JPS6350136U - - Google Patents
Info
- Publication number
- JPS6350136U JPS6350136U JP1986144649U JP14464986U JPS6350136U JP S6350136 U JPS6350136 U JP S6350136U JP 1986144649 U JP1986144649 U JP 1986144649U JP 14464986 U JP14464986 U JP 14464986U JP S6350136 U JPS6350136 U JP S6350136U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor pellet
- heat dissipation
- land portion
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986144649U JPS6350136U (enExample) | 1986-09-19 | 1986-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986144649U JPS6350136U (enExample) | 1986-09-19 | 1986-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6350136U true JPS6350136U (enExample) | 1988-04-05 |
Family
ID=31055448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986144649U Pending JPS6350136U (enExample) | 1986-09-19 | 1986-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6350136U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564243A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Semiconductor device and assembly method thereof |
| JPS5623765A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Molded type electronic device |
-
1986
- 1986-09-19 JP JP1986144649U patent/JPS6350136U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564243A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Semiconductor device and assembly method thereof |
| JPS5623765A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Molded type electronic device |