JPS6346009A - Ic device with built-in impedance matching resistor - Google Patents

Ic device with built-in impedance matching resistor

Info

Publication number
JPS6346009A
JPS6346009A JP18877486A JP18877486A JPS6346009A JP S6346009 A JPS6346009 A JP S6346009A JP 18877486 A JP18877486 A JP 18877486A JP 18877486 A JP18877486 A JP 18877486A JP S6346009 A JPS6346009 A JP S6346009A
Authority
JP
Japan
Prior art keywords
input
output
impedance matching
buffer
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18877486A
Other languages
Japanese (ja)
Inventor
Takaharu Ishizuka
敬治 石塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP18877486A priority Critical patent/JPS6346009A/en
Publication of JPS6346009A publication Critical patent/JPS6346009A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To place an IC device with high density by constituting it so that an impedance matching resistor is connected in series to an output buffer at the time of outputting a signal, and said resistor is connected in parallel to an input buffer at the time of inputting the signal. CONSTITUTION:The titled device is provided with input/output terminals P1, P2, impedance matching resistances R1, R2, output buffers A1, A2, and input buffers B1, B2. When a signal is outputted from the output buffer A1 of one IC device 1, and transferred to the input buffer B2 of the other IC device 2, the impedance matching resistance R1 which has been connected in series between the output buffer A1 and the input/output terminal P1 of one IC device 1 is connected in series to a signal transfer path. Also, the impedance matching resistance R2 which has been connected in series between the output buffer A2 and the input/output terminal P2 of the other IC device 2 becomes parallel to the input buffer B2, therefore, matching of the impedance is taken and no reflection occurs, and a signal can be transferred without a loss.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、IC装置、特に入出力端子間のインピーダン
ス整合用の抵抗を内蔵したIC装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC device, and particularly to an IC device that includes a built-in resistor for impedance matching between input and output terminals.

[従来の技術] 従来のこの種IC装置は、各IC装置を接続するに際し
ては、例えば第4図に示すように、信号を正しく伝達す
るためにインピーダンス整合用の抵抗を付けていた。す
なわち、ICIの出力バッファAからIC2の入力バッ
ファBに入出力端子Paおよびpbを介して信号を伝達
する場合、抵抗Raを直列に、抵抗Rbおよび抵抗Rc
を並列に接続し、インピーダンスの整合をはかっていた
[Prior Art] In conventional IC devices of this type, when connecting each IC device, a resistor for impedance matching is attached in order to properly transmit signals, as shown in FIG. 4, for example. That is, when transmitting a signal from output buffer A of ICI to input buffer B of IC2 via input/output terminals Pa and pb, resistor Ra is connected in series, resistor Rb and resistor Rc
were connected in parallel to match impedance.

従って、従来のこの種IC装置を基板上に組んだ場合、
IC装置間に外付けのインピーダンス整合用の抵抗が必
要であり、多大な面積を必要としその高密度配置が不可
能であった。また、コスト的にも外付は抵抗分高価にな
らざるを得なかったのである。
Therefore, when a conventional IC device of this type is assembled on a board,
An external impedance matching resistor is required between the IC devices, which requires a large area and makes it impossible to arrange it in high density. Also, in terms of cost, external connections had to be expensive due to the resistance.

[発明か解決しようとする問題点] そこで、本発明の目的は、上述の従来装置の欠点を除去
し、インピーダンス整合用の抵抗をIC装置に内蔵する
ことによりその高密度配置を可能ならしめ、かつ、安価
なIC装置を提供することにあ−る。
[Problems to be Solved by the Invention] Therefore, an object of the present invention is to eliminate the above-mentioned drawbacks of the conventional device, and to enable high-density arrangement of impedance matching resistors by incorporating them into an IC device. Another object of the present invention is to provide an inexpensive IC device.

[問題点を解決するための手段] 上記目的を達成するために、本発明は、入出力端子と、
入出力端子に接続されたインピーダンス整合用抵抗と、
入出力端子に対してインピーダンス整合用抵抗を介して
直列に接続された出力バッファと、入出力端子とインピ
ーダンス整合用抵抗との接続点に接続された入力ハッコ
アとを備え、侶号出ノ月1、νには、インピーダンス整
合用抵抗が出力ハッコアと直列に接続され、信号入力時
にはインピータンス整合用抵抗か入力バッファと並列に
接続されるようにしたことを特徴とする。
[Means for Solving the Problems] In order to achieve the above object, the present invention provides an input/output terminal;
An impedance matching resistor connected to the input/output terminal,
It is equipped with an output buffer connected in series to the input/output terminal via an impedance matching resistor, and an input buffer connected to the connection point between the input/output terminal and the impedance matching resistor. , ν is characterized in that an impedance matching resistor is connected in series with the output core, and when a signal is input, the impedance matching resistor or the input buffer is connected in parallel.

