JPS6342153A - Hybrid integrated circuit board and manufacture thereof - Google Patents
Hybrid integrated circuit board and manufacture thereofInfo
- Publication number
- JPS6342153A JPS6342153A JP18591586A JP18591586A JPS6342153A JP S6342153 A JPS6342153 A JP S6342153A JP 18591586 A JP18591586 A JP 18591586A JP 18591586 A JP18591586 A JP 18591586A JP S6342153 A JPS6342153 A JP S6342153A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- paste
- substrate
- ceramic substrate
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000463 material Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000010949 copper Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000000843 powder Substances 0.000 claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 16
- 239000002131 composite material Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000012298 atmosphere Substances 0.000 claims abstract description 6
- 230000001590 oxidative effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000007639 printing Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- BYFGZMCJNACEKR-UHFFFAOYSA-N aluminium(i) oxide Chemical compound [Al]O[Al] BYFGZMCJNACEKR-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005551 mechanical alloying Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- -1 butylcarpitol Chemical compound 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は混成集積回路基板及びその製造方法に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a hybrid integrated circuit board and a method of manufacturing the same.
（従来の技術及び解決しようとする問題点）従来、いわ
ゆるハイブリッド基板と称される混成集積回路基板は、
一般に、メツキ処理を含む多数の工程で製造されていた
。(Prior art and problems to be solved) Conventionally, a hybrid integrated circuit board called a so-called hybrid board is
Generally, it was manufactured using multiple steps, including plating.
例えば、第２図に示すように、アルミナ等のセラミック
基板１の両面にＭＯｌＭｏ−ＭｎやＷ等の金属ペースト
２０を印刷し、乾燥後、水素気流中にて約１２００〜１
６００℃で焼成してメタライズ層を形成し、その上にＮ
ｉメツキ処理を施してメツキ層２１を形成し脱水素処理
した後、ヒートシンクとしてＮｉメツキ処処理Ｃ抜板２
２半田付け２３を行うという多段工程による方法である
。For example, as shown in FIG. 2, a metal paste 20 such as MOlMo-Mn or W is printed on both sides of a ceramic substrate 1 made of alumina or the like, and after drying, it is heated to about 1,200 to 1
A metallized layer is formed by firing at 600°C, and N
After performing the i-plating process to form a plating layer 21 and dehydrogenating, the Ni-plated C punched plate 2 is used as a heat sink.
This is a multi-step method in which 2 soldering steps 23 are performed.
しかし、このような方法は水素気流中で、しかも高温で
焼成したり、メツキ処理したり、或いは更にヒートシン
クを半田付けするなど複雑な工程を必要とすると共に１
Ｍｏ、Ｗ等を介して接合した場合の回路面には抵抗体と
してはチップ抵抗しか使用できず、また回路面はせいぜ
い５００μ程度であるので細線を描くことができず、シ
ート抵抗も高いという欠点がある。更に、銅板（ヒート
シンク）の接合は半田付けによるために接合面に気泡が
介在したり、回路面に半田付けする場合には銅板の接合
に用いた半田を使用できず、銅板自身が酸化変色したり
、回路面も酸化したりしていた。またこの方法でＭＯメ
タライズを使用する方式は、通常の厚膜ペーストを用い
たハイブリッド基板の製造は大気中で厚膜ペーストを焼
成するので適用できず、樹脂等で接合するという制約が
ある。However, such a method requires complicated steps such as firing in a hydrogen stream at high temperatures, plating, or even soldering a heat sink.
When bonded through Mo, W, etc., only a chip resistor can be used as a resistor on the circuit surface, and since the circuit surface is about 500μ at most, thin lines cannot be drawn, and the sheet resistance is high. There is. Furthermore, since copper plates (heat sinks) are bonded by soldering, air bubbles may be present on the bonding surface, and when soldering to a circuit surface, the solder used to bond the copper plates cannot be used, and the copper plate itself may become discolored due to oxidation. The circuit surface was also oxidized. Furthermore, this method of using MO metallization cannot be applied to the production of hybrid substrates using normal thick film paste because the thick film paste is fired in the atmosphere, and there is a restriction that bonding is performed using resin or the like.
