JPS6343021Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an effective cooling structure for a grinding device using a rotating grindstone.

Grinding equipment usually grinds a small amount of cutting, from a few mm to several 100 Å, and is often used to finish the surface of materials that are brittle and easily chip when cut.

For example, it is used for surface finishing of insulating ceramics and magnetic materials, but it is especially often used for silicon substrates, which are semiconductor materials.Since single crystal silicon is brittle and easily damaged, semiconductors are often placed on relatively thick substrates. After forming an element, it is applied to a process in which the back surface is ground to form a thin plate. FIG. 1 is a sectional view of the mechanism of such a grinding device, in which a rotary grindstone 3 contacts a rotary table 2 holding a silicon substrate 1 at an oblique angle of 1 to 2 degrees to perform grinding.
In this example, diamonds 5 of an appropriate particle size are metal-bonded to the tip of a bowl-shaped base 4. During grinding,
Since the rotary grindstone 3 rotates at a high speed of about 4,500 to 7,500 rpm for grinding, frictional heat is generated, which needs to be cooled. The powder is washed away and the frictional heat generated in the contact portion 7 is cooled down.

However, with the cooling water inflow structure shown in Figure 1,
Since the rotary grindstone 3 contacts the silicon substrate 1, which is the workpiece, at an oblique angle, the cooling water that has flowed in directly hits the silicon substrate and flows in the opposite direction to the contact portion 7, so that the amount of water is reduced. Even if the temperature is increased, desired cooling is not achieved and oxides are formed on the surface due to heating.

In order to eliminate the above-mentioned problems, this invention aims to efficiently cool the contact part during grinding, and a cooling water nozzle is installed at the center of the upper part of the convex side of the bowl-shaped rotary grinding wheel, and a cooling water nozzle is installed at the lower end of the open side. is provided with a diamond grindstone, and the nozzle is provided with an outlet for blowing out the cooling water that has flowed in from the inlet to the upper inner surface of the bowl-shaped rotary grindstone, and the cooling water that has flowed out from the outlet is This invention proposes a cooling structure for a grinding device in which water flows down the inner surface of a bowl-shaped rotary grindstone from the upper inner surface to the lower end thereof.

In detail below, FIG. 2 shows a cross-sectional structure of the cooling water nozzle 10 of the present invention attached to the rotating grindstone 3. The cooling water nozzle 10 is shown in a side sectional view in FIG.
As shown in the cross-sectional view in Figure 3b, the inlet 1
This nozzle has an outlet 12 that changes the direction of the cooling water entering from 1 at right angles and blows it out laterally.When this is installed, the cooling water flows above the bowl-shaped base 4 as shown by the dotted line in FIG. The cooling water flows down along the inner surface of the base body while rotating as the rotary grindstone 3 rotates, and the cooling water is evenly supplied to the diamond 5 portion at the tip, and the contact portion 7 is also efficiently cooled. will be done. Note that the cooling water nozzle 10 may be designed in advance to be integrated with the rotary grindstone 3, or may be attached later.

As a result, when the present invention is applied and a grinding device equipped with a cooling water nozzle is used, there is no discoloration of the ground surface of the silicon substrate, which is the workpiece material, and the adhesive strength is also strengthened when gold is vapor-deposited. Ta. With the conventional structure of grinding equipment, silicon oxides such as SiOx were formed on the grinding surface, which could not be removed even when treated with hydrofluoric acid, and peeled off when gold was deposited.However, by applying the present invention, No more peeling occurs. This can be said to be an effect of improving the condition of the ground surface.

The above description has been made using an example of grinding the back surface of a silicon substrate of a semiconductor material, but it is natural that it can be applied to grinding other workpieces to improve the surface condition, and the present invention will further improve the surface condition. An excellent ground surface can be obtained and the quality thereof can be improved.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional grinding mechanism, FIG. 2 is a sectional view of a grinding mechanism to which the present invention is applied, and FIGS. 3a and 3b are a side sectional view and a cross sectional view of a cooling water nozzle, respectively. In the figure, 1... silicon substrate, 2... table,
3... Rotating grindstone, 10... Cooling water nozzle.

Claims (1)

[Scope of Claim for Utility Model Registration] In a grinding device that grinds a workpiece held on a table by bringing a rotating diamond grindstone into contact with the workpiece, a cooling water nozzle is located at the center of the upper convex side of the bowl-shaped rotating grindstone and an opening is provided. A diamond grindstone is provided at the lower end of the side, and the nozzle is provided with an outlet for blowing out the cooling water that has flowed in from the inlet onto the upper inner surface of the bowl-shaped rotary grindstone, and the cooling water that has flowed out from the outlet is provided with an outlet. A cooling structure for a grinding device, characterized in that water flows down from the upper inner surface of the bowl-shaped rotary grindstone to the lower end thereof.