[作用] 上記構成になる本発明の詳細な説明する。一方のIC装
置の出力バッファから信号を出力し、他方のIC装置の
入力バッファに伝達するときには、一方のIC装置の出
力バッファと入出力端子との間に直列に接続したインピ
ーダンス整合用の抵抗が信号伝達経路に対して直列に接
続され、また、他方のIC装置の出力バッファと入出力
端子との間に直列に接続したインピーダンス整合用の抵
抗が入力バッファに対して並列となることから、インピ
ーダンスのマツチングがとれて反射が起こらず損失なく
信号を伝達することができる。
[Operation] The present invention having the above configuration will be explained in detail. When outputting a signal from the output buffer of one IC device and transmitting it to the input buffer of the other IC device, an impedance matching resistor connected in series between the output buffer of one IC device and the input/output terminal is connected. Since the impedance matching resistor, which is connected in series to the signal transmission path and also connected in series between the output buffer and the input/output terminal of the other IC device, is parallel to the input buffer, the impedance Since the signals are matched, reflections do not occur and signals can be transmitted without loss.

[実施例] 以下、本発明の実施例につき添附図面を参照して説明す
る。
[Examples] Examples of the present invention will be described below with reference to the accompanying drawings.

第1図は、本発明の実施例を示す回路図であり、IC装
置ICIおよびIC装置IC2がそれぞれ入出力端子P
1および入出力端子P2を介して接続される(破線示)
FIG. 1 is a circuit diagram showing an embodiment of the present invention, in which an IC device ICI and an IC device IC2 each have an input/output terminal P.
1 and connected via input/output terminal P2 (shown by broken line)
.

なお、入出力端子は複数個存在し、本図は、その1部の
みを示すものである。■および八2は出力バッファであ
り、それぞれ動作のイネーブル制御用入力端子a1およ
びa2が接続されている。
Note that there are a plurality of input/output terminals, and this figure shows only a portion of them. 2 and 82 are output buffers, to which operation enable control input terminals a1 and a2 are connected, respectively.

旧およびR2は、それぞれ出力バッファA1および八2
と直列に接続されたインピーダンス整合用の抵抗であり
、信号伝達経路射が起こらないように相互にインピーダ
ンス整合がとられている。
old and R2 are output buffers A1 and 82 respectively
This is an impedance matching resistor connected in series with the signal transmission path, and the impedances are matched to each other so that signal transmission path radiation does not occur.

口1および口2は、それぞれ出力バッファAlと抵抗R
1および出力バッファA2と抵抗R2に対して並列に接
続された入力バッファであり、それぞれ制御用入力端子
blおよびb2が接続されている。
Port 1 and port 2 are connected to output buffer Al and resistor R, respectively.
1 and output buffer A2 are input buffers connected in parallel to the resistor R2, and are connected to control input terminals bl and b2, respectively.

上記構成において、今、ICIからIC2に信号を伝達
する場合について説明する。
In the above configuration, the case where a signal is transmitted from the ICI to the IC2 will now be described.

この場合は、ICIの出力バッファA1の制御用入力端
子a1には、出力バッファA1をイネーブルにする信号
か入力されており、制御用入力端子b1には、入力バッ
ファ81の出力をハイインピーダンスにする信号が入力
されている。一方、IC2の出力バッファΔ2の制御用
入力端子a2には出力バッファ八2の出力をハイレベル
あるいはローレベルに固定する信号が入力され(以下の
説明ではハイレヘル固定とする)、制御用入力端子b2
には入力バッフアロ2をイネーブルにする信号が入力さ
れている。
In this case, a signal that enables the output buffer A1 is input to the control input terminal a1 of the output buffer A1 of the ICI, and a signal that enables the output buffer A1 is input to the control input terminal b1, which sets the output of the input buffer 81 to high impedance. A signal is being input. On the other hand, a signal that fixes the output of the output buffer 82 to a high level or a low level is input to the control input terminal a2 of the output buffer Δ2 of the IC2 (in the following explanation, it is assumed that the output is fixed to a high level), and the control input terminal b2
A signal for enabling input buffer allo 2 is input to .

