JPS6345051A - 耐熱性積層体 - Google Patents

耐熱性積層体

Info

Publication number
JPS6345051A
JPS6345051A JP18838186A JP18838186A JPS6345051A JP S6345051 A JPS6345051 A JP S6345051A JP 18838186 A JP18838186 A JP 18838186A JP 18838186 A JP18838186 A JP 18838186A JP S6345051 A JPS6345051 A JP S6345051A
Authority
JP
Japan
Prior art keywords
heat
laminate
resistant laminate
present
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18838186A
Other languages
English (en)
Japanese (ja)
Other versions
JPH049667B2 (https=
Inventor
武夫 木村
近森　俊二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kodoshi Corp
Original Assignee
Nippon Kodoshi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kodoshi Corp filed Critical Nippon Kodoshi Corp
Priority to JP18838186A priority Critical patent/JPS6345051A/ja
Publication of JPS6345051A publication Critical patent/JPS6345051A/ja
Publication of JPH049667B2 publication Critical patent/JPH049667B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP18838186A 1986-08-13 1986-08-13 耐熱性積層体 Granted JPS6345051A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18838186A JPS6345051A (ja) 1986-08-13 1986-08-13 耐熱性積層体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18838186A JPS6345051A (ja) 1986-08-13 1986-08-13 耐熱性積層体

Publications (2)

Publication Number Publication Date
JPS6345051A true JPS6345051A (ja) 1988-02-26
JPH049667B2 JPH049667B2 (https=) 1992-02-20

Family

ID=16222626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18838186A Granted JPS6345051A (ja) 1986-08-13 1986-08-13 耐熱性積層体

Country Status (1)

Country Link
JP (1) JPS6345051A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02113938A (ja) * 1988-10-24 1990-04-26 Toyobo Co Ltd ポリエステル積層フィルム
JPH02252786A (ja) * 1989-03-28 1990-10-11 Hitachi Ltd 耐熱性接着剤
JP2008251900A (ja) * 2007-03-30 2008-10-16 Nippon Steel Chem Co Ltd フレキシブル基板用積層体及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02113938A (ja) * 1988-10-24 1990-04-26 Toyobo Co Ltd ポリエステル積層フィルム
JPH02252786A (ja) * 1989-03-28 1990-10-11 Hitachi Ltd 耐熱性接着剤
JP2008251900A (ja) * 2007-03-30 2008-10-16 Nippon Steel Chem Co Ltd フレキシブル基板用積層体及びその製造方法

Also Published As

Publication number Publication date
JPH049667B2 (https=) 1992-02-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term