JPS6350142U - - Google Patents
Info
- Publication number
- JPS6350142U JPS6350142U JP14457886U JP14457886U JPS6350142U JP S6350142 U JPS6350142 U JP S6350142U JP 14457886 U JP14457886 U JP 14457886U JP 14457886 U JP14457886 U JP 14457886U JP S6350142 U JPS6350142 U JP S6350142U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- board
- utility
- led out
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図と第２図は本考案の一実施例によるハイ
ブリツドＩＣの斜視図とリードピツチ状態を示す
平面図、第３図〜第５図は本考案の他の実施例に
よるハイブリツドＩＣの正面図と側面図および実
装状態の側面図、第６図と第７図は従来のハイブ
リツドＩＣの斜視図とリードピツチ状態を示す平
面図である。
〔符号の説明〕１０，２０……ハイブリツドＩ
Ｃ基板、１１，２１……リード端子、１３，２３
……水平折曲げ部。
1 and 2 are a perspective view and a plan view showing a lead pitch state of a hybrid IC according to an embodiment of the present invention, and FIGS. 3 to 5 are front views of a hybrid IC according to other embodiments of the present invention. A side view and a side view of a mounted state, and FIGS. 6 and 7 are a perspective view and a plan view showing a lead pitch state of a conventional hybrid IC. [Explanation of codes] 10, 20...Hybrid I
C board, 11, 21...Lead terminal, 13, 23
...Horizontal bending part.
Claims (1)
複数本のサーフエイスマウンテイング用リード端
子が、その実装基板表面に接触する水平折曲げ部
を１本おきに互に逆方向に向けて折曲げ形成され
ていることを特徴としたハイブリツドＩＣ。 (2) 前記ハイブリツドＩＣ基板は前記実装基板
表面に水平配置され、且つ前記リード端子が該ハ
イブリツドＩＣ基板の両側部より導出しているこ
とを特徴とした実用新案登録請求の範囲第１項記
載のハイブリツドＩＣ。 (3) 前記ハイブリツドＩＣ基板は前記実装基板
表面に垂直配置され、且つ前記リード端子が該ハ
イブリツドＩＣ基板の一側部より導出しているこ
とを特徴とした実用新案登録請求の範囲第１項記
載のハイブリツドＩＣ。[Scope of Claim for Utility Model Registration] (1) A plurality of lead terminals for surf-eight mounting led out from the side of a hybrid IC board are connected to each other at every other horizontal bent part that contacts the surface of the mounting board. A hybrid IC characterized by being bent in opposite directions. (2) The utility model according to claim 1, wherein the hybrid IC board is arranged horizontally on the surface of the mounting board, and the lead terminals are led out from both sides of the hybrid IC board. Hybrid IC. (3) Claim 1 of the utility model registration characterized in that the hybrid IC board is arranged perpendicularly to the surface of the mounting board, and the lead terminals are led out from one side of the hybrid IC board. hybrid IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14457886U JPS6350142U (en) | 1986-09-19 | 1986-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14457886U JPS6350142U (en) | 1986-09-19 | 1986-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6350142U true JPS6350142U (en) | 1988-04-05 |
Family
ID=31055309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14457886U Pending JPS6350142U (en) | 1986-09-19 | 1986-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6350142U (en) |
-
1986
- 1986-09-19 JP JP14457886U patent/JPS6350142U/ja active Pending
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