一方、貴金属ペーストを使用し、導体、抵抗体、誘電体
ペーストを印刷して８５０℃付近で焼成し、回路を形成
する方法もあるが、この場合のヒートシンクへの接合に
は放熱グリースや放熱シートを用い、有機接着剤に無機
フィラーを添加したものを用いているので、放熱性に大
きな問題があるうえ、耐熱性にも問題があった。On the other hand, there is a method of printing conductors, resistors, and dielectric pastes using noble metal paste and baking them at around 850°C to form circuits, but in this case, thermal grease or heat radiation sheet is used for bonding to the heat sink. Since it uses an organic adhesive with an inorganic filler added, there is a big problem with heat dissipation, and there is also a problem with heat resistance.
本発明は、上記従来技術の欠点を解消し、セラミック基
板とヒートシンク材との接着強度が゛大きく、かつ耐熱
性、放熱性に優れた混成集積回路基板であって、これを
簡単な工程で通常の厚膜ペーストを使用して製造し得る
技術を提供することを目的とするものである。The present invention eliminates the drawbacks of the prior art described above, and provides a hybrid integrated circuit board that has high adhesive strength between a ceramic substrate and a heat sink material, and has excellent heat resistance and heat dissipation. The purpose of this invention is to provide a technology that can be manufactured using a thick film paste.
（問題点を解決するための手段）
上記目的を達成するため、本発明者は１通常の厚膜ペー
ストを使用する方法でセラミック基板とヒートシンク材
との接合性に優れた方策について鋭意研究を重ねた結果
、接着剤として特定のペースト状インサート材を使用し
特定の処理を施すことにより可能であることを知得し、
本発明をなしたものである。(Means for Solving the Problems) In order to achieve the above object, the present inventor has conducted extensive research on methods for achieving excellent bonding between a ceramic substrate and a heat sink material using a method using a normal thick film paste. As a result, we learned that this is possible by using a specific paste-like insert material as an adhesive and applying a specific treatment.
This invention has been made.
すなわち、本発明に係る混成集積回路基板は。That is, the hybrid integrated circuit board according to the present invention is as follows.
アルミナ等のセラミック基板と、該基板の片面に形成さ
れた印刷回路面と、該基板の他方の面全体に印刷、焼成
された複合金属粉末からなるインサート材と、このイン
サート材を介して該基板に加熱接合された銅板等のヒー
トシンク材からなることを特徴とするものである。A ceramic substrate such as alumina, a printed circuit surface formed on one side of the substrate, an insert material made of composite metal powder printed and fired on the entire other surface of the substrate, and the substrate through this insert material. It is characterized by being made of a heat sink material such as a copper plate that is thermally bonded to a heat sink.
また、その製造方法は、アルミナ等のセラミック基板の
片面に厚膜ペーストを用いて回路を印刷すると共に、他
方の面全体に複合金属粉末をペースト状にしたインサー
ト材を印刷し、これを乾燥、焼成後、インサート材上に
銅板等のヒートシンク材を重ね合せ、非酸化性雰囲気中
又は１０−’Ｔｏｒｒ以下の真空中にて加熱して該基板
とヒートシンク材を接合することを特徴とするものであ
る。In addition, the manufacturing method is to print a circuit using thick film paste on one side of a ceramic substrate such as alumina, and print an insert material made of composite metal powder paste on the entire other side, dry it, After firing, a heat sink material such as a copper plate is superimposed on the insert material, and the substrate and the heat sink material are bonded by heating in a non-oxidizing atmosphere or in a vacuum of 10-'Torr or less. be.
以下に本発明を実施例に基づいて詳細に説明する。The present invention will be explained in detail below based on examples.
まず、セラミック基板としては、従来と同様の材質のも
のでよく、アルミナ、窒化アルミナ等々のセラミック材
料を用いる。First, the ceramic substrate may be made of the same material as in the past, and ceramic materials such as alumina, alumina nitride, etc. are used.
セラミック基板の片面、すなわち回路印刷面には、第１
図（ａ）、 （ｂ）に示すように通常の厚膜ペースト（
卑金属ペーストを含む）２を使用する厚膜技術によって
導体、抵抗体、誘電体回路をセラミック基板１上に印刷
する。印刷後、従来と同様、レベリングし、乾燥する。On one side of the ceramic substrate, that is, the circuit printing side, there is a first
As shown in Figures (a) and (b), ordinary thick film paste (
Conductors, resistors and dielectric circuits are printed on the ceramic substrate 1 by thick film technology using base metal pastes 2). After printing, it is leveled and dried in the same way as before.
