece S16. The clamp 15 is released, and the conveyor table 27 is lowered while the crosspiece S16 is placed. Subsequently, the conveyors 31 and 33 rotate to carry out the crosspiece S16.

上述のように、X方向の製品取り、Y方向の製品取りの他に、例えば、至急必要な製品を初めに加工し製品取りを行い、後は、X方向あるいはY方向に製品取りを行ってもよい。   As described above, in addition to product removal in the X direction and product removal in the Y direction, for example, an urgently required product is first processed and product removal is performed, and thereafter product removal is performed in the X direction or the Y direction. Also good.

さらに、初めに全部の製品取りを行い、桟を最後まで残しておき、残った桟を適正な大きさに分割し搬出するようにしても良い。   Further, all the products may be collected at the beginning, and the crosspieces may be left to the end, and the remaining crosspieces may be divided into an appropriate size and carried out.

なお、本発明は、上述した実施の態様の例に限定されることなく、適宜の変更を加えることにより、その他の態様で実施できるものである。   In addition, this invention is not limited to the example of the embodiment mentioned above, It can implement in another aspect by adding an appropriate change.

製品の加工・搬出システムの概略を示す概略図である。It is the schematic which shows the outline of the processing and carrying-out system of a product. コンベアテーブルの動作を説明する説明図である。It is explanatory drawing explaining operation | movement of a conveyor table. レーザ加工部の動作を説明する説明図である。It is explanatory drawing explaining operation | movement of a laser processing part. (a)〜(d)は製品搬出の動作を説明する説明図である。(A)-(d) is explanatory drawing explaining operation | movement of product carrying out. (a)〜(d)は製品搬出の動作を説明する説明図である。(A)-(d) is explanatory drawing explaining operation | movement of product carrying out. (a)〜(d)は製品搬出の動作を説明する説明図である。(A)-(d) is explanatory drawing explaining operation | movement of product carrying out. (a)〜(d)は製品搬出の動作を説明する説明図である。(A)-(d) is explanatory drawing explaining operation | movement of product carrying out.

符号の説明Explanation of symbols

1 製品の加工・搬出システム
3 フレーム
5 上部タレット
7 下部タレット
11 キャレッジベース
13 キャレッジ
15 板材クランプ
17 レーザ加工ヘッド
19 レーザ発振器
21 ベンドミラー
23 ベンドミラー
25 フロントテーブル
27 コンベアテーブル
31 コンベア
33 コンベア
35 フリーブラシローラ
37 開口部
39 支持台
41 油圧シリンダ
A パンチング加工部
B レーザ加工部
C 製品搬出部
D ダイ
L レーザ加工位置
K 加工位置
P パンチ
S 制御部
W ワーク
DESCRIPTION OF SYMBOLS 1 Product processing and carrying-out system 3 Frame 5 Upper turret 7 Lower turret 11 Carriage base 13 Carage 15 Plate material clamp 17 Laser processing head 19 Laser oscillator 21 Bend mirror 23 Bend mirror 25 Front table 27 Conveyor table 31 Conveyor 33 Conveyor 35 Free brush Roller 37 Opening 39 Support base 41 Hydraulic cylinder A Punching part B Laser processing part C Product unloading part D Die L Laser processing position K Processing position P Punch S Control part W Workpiece

Claims (4)

板材を加工し製品の搬出を行う製品の加工・搬出システムにおいて、
前記板材を加工する加工部と、加工された製品の搬出を行う製品搬出部と、これらの制御を行う制御部とを備え、
前記加工部は少なくとも位置決めされた板材にレーザ加工を行うレーザ加工部を備え、
前記製品搬出部は、前記板材から切り離された部材を載置するコンベアテーブルと、コンベアテーブルを昇降する昇降手段とを有し、
前記制御部は、予め板材に板取りされた板取りデータに基づき、前記製品を載置した前記コンベアテーブルを下降させた後、コンベアを作動させ前記製品を逐次搬出し、前記製品の加工中に桟が生成した場合に前記桟も逐次搬出させることを特徴とする製品の加工・搬出システム。
In a product processing / unloading system that processes board materials and unloads products,
A processing unit that processes the plate material, a product unloading unit that unloads the processed product, and a control unit that controls these,
The processing section includes a laser processing section that performs laser processing on at least the positioned plate material,
The product carry-out unit has a conveyor table for placing a member cut off from the plate material, and an elevating means for raising and lowering the conveyor table,
The control unit lowers the conveyor table on which the product is placed based on plate cutting data that has been cut into a plate in advance, then operates the conveyor to sequentially carry out the product, and during the processing of the product A product processing / carrying-out system characterized in that, when a crosspiece is generated, the crosspiece is also sequentially carried out.
前記制御部は、予め板材に板取りされた板取りデータに基づき、前記板材のY方向より製品取りを行い前記製品を逐次搬出する制御を行うことを特徴とする請求項1記載の製品の加工・搬出システム。   2. The product processing according to claim 1, wherein the control unit performs control to take out the product from the Y direction of the plate material and sequentially carry out the product based on the plate data that has been cut into the plate material in advance. -Unloading system. 前記制御部は、予め板材に板取りされた板取りデータに基づき、前記板材のX方向より製品取りを行い前記製品を逐次搬出する制御を行うことを特徴とする請求項1記載の製品の加工・搬出システム。   The product processing according to claim 1, wherein the control unit performs control to take a product from the X direction of the plate material and sequentially carry out the product on the basis of plate cutting data that has been cut into a plate material in advance. -Unloading system. 板材を加工し製品の搬出を行う製品の加工・搬出方法において、
前記板材を加工する加工工程と、加工された製品の搬出を行う製品搬出工程とを含み、
前記加工工程は少なくとも位置決めされた板材にレーザ加工を行うレーザ加工工程を含み、
前記製品搬出工程は、コンベアテーブルに前記板材から切り離された部材を載置し、前記製品を載置した前記コンベアテーブルを下降させた後、コンベアを作動させ前記製品を逐次搬出し、前記製品の加工中に桟が生成した場合に前記桟も逐次搬出させることを特徴とする製品の加工・搬出方法。
In the processing and unloading method of products that process board materials and unload products,
A processing step of processing the plate material, and a product unloading step of unloading the processed product,
The processing step includes a laser processing step of performing laser processing on at least the positioned plate material,
The product unloading step places a member separated from the plate material on a conveyor table, lowers the conveyor table on which the product is placed, operates the conveyor, and sequentially unloads the product, A method for processing and carrying out a product, characterized in that, when a crosspiece is generated during processing, the crosspiece is also sequentially carried out.
JP2005006426A 2005-01-13 2005-01-13 Product processing / unloading system and method Expired - Fee Related JP4871510B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008264862A (en) * 2007-04-25 2008-11-06 Murata Mach Ltd System for working plate material
DE102011054361A1 (en) 2011-10-10 2013-04-11 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for producing workpieces from a plate-shaped material

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001030028A (en) * 1999-05-18 2001-02-06 Amada Co Ltd Plate working machine, working method using the machine and product stacking method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001030028A (en) * 1999-05-18 2001-02-06 Amada Co Ltd Plate working machine, working method using the machine and product stacking method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008264862A (en) * 2007-04-25 2008-11-06 Murata Mach Ltd System for working plate material
DE102011054361A1 (en) 2011-10-10 2013-04-11 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for producing workpieces from a plate-shaped material
WO2013053570A1 (en) 2011-10-10 2013-04-18 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Methods for producing workpieces from a plate-shaped material

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