JPS6349388B2 - - Google Patents
Info
- Publication number
- JPS6349388B2 JPS6349388B2 JP58153280A JP15328083A JPS6349388B2 JP S6349388 B2 JPS6349388 B2 JP S6349388B2 JP 58153280 A JP58153280 A JP 58153280A JP 15328083 A JP15328083 A JP 15328083A JP S6349388 B2 JPS6349388 B2 JP S6349388B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating film
- mos transistor
- predetermined region
- polycrystalline silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052710 silicon Inorganic materials 0.000 claims description 29
- 239000010703 silicon Substances 0.000 claims description 29
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 71
- 239000011229 interlayer Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000010354 integration Effects 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000005368 silicate glass Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58153280A JPS5956760A (ja) | 1983-08-24 | 1983-08-24 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58153280A JPS5956760A (ja) | 1983-08-24 | 1983-08-24 | 半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10058276A Division JPS5326688A (en) | 1976-08-25 | 1976-08-25 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5956760A JPS5956760A (ja) | 1984-04-02 |
JPS6349388B2 true JPS6349388B2 (enrdf_load_html_response) | 1988-10-04 |
Family
ID=15559014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58153280A Granted JPS5956760A (ja) | 1983-08-24 | 1983-08-24 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5956760A (enrdf_load_html_response) |
-
1983
- 1983-08-24 JP JP58153280A patent/JPS5956760A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5956760A (ja) | 1984-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2616569B2 (ja) | 半導体集積回路装置の製造方法 | |
US4792841A (en) | Semiconductor devices and a process for producing the same | |
KR960002804A (ko) | 반도체장치 및 그 제조방법 | |
JPS61214555A (ja) | 半導体装置 | |
JPH0194664A (ja) | 電界効果トランジスタ | |
JPS6010673A (ja) | 半導体装置 | |
US5087578A (en) | Semiconductor device having multi-layered wiring | |
JPS6349388B2 (enrdf_load_html_response) | ||
JPS5890755A (ja) | 半導体装置 | |
JP3013628B2 (ja) | 半導体装置 | |
JPS60200541A (ja) | 半導体装置 | |
JPS6012758A (ja) | 半導体装置の製造方法 | |
JPH0590492A (ja) | 半導体集積回路とその製造方法 | |
KR100230731B1 (ko) | 반도체 디바이스의 콘택 구조 및 그 제조방법 | |
JP3264402B2 (ja) | 半導体装置 | |
JPS6240746A (ja) | 半導体装置 | |
JPS6243175A (ja) | 半導体装置の製造方法 | |
JPS5956761A (ja) | 半導体装置 | |
JPS61150376A (ja) | 半導体装置 | |
JP2732523B2 (ja) | 半導体集積回路装置 | |
JP3031137B2 (ja) | 絶縁物分離半導体装置 | |
JPS5956762A (ja) | 半導体装置の製造方法 | |
JPS61253832A (ja) | 半導体装置 | |
JPS63177454A (ja) | 半導体装置の製造方法 | |
JPH0618251B2 (ja) | 半導体装置 |