JPS6349902B2 - - Google Patents

Info

Publication number
JPS6349902B2
JPS6349902B2 JP9707281A JP9707281A JPS6349902B2 JP S6349902 B2 JPS6349902 B2 JP S6349902B2 JP 9707281 A JP9707281 A JP 9707281A JP 9707281 A JP9707281 A JP 9707281A JP S6349902 B2 JPS6349902 B2 JP S6349902B2
Authority
JP
Japan
Prior art keywords
metal outer
outer ring
lead wire
glass
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9707281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57211255A (en
Inventor
Koichi Komoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP9707281A priority Critical patent/JPS57211255A/ja
Publication of JPS57211255A publication Critical patent/JPS57211255A/ja
Publication of JPS6349902B2 publication Critical patent/JPS6349902B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/10Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9707281A 1981-06-22 1981-06-22 Manufacture of airtight terminal Granted JPS57211255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9707281A JPS57211255A (en) 1981-06-22 1981-06-22 Manufacture of airtight terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9707281A JPS57211255A (en) 1981-06-22 1981-06-22 Manufacture of airtight terminal

Publications (2)

Publication Number Publication Date
JPS57211255A JPS57211255A (en) 1982-12-25
JPS6349902B2 true JPS6349902B2 (enrdf_load_html_response) 1988-10-06

Family

ID=14182432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9707281A Granted JPS57211255A (en) 1981-06-22 1981-06-22 Manufacture of airtight terminal

Country Status (1)

Country Link
JP (1) JPS57211255A (enrdf_load_html_response)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006036100B3 (de) * 2006-08-02 2008-01-24 Zitzmann, Heinrich, Dr. Verfahren zur Herstellung eines Temperaturmessfühlers
JP6217226B2 (ja) 2013-08-09 2017-10-25 日立金属株式会社 熱式質量流量計、質量流量制御装置、及び熱式質量流量計の製造方法
JPWO2021065529A1 (enrdf_load_html_response) 2019-09-30 2021-04-08

Also Published As

Publication number Publication date
JPS57211255A (en) 1982-12-25

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