一方、セラミック基板１の他方の面、すなわちヒートシ
ンク材４を取付ける面には、第１図（ｂ）に示すように
、特定組成のペースト状インサート材３を全面に所要量
印刷し、加熱接合処理する。On the other hand, on the other surface of the ceramic substrate 1, that is, the surface on which the heat sink material 4 is attached, as shown in FIG. do.
すなわち、そのためには、インサート材としては、例え
ばＡｇ系で複合金属粉末をペースト状にしたものを用い
る。That is, for that purpose, as the insert material, for example, a paste made of Ag-based composite metal powder is used.
具体的には、例えば、Ｃｕ及びＮｉのうちの少なくとも
１種を１０〜６０シｔ％（以下、同じ）、 ”ｒｉ、Ｎ
ｂ及びＺｒのうちの少なくとも１種を１０〜８０％含み
、残部が実質的にＡｇである組成を有し、各成分をメカ
ニカル７コイ法によって機械的に噛合結合した複合粉末
を有機溶媒中に分散させペースト状にしたインサート材
、或いはＣｕ及びＮｉのうちの少なくとも１種を１０〜
６０％、Ｔ１、Ｎｂ及びＺｒのうちの少なくとも１種を
７〜８０％、希土類元素（Ｙを含む）のうちの少なくと
も１種を５ ｐｐｍ〜３％含み、残部が実質的にＡｇ系
である組成を有し、各成分をメカニカルアロイ法によっ
て機械的に噛合結合した複合粉末を有機溶媒中に分散さ
せペースト状にしたインサート材などが好ましい。この
ような複合粉末は、いわゆるメカニヵルアロイ法によっ
て製造することができ、各成分の金属粉末を摺潰機、ボ
ールミル、アトライター等の攪拌機を用いて高速、高エ
ネルギー下で所要時間混合攪拌して粉砕することにより
、各成分粒子が機械的に噛合結合した、いわゆるメカニ
カルアロイ形態の複合粉末が得られるにの複合粉末の粒
度は４４μｍ以下、好ましくは１０μｍ以下のものが５
０すｔ％以上である微粉末が望ましい、この複合粉末は
ペースト状にするために有機溶媒中に分散させる。有機
溶媒としては、テレピネオール、ブチルカルピトール、
テキサノール、ブチルカルピトールアセテートなどを使
用することができ、またペースト中の金属粉量は６０〜
９０ｗｔ％とするのが適当である。なお、有機溶媒の他
に界面活性剤（例、ロジン・ワックス）を少量添加した
り、またバインダーとしてエチルセルロースなどを添加
してもよい。Specifically, for example, at least one of Cu and Ni is added at 10 to 60 t% (hereinafter the same), "ri, N
A composite powder containing 10 to 80% of at least one of b and Zr, with the remainder being substantially Ag, and each component being mechanically interlocked and bonded by a mechanical seven-coil method, is placed in an organic solvent. Insert material dispersed and made into paste, or at least one of Cu and Ni in 10~
60%, 7 to 80% of at least one of T1, Nb, and Zr, 5 ppm to 3% of at least one of rare earth elements (including Y), and the remainder is substantially Ag-based. It is preferable to use an insert material made by dispersing in an organic solvent a composite powder in which each component is mechanically interlocked and bonded using a mechanical alloying method and made into a paste. Such composite powders can be manufactured by the so-called mechanical alloying method, in which the metal powders of each component are mixed and pulverized using a stirrer such as a grinder, ball mill, or attritor at high speed and high energy for the required time. By doing so, a so-called mechanical alloy composite powder in which each component particle is mechanically interlocked and bonded can be obtained.The particle size of the composite powder is 44 μm or less, preferably 10 μm or less.
A fine powder with a content of 0% or more is desirable, and this composite powder is dispersed in an organic solvent to form a paste. Examples of organic solvents include terpineol, butylcarpitol,
Texanol, butylcarpitol acetate, etc. can be used, and the amount of metal powder in the paste is 60~
A suitable content is 90 wt%. In addition to the organic solvent, a small amount of a surfactant (eg, rosin wax) may be added, or ethyl cellulose or the like may be added as a binder.