従って、このときの等価回路は、第2図に示すように抵
抗R1が信号伝達経路に直列に、抵抗R2が並列に接続
されることになり、両抵抗R1,R2には反射が起こら
ないように選ばれたインピーダンス整合用の抵抗である
ので、損失を伴わずに信号の伝達ができるのである。
Therefore, in the equivalent circuit at this time, as shown in Figure 2, the resistor R1 is connected in series with the signal transmission path, and the resistor R2 is connected in parallel, so that no reflection occurs in both resistors R1 and R2. The impedance matching resistor is selected to allow signal transmission without loss.

逆に、IC2からICIに信号を伝達する場合には、各
制御用入力端子al、bl、a2.b2への入力を切換
える。すなわち、出力バッファA2および入力バッファ
B1がイネーブル状態となり、入力バッファB2の出力
がハイインピーダンスで、出力バッファAlの出力がハ
イレベルに固定されるように信号が入力される。
Conversely, when transmitting a signal from IC2 to ICI, each control input terminal al, bl, a2 . Switch the input to b2. That is, output buffer A2 and input buffer B1 are enabled, and a signal is input so that the output of input buffer B2 is at high impedance and the output of output buffer Al is fixed at high level.

このときの等価回路は、第3図に示すようになり、前述
の如くインピーダンスの整合が行なわれるのである。
The equivalent circuit at this time is as shown in FIG. 3, and impedance matching is performed as described above.

尚、内蔵する抵抗は、ポリシリコンあるいは拡散層の抵
抗等の形態として、上述の入力および出力バッファと一
体に集積回路化することがてき、IC装置のチップ面積
に与える影習は極めて少ない。
Note that the built-in resistor can be in the form of a polysilicon resistor, a resistor in a diffusion layer, or the like, and can be integrated into an integrated circuit with the above-mentioned input and output buffers, so that the impact on the chip area of the IC device is extremely small.

[発明の効果] 以上の説明から明らかなように、本発明によればインピ
ータンス整合用の抵抗をIC装置に内蔵することにより
、基板上にそのIC装置をより高密度に配置することか
可能となり、かつ、安価に製造できる。
[Effects of the Invention] As is clear from the above description, according to the present invention, by incorporating a resistor for impedance matching into an IC device, it is possible to arrange the IC device on a substrate at a higher density. and can be manufactured at low cost.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例を示す回路図、第2図はICI
からIC2に信号を伝達する場合の等価回路図、 第3図はIC2からICIに信号を伝達する場合の等価
回路図、 第4図は従来のIC装置の接続状態を示す回路図である
。 八1.A2・・・出力ハッコア、 Ill、lI2・・・入力バッファ、 Ill、112・・・インピーダンス整合用抵抗、al
、a2.bl、b2・・・制御用入力端子。 突旅竹ソEホす回路口 第1図 IC7かうIC2にイ富号とイ云σしする針の等イ山四
つ8称図第2図
Figure 1 is a circuit diagram showing an embodiment of the present invention, Figure 2 is an ICI
FIG. 3 is an equivalent circuit diagram when transmitting a signal from IC2 to IC2, FIG. 3 is an equivalent circuit diagram when transmitting a signal from IC2 to ICI, and FIG. 4 is a circuit diagram showing the connection state of a conventional IC device. 81. A2... Output core, Ill, lI2... Input buffer, Ill, 112... Impedance matching resistor, al
, a2. bl, b2...control input terminals. Tsukuba Takeso E Hosu Circuit Exit Fig. 1 IC7 IC2 has a needle that says I Tomigo Fig. 2

Claims (1)

