JPS634352B2 - - Google Patents

Info

Publication number
JPS634352B2
JPS634352B2 JP11760780A JP11760780A JPS634352B2 JP S634352 B2 JPS634352 B2 JP S634352B2 JP 11760780 A JP11760780 A JP 11760780A JP 11760780 A JP11760780 A JP 11760780A JP S634352 B2 JPS634352 B2 JP S634352B2
Authority
JP
Japan
Prior art keywords
heat pipe
heat
heating
section
element mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11760780A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5742155A (en
Inventor
Shinichi Ishida
Hideo Sakurai
Susumu Ogiwara
Takashi Murase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP11760780A priority Critical patent/JPS5742155A/ja
Publication of JPS5742155A publication Critical patent/JPS5742155A/ja
Publication of JPS634352B2 publication Critical patent/JPS634352B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP11760780A 1980-08-26 1980-08-26 Heat pipe type heat sink Granted JPS5742155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11760780A JPS5742155A (en) 1980-08-26 1980-08-26 Heat pipe type heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11760780A JPS5742155A (en) 1980-08-26 1980-08-26 Heat pipe type heat sink

Publications (2)

Publication Number Publication Date
JPS5742155A JPS5742155A (en) 1982-03-09
JPS634352B2 true JPS634352B2 (enrdf_load_stackoverflow) 1988-01-28

Family

ID=14715950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11760780A Granted JPS5742155A (en) 1980-08-26 1980-08-26 Heat pipe type heat sink

Country Status (1)

Country Link
JP (1) JPS5742155A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2724227T3 (es) 2011-07-20 2019-09-09 Daikin Ind Ltd Estructura de instalación para tubo de refrigerante

Also Published As

Publication number Publication date
JPS5742155A (en) 1982-03-09

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