ペースト状インサート材の膜厚は、インサート材及びセ
ラミック基板の材質、鋼板の厚みにもよるが、焼成膜厚
が４５〜６５μとなるような膜厚にする。The film thickness of the paste-like insert material depends on the materials of the insert material and the ceramic substrate, and the thickness of the steel plate, but is set to a film thickness such that the fired film thickness is 45 to 65 μm.
印刷後は、レベリングし、乾燥し、その後、焼成（脱脂
処理）するが、脱脂処理は不活性雰囲気中で約６００℃
で焼成するのが望ましく、これによりバインダー分を揮
発させる。After printing, it is leveled, dried, and then baked (degreased) at approximately 600°C in an inert atmosphere.
It is preferable to sinter the binder in a vacuum to volatilize the binder.
次いで、第１図（ｃ）に示すように、インサート材印刷
面にヒートシンク材４、すなわちヒートシンクやマザー
・ボードになる銅板又はアルミニウム板（いずれもニッ
ケルメッキしたものを含む）を合体させ、Ｎ２、Ａｒな
どの非酸化性雰囲気中又は１Ｏ−ｆｆＴｏｒｒ以下の真
空中で所要時間加熱し、接合する。加熱温度は上記組成
のインサート材を用いた場合、６００〜９００℃が好ま
しく、また１〜１００ ｋｇ／ａＪの加圧下で接合する
。Next, as shown in FIG. 1(c), a heat sink material 4, that is, a copper plate or an aluminum plate (including those plated with nickel) that will become a heat sink or a mother board, is combined with the printed surface of the insert material, and N2, Bonding is performed by heating in a non-oxidizing atmosphere such as Ar or in a vacuum of 10-ffTorr or less for a required period of time. When the insert material having the above composition is used, the heating temperature is preferably 600 to 900°C, and the bonding is performed under a pressure of 1 to 100 kg/aJ.
なお、抵抗体の場合には、第１図（ｄ）に示すように、
導体２の上に抵抗体２′を印刷する。In addition, in the case of a resistor, as shown in FIG. 1(d),
A resistor 2' is printed on the conductor 2.
次に本発明の実施例を示す。Next, examples of the present invention will be shown.
（実施例）
＝２０μに分級したスポンジチタン粉末２０部と平均粒
径１．６μの銀粉末４０部と平均粒径１゜５μの銅粉末
４０部とを合計５０ｇ準備し、前処理として摺潰機で５
時間混合粉砕した。混合粉砕後、フィッシャー・サブ・
シーブ・サイザー（粒度分布測定袋Ｗ）で平均粒径を測
定したところ、１．３μであった。(Example) A total of 50g of 20 parts of sponge titanium powder classified into 20μ, 40 parts of silver powder with an average particle size of 1.6μ, and 40 parts of copper powder with an average particle size of 1°5μ was prepared, and crushed as a pretreatment. 5 on the machine
Mixed and crushed for an hour. After mixing and grinding, Fisher sub-
The average particle size was measured with a sieve sizer (particle size distribution measurement bag W) and found to be 1.3 μm.
更に、次の割合で摺潰機を使用して５時間、予備混練し
た。Furthermore, preliminary kneading was carried out for 5 hours using a crusher at the following ratio.
上記混合粉砕物 ８０部
エチル・セルロース １．５部
テキサノール １６．７部
界面活性剤 １．８部
予備混線の目的は、粉末表面を活性にし、ビヒクルと接
触させることによって分散性をよくするためである。予
備混線の終了後、三本ロール・ミルで本混線を行い、ペ
ースト状インサート材を得た。The above mixed pulverized product: 80 parts Ethyl cellulose 1.5 parts Texanol 16.7 parts Surfactant 1.8 parts The purpose of premixing is to activate the powder surface and improve dispersibility by bringing it into contact with the vehicle. be. After the preliminary cross-crossing was completed, main cross-crossing was performed in a three-roll mill to obtain a paste-like insert material.