【特許請求の範囲】  入出力端子と、 該入出力端子に接続されたインピーダンス整合用抵抗と
、 前記入出力端子に対して前記インピーダンス整合用抵抗
を介して直列に接続された出力バッファと、 前記入出力端子と前記インピーダンス整合用抵抗との接
続点に接続された入力バッファとを備え、信号出力時に
は、前記インピーダンス整合用抵抗が前記出力バッファ
と直列に接続され、信号入力時には前記インピーダンス
整合用抵抗が前記入力バッファと並列に接続されるよう
にしたことを特徴とするインピーダンス整合用抵抗内蔵
IC装置。
[Scope of Claims] An input/output terminal; an impedance matching resistor connected to the input/output terminal; an output buffer connected in series to the input/output terminal via the impedance matching resistor; an input buffer connected to a connection point between an input/output terminal and the impedance matching resistor; when a signal is output, the impedance matching resistor is connected in series with the output buffer; when a signal is input, the impedance matching resistor is connected in series with the output buffer; An IC device with a built-in resistor for impedance matching, characterized in that the input buffer is connected in parallel with the input buffer.
JP18877486A 1986-08-13 1986-08-13 Ic device with built-in impedance matching resistor Pending JPS6346009A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18877486A JPS6346009A (en) 1986-08-13 1986-08-13 Ic device with built-in impedance matching resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18877486A JPS6346009A (en) 1986-08-13 1986-08-13 Ic device with built-in impedance matching resistor

Publications (1)

Publication Number Publication Date
JPS6346009A true JPS6346009A (en) 1988-02-26

Family

ID=16229546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18877486A Pending JPS6346009A (en) 1986-08-13 1986-08-13 Ic device with built-in impedance matching resistor

Country Status (1)

Country Link
JP (1) JPS6346009A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04348067A (en) * 1990-06-28 1992-12-03 Mitsubishi Electric Corp Cmos semiconductor integrated circuit
US6873179B2 (en) 1993-12-28 2005-03-29 Hitachi, Ltd. Signal transmitting device suited to fast signal transmission

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04348067A (en) * 1990-06-28 1992-12-03 Mitsubishi Electric Corp Cmos semiconductor integrated circuit
US6873179B2 (en) 1993-12-28 2005-03-29 Hitachi, Ltd. Signal transmitting device suited to fast signal transmission
US7015717B2 (en) * 1993-12-28 2006-03-21 Hitachi, Ltd. Signal transmitting device suited to fast signal transmission
US7123048B2 (en) * 1993-12-28 2006-10-17 Hitachi, Ltd. Signal transmitting device suited to fast signal transmission
US7295034B2 (en) 1993-12-28 2007-11-13 Hitachi, Ltd. Signal transmitting device suited to fast signal transmission
US7372292B2 (en) * 1993-12-28 2008-05-13 Hitachi, Ltd. Signal transmitting device suited to fast signal transmission
US7911224B2 (en) 1993-12-28 2011-03-22 Hitachi, Ltd. Signal transmitting device suited to fast signal transmission
US8106677B2 (en) 1993-12-28 2012-01-31 Lg Electronics Inc. Signal transmitting device suited to fast signal transmission

Similar Documents

Publication Publication Date Title
US6496880B1 (en) Shared I/O ports for multi-core designs
US6690191B2 (en) Bi-directional output buffer
US20030043683A1 (en) Memory device
US6812741B2 (en) Bidirectional signal transmission circuit and bus system
US20010050858A1 (en) Memory modules having integral terminating resistors and computer system boards for use with same
JPH11205118A (en) Differential signal transmission circuit
US6011710A (en) Capacitance reducing memory system, device and method
JPH11177189A (en) Terminal structure of wiring on printed board
US4739194A (en) Supergate for high speed transmission of signals
US6470054B1 (en) Bidirectional two-way CMOS link tailored for reception and transmission
US5757249A (en) Communication system having a closed loop bus structure
US6014037A (en) Method and component arrangement for enhancing signal integrity
US5202940A (en) Modular electro-optic bus coupler system
JPS6346009A (en) Ic device with built-in impedance matching resistor
US6417688B1 (en) Method and apparatus for implementing a highly robust, fast, and economical five load bus topology based on bit mirroring and a well terminated transmission environment
US20030146434A1 (en) Semiconductor memory device
JPH0786509A (en) Semiconductor integrated circuit
US20070170971A1 (en) Signal transmitting circuit
KR19990004111A (en) Semiconductor device with termination resistor
JP2515705B2 (en) Semiconductor integrated circuit device
US6320475B1 (en) Printed circuit board suppressing ringing in signal waveforms
JPH05341892A (en) Information processor
US8212586B2 (en) Universal pinout for both receiver and transceiver with loopback
EP1091600A2 (en) Combined selector switch and serial multi-Gb/s data pulse receiver
JP2001169314A (en) Transmission interface device