JPS6349922B2 - - Google Patents

Info

Publication number
JPS6349922B2
JPS6349922B2 JP4289581A JP4289581A JPS6349922B2 JP S6349922 B2 JPS6349922 B2 JP S6349922B2 JP 4289581 A JP4289581 A JP 4289581A JP 4289581 A JP4289581 A JP 4289581A JP S6349922 B2 JPS6349922 B2 JP S6349922B2
Authority
JP
Japan
Prior art keywords
output
circuit
input
drain
fet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4289581A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57157548A (en
Inventor
Kyohiro Shibata
Shigekazu Hori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP4289581A priority Critical patent/JPS57157548A/ja
Publication of JPS57157548A publication Critical patent/JPS57157548A/ja
Publication of JPS6349922B2 publication Critical patent/JPS6349922B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Networks Using Active Elements (AREA)
JP4289581A 1981-03-24 1981-03-24 Microwave integrated circuit Granted JPS57157548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4289581A JPS57157548A (en) 1981-03-24 1981-03-24 Microwave integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4289581A JPS57157548A (en) 1981-03-24 1981-03-24 Microwave integrated circuit

Publications (2)

Publication Number Publication Date
JPS57157548A JPS57157548A (en) 1982-09-29
JPS6349922B2 true JPS6349922B2 (enFirst) 1988-10-06

Family

ID=12648761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4289581A Granted JPS57157548A (en) 1981-03-24 1981-03-24 Microwave integrated circuit

Country Status (1)

Country Link
JP (1) JPS57157548A (enFirst)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5887642U (ja) * 1981-12-08 1983-06-14 株式会社東海理化電機製作所 自動車用アウタミラ−の離脱防止機構
JPH02206202A (ja) * 1989-02-03 1990-08-16 A T R Koudenpa Tsushin Kenkyusho:Kk マイクロ波多端子合成分配回路装置
JPH07120886B2 (ja) * 1989-12-27 1995-12-20 三菱電機株式会社 電力分配器および電力合成器
JP3396018B2 (ja) * 1997-03-25 2003-04-14 株式会社村上開明堂 ミラー位置検出装置

Also Published As

Publication number Publication date
JPS57157548A (en) 1982-09-29

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