一方、約２５ｍｍ口Ｘ０．６３５ｍｍｔの９６％ＡＮ２
０３基板及び２５ｍｎ＋口Ｘ２ｍｍｔの銅板を用意した
。そして、銅板を貼り付ける側のＡｌ２Ｏ，基板に対し
ては、焼成膜厚が１６μ、３０μ、４５μ、６３μ、１
ｍｍになるように（焼成膜厚４５μとする乾燥膜厚は１
２０〜１３０μ）、２００メツシユ、バイアス張り、エ
マルジョン厚さ４５μのスクリーンを使用したスクリー
ン印刷機により、上記ペースト状インサート材を全面印
刷した。厚みの制御は印刷→乾燥を繰り返し、三回全面
にわたって印刷した。印刷後、１２０℃で３０分間最終
乾燥した。On the other hand, 96% AN2 with approximately 25mm opening x 0.635mmt
A 03 board and a copper plate of 25 mm+opening x 2 mmt were prepared. For the Al2O substrate on which the copper plate is attached, the fired film thicknesses are 16μ, 30μ, 45μ, 63μ, 1
mm (with a fired film thickness of 45μ, the dry film thickness is 1
The paste-like insert material was printed on the entire surface using a screen printing machine using a screen of 20 to 130 μm), 200 mesh, bias tension, and emulsion thickness of 45 μm. To control the thickness, printing and drying were repeated, and the entire surface was printed three times. After printing, final drying was performed at 120° C. for 30 minutes.
一方、Ａｌ２Ｏ，基板の裏側には、Ｒｅｍｅｘ社製厚膜
導電ペーストＡｇ／Ｐｄ＃２０３４、Ｃｕ＃５８１４を
＃Ａ＄パターンを使用して印刷し、１５分間レベリング
した後に１０５℃で約１時間乾燥し。On the other hand, on the back side of the Al2O and substrate, thick film conductive paste Ag/Pd #2034 and Cu #5814 made by Remex was printed using #A$ pattern, leveled for 15 minutes, and then dried at 105℃ for about 1 hour. death.
またＲ ｅｍｅｘ社製Ｒｕ系抵抗ペーストを印刷し、同
様にレベリングし、乾燥した。なお、印刷は２゜Ｏメツ
シュ、バイアス張り、エマルジョン厚さ４５μのステン
レススクリーンを使用したスクリーン印刷機により行な
った。Further, Ru-based resistance paste manufactured by Remex was printed, leveled in the same manner, and dried. The printing was carried out using a screen printing machine using a stainless steel screen with a 2°O mesh, bias tension, and an emulsion thickness of 45 μm.
このように両面に印刷した後、厚膜焼成炉を使用し、Ｎ
２気流中にて９０分間プロファイルで１５分間ピーク温
度（６００℃）保持の焼成を行い、含有しているバイン
ダー（ビヒクル）成分を揮発させたゆ
次いで、上記Ａｆ１．０３．Ｗ板のインサート材印刷面
に銅板を重ね合せ、更に全面１ｋｇの荷重をかけ、真空
炉に装入し、真空度１０ ”−’ Ｔｏｒｒ、接合温度
８５０℃で１時間保持し、常温になってから取り出した
。なお、真空炉への装入に際しては、第３図に示すよう
に、ステンレス鋼板（ＳＵＳ３０４）５と９９．５％Ａ
Ｑ２０３板６を用いて回路部を保護する状態にした。After printing on both sides in this way, a thick film firing furnace is used and N
Firing was carried out in a 90-minute profile for 15 minutes at a peak temperature (600° C.) in 2 air currents to volatilize the binder (vehicle) component contained therein, and then the above Af1.03. A copper plate was superimposed on the printed surface of the insert material of the W plate, and a load of 1 kg was applied to the entire surface, and the plate was placed in a vacuum furnace and held at a vacuum level of 10''-' Torr and a bonding temperature of 850℃ for 1 hour, until it reached room temperature. When charging the vacuum furnace, as shown in Figure 3, a stainless steel plate (SUS304) 5 and a 99.5% A
A Q203 board 6 was used to protect the circuit section.
得られた基板の接着強度は次のようにして調べた。The adhesive strength of the obtained substrate was examined as follows.
まず、銅板とＡＱ、Ｏ，基板の接着強度については、厚
膜ペーストを印刷しないサンプルを使い。First, for the adhesive strength between the copper plate and the AQ, O, and substrate, we used a sample without printing thick film paste.
ＭＥＥＫ加工機（放電砥石切断４！＆）によって１０ｍ
ｍ口に切り出した。サンプルは、１枚につき１６ケ切り
出すことができた。このようなサンプルについて次のよ
うな方法で銅板側の接着強度を測定した。すなわち、第
４図に示すように、接着剤７としてアラルダイトＡＺ−
１５を使用して、２５ｍｍＸ ５０ｍｍＸ ２ｍｍｔの
ステンレス鋼板（ＳＵＳ３０４）８の中央部に銅板側を
接着し、ＡＱ、Ｏ，基板１のアルミナ面に１０ＩｎＩ！
ｌφの銅リベット９を接合した後、ブツシュ・プル・テ
スター（全国製作所製）で銅板４側の接着強度を測定し
た。10m by MEEK processing machine (discharge grindstone cutting 4!&)
I cut it out into m pieces. It was possible to cut out 16 samples from each sheet. The adhesive strength on the copper plate side of such a sample was measured by the following method. That is, as shown in FIG. 4, Araldite AZ-
15, adhere the copper plate side to the center of a 25mm x 50mm x 2mmt stainless steel plate (SUS304) 8, and apply 10InI! to the alumina surface of the AQ, O, and substrate 1.
After joining the copper rivet 9 of lφ, the adhesive strength on the side of the copper plate 4 was measured using a bush pull tester (manufactured by Zenkoku Seisakusho).
一方、ＡＱ２０．基板に厚膜ペーストを用いて標準テス
ト・パターンにより印刷した面の接着強度については、
測定パターンは２ｍｍ口のパッドとし、第５図に示すよ
うに、そのパッド部１０にＬ字型にした０ 、 ６ ｍ
ｍφ銅線（スズ・メツキ処理）１１を２Ａｇ−６２Ｓｎ
−３６Ｐｂの銀入り半田１２にて固定し、バーチカル・
ボンド・テスターにより回路接着強度を求めた。更にラ
スペクト比１０：１のテストパターンにより、抵抗値、
シート抵抗、Ｔ。On the other hand, AQ20. Regarding the adhesion strength of a surface printed with a standard test pattern using a thick film paste on a substrate,
The measurement pattern was a pad with a 2 mm opening, and as shown in FIG.
mφ copper wire (tin plating treatment) 11 2Ag-62Sn
- Fixed with 36Pb silver solder 12, vertically
Circuit adhesion strength was determined using a bond tester. Furthermore, by using a test pattern with a raspect ratio of 10:1, the resistance value,
Sheet resistance, T.
Ｃ，Ｒも測定した。C and R were also measured.
以上の結果を第１表及び第２表に示す。The above results are shown in Tables 1 and 2.
【以下余白１ 第１表及び第２表かられかるように、ＡＱ、□○。[Margin 1 below As can be seen from Tables 1 and 2, AQ, □○.
基板と銅板の間のインサート材の焼成膜厚を適当に選ぶ
ならば（Ｎα３．４）、接着強度の優れた接合面を得る
ことができ、回路面の接着強度及び回路面積も本発明法
の処理に影響されず十分確保されると共にシート抵抗も
低く抑えられ、他の回路特性も良好である。If the firing film thickness of the insert material between the substrate and the copper plate is appropriately selected (Nα 3.4), a bonding surface with excellent adhesive strength can be obtained, and the adhesive strength and circuit area of the circuit surface can be reduced by the method of the present invention. It is not affected by processing and is sufficiently secured, sheet resistance is kept low, and other circuit characteristics are also good.
（発明の効果）
以上詳述したように、本発明によれば、特定のペースト
状インサート材を使用してセラミック基板に銅板等のヒ
ートシンク材を接合するので、接着強度及び耐熱性に優
れ、しかも通常の厚膜ペーストを用いて回路面を印刷で
きると共に特別のヒートシンクを使用せずに放熱性も向
上でき、更に製造工程が大幅に簡略化される。(Effects of the Invention) As detailed above, according to the present invention, since a heat sink material such as a copper plate is bonded to a ceramic substrate using a specific paste-like insert material, it has excellent adhesive strength and heat resistance. The circuit surface can be printed using ordinary thick film paste, heat dissipation can be improved without using a special heat sink, and the manufacturing process is greatly simplified.
第１図（ａ）〜（ｄ）は本発明法の製造工程の一例を示
す説明図、
第２図（ａ）〜（ｄ）は従来法の製造工程を示す説明図
、
第３図は真空炉を用いて加熱接合する際の装入状態を示
す断面図、
第４図はＡＱ、、Ｏ，基板と銅板の接着強度を試験する
時の試料取付状態を示す断面図、
第５図はＡＱ、Ｏ，基板と回路面の接着強度を試験する
時の試料取付状態を示す断面図である。
１・・・ＡＱ２０．基板、 ２・・・厚膜ペースト
、３・・・インサート材、 ４・・・ヒートシンク材
。
特許出願人 昭和電工株式会社
代理人弁理士 中 村 尚
第３図
旦
第５図Figures 1 (a) to (d) are explanatory diagrams showing an example of the manufacturing process of the present invention method, Figures 2 (a) to (d) are explanatory diagrams showing the manufacturing process of the conventional method, and Figure 3 is a vacuum A cross-sectional view showing the loading state when heat bonding is performed using a furnace. Figure 4 is a cross-sectional view showing the sample mounting state when testing the bond strength between a substrate and a copper plate. Figure 5 is AQ. , O, is a cross-sectional view showing the state in which the sample is attached when testing the adhesive strength between the board and the circuit surface. 1...AQ20. Substrate, 2... Thick film paste, 3... Insert material, 4... Heat sink material. Patent applicant Hisashi Nakamura, patent attorney for Showa Denko K.K. Figure 3 Figure 5
Claims (2)
形成された印刷回路面と、該基板の他方の面全体に印刷
、焼成された複合金属粉末からなるインサート材と、こ
のインサート材を介して該基板に加熱接合された銅板等
のヒートシンク材からなることを特徴とする混成集積回
路基板。(1) A ceramic substrate such as alumina, a printed circuit surface formed on one side of the substrate, an insert material made of composite metal powder printed and fired on the entire other side of the substrate, and a 1. A hybrid integrated circuit board comprising a heat sink material such as a copper plate that is thermally bonded to the board.
トを用いて回路を印刷すると共に、他方の面全体に複合
金属粉末をペースト状にしたインサート材を印刷し、こ
れを乾燥、焼成後、インサート材上に銅板等のヒートシ
ンク材を重ね合せ、非酸化性雰囲気中又は１０＾−＾３
Ｔｏｒｒ以下の真空中にて加熱して該基板とヒートシン
ク材を接合することを特徴とする混成集積回路基板の製
造方法。(2) Print a circuit using a thick film paste on one side of a ceramic substrate such as alumina, and print an insert material made of paste of composite metal powder on the entire other side. After drying and firing, insert Layer a heat sink material such as a copper plate on top of the material and place it in a non-oxidizing atmosphere or at 10^-^3
A method for manufacturing a hybrid integrated circuit board, characterized in that the board and a heat sink material are bonded by heating in a vacuum of Torr or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185915A JPH0738424B2 (en) | 1986-08-07 | 1986-08-07 | Hybrid integrated circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185915A JPH0738424B2 (en) | 1986-08-07 | 1986-08-07 | Hybrid integrated circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6342153A true JPS6342153A (en) | 1988-02-23 |
| JPH0738424B2 JPH0738424B2 (en) | 1995-04-26 |
Family
ID=16179104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61185915A Expired - Lifetime JPH0738424B2 (en) | 1986-08-07 | 1986-08-07 | Hybrid integrated circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0738424B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014088025A1 (en) * | 2012-12-06 | 2014-06-12 | 三菱マテリアル株式会社 | Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, paste for copper plate bonding, and method for producing bonded body |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5267275U (en) * | 1975-11-13 | 1977-05-18 | ||
| JPS6032343A (en) * | 1983-08-02 | 1985-02-19 | Toshiba Corp | Power semiconductor module substrate |
-
1986
- 1986-08-07 JP JP61185915A patent/JPH0738424B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5267275U (en) * | 1975-11-13 | 1977-05-18 | ||
| JPS6032343A (en) * | 1983-08-02 | 1985-02-19 | Toshiba Corp | Power semiconductor module substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014088025A1 (en) * | 2012-12-06 | 2014-06-12 | 三菱マテリアル株式会社 | Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, paste for copper plate bonding, and method for producing bonded body |
| JP2014116353A (en) * | 2012-12-06 | 2014-06-26 | Mitsubishi Materials Corp | Power module substrate, power module substrate with heat sink, power module, method for manufacturing power module substrate, paste for copper plate junction, and method for manufