JPS6342527Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to an improvement of a resist coating device.

(b) Background of the technology It is well known that when forming semiconductor devices such as ICs and LSIs, fine resist film patterns using photolithography are used in the process of forming fine patterns.

(c) Conventional technology and problems For example, regarding conventional resist coating equipment used to spray a predetermined amount of resist liquid onto a semiconductor substrate and uniformly apply the resist liquid onto the semiconductor substrate to form a resist film. , will be explained using FIG.

In the figure, a semiconductor substrate 2 is fixed on a substrate mounting table 1 having a chuck mechanism, and a resist liquid 4 pressurized with high-pressure nitrogen or the like is injected from an injection nozzle 3 provided at a predetermined position on the substrate 2. After a predetermined amount is sprayed onto the substrate 2, the spray nozzle 3
The resist liquid 4 is released by the opening/closing bell 5 attached to the
injection is stopped. By rotating the substrate mounting table 1 at high speed, the resist liquid 4 on the substrate 2 is spread to a uniform thickness and is uniformly applied onto the substrate 2. The substrate mounting table 1 is surrounded by a container 6 to prevent the resist liquid from scattering.

However, remaining droplets may drip from the tip of the spray nozzle 3 after preventing spraying of the resist solution onto a substrate that has been uniformly coated, and such droplets may drop onto a substrate that has been coated uniformly. If the resist film is dropped, the resist film on the substrate must be removed and the coating must be reapplied, which is a time-consuming problem.

(d) Purpose of the invention The purpose of the present invention is to provide a resist coating device that solves these problems and can efficiently coat resists.

(e) Structure of the Device In order to achieve the object, the present invention provides a resist coating device that sprays a resist liquid under pressure from a spray nozzle, in which a portion of the resist liquid is placed at the bottom of the nozzle at an area outside the inner diameter position of the bottom of the nozzle. The nozzle has a tip portion provided with droplet attracting means by capillary action at a position where it comes into contact with the resist droplets remaining at the tip portion of the nozzle after the liquid jetting is stopped, and the tip portion is directed toward the lower side of the periphery of the nozzle. It is characterized in that the extending receiving groove for the resist droplet is fixedly disposed.

(f) Embodiments of the invention Examples of the invention will be described below with reference to the drawings. FIG. 2 is a perspective view of essential parts of an embodiment of the present invention, and parts equivalent to those in the previous figure are designated by the same reference numerals. In the figure, a receiving groove 11 is provided at a predetermined fixed position at the tip of the injection nozzle 3, which will be described later, by a support frame 12 as shown. The tip of the receiving groove 11 is provided with a means for attracting droplets by capillary action, which consists of, for example, two sections 13, and as shown in the cross-sectional view of the tip of the receiving groove in FIG. As shown, the gaps are arranged so that they gradually become narrower toward the top. By the way, when the droplets remaining after the above-mentioned jetting of the resist liquid is stopped dripping, it is a phenomenon that the droplets have a diameter larger than the diameter of the jetting nozzle and drop due to gravity. Therefore, in one embodiment of the present invention, a section 1 of the receiving groove 11 is located at a position inside the diameter of the falling drop and at a position outside the nozzle diameter (inner diameter).
3 is placed (at a predetermined position) so as to be in contact with the falling drop. By fixing the sections 13 at such predetermined positions, the resist droplets remaining at the tip of the nozzle after stopping spraying of the resist can easily flow into the receiving groove 11 through the narrow gap between the two sections 13 by capillary action. be absorbed by. Therefore, after resist jetting is stopped, resist droplets from the nozzle tip are completely prevented from falling onto the uniformly coated semiconductor substrate.

Incidentally, during resist injection by normal pressurization, the section 13 of the receiving groove 11 does not come into contact with the resist liquid that is injected to the diameter of the injection nozzle, so it does not have any practical effect.

(g) Effect of the invention As explained above, according to the resist coating device of the invention, the resist droplets are prevented from falling from the nozzle tip onto the substrate on which the resist has been evenly coated, so that the resist coating device can prevent the resist from falling from the nozzle tip. No need to reapply, improving work efficiency.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view of a conventional resist coating device, and FIG. 2 is a perspective view of essential parts of an embodiment of the present invention.
FIG. 3 is a sectional view of the tip of the receiving groove. In the figure, 3 is a spray nozzle, 4 is a resist liquid, 11 is a receiving groove, 12 is a support frame, and 13 is a section.

Claims (1)

[Scope of Claim for Utility Model Registration] In a resist coating device that sprays a resist solution under pressure from a spray nozzle, the nozzle is installed at the bottom of the nozzle outside the inner diameter position of the lower part of the nozzle and after the spraying of the resist solution is stopped. A resist droplet receiving groove extending toward the lower side around the periphery of the nozzle, the tip having a droplet attracting means by capillary action at a position in contact with the resist droplet remaining at the tip of the nozzle. A resist coating device characterized in that the resist coating device is fixedly arranged.