JPS6343465U - - Google Patents
Info
- Publication number
- JPS6343465U JPS6343465U JP13513786U JP13513786U JPS6343465U JP S6343465 U JPS6343465 U JP S6343465U JP 13513786 U JP13513786 U JP 13513786U JP 13513786 U JP13513786 U JP 13513786U JP S6343465 U JPS6343465 U JP S6343465U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- tip
- led
- led element
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13513786U JP2524774Y2 (ja) | 1986-09-03 | 1986-09-03 | Ｌｅｄランプ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13513786U JP2524774Y2 (ja) | 1986-09-03 | 1986-09-03 | Ｌｅｄランプ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6343465U true JPS6343465U (es) | 1988-03-23 |
| JP2524774Y2 JP2524774Y2 (ja) | 1997-02-05 |
Family
ID=31037031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13513786U Expired - Lifetime JP2524774Y2 (ja) | 1986-09-03 | 1986-09-03 | Ｌｅｄランプ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2524774Y2 (es) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298665U (es) * | 1989-01-25 | 1990-08-06 | ||
| WO2001003184A1 (en) * | 1999-07-02 | 2001-01-11 | Rohm Co., Ltd. | Electronic part |
-
1986
- 1986-09-03 JP JP13513786U patent/JP2524774Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298665U (es) * | 1989-01-25 | 1990-08-06 | ||
| WO2001003184A1 (en) * | 1999-07-02 | 2001-01-11 | Rohm Co., Ltd. | Electronic part |
| KR100633113B1 (ko) * | 1999-07-02 | 2006-10-11 | 롬 가부시키가이샤 | 전자부품 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2524774Y2 (ja) | 1997-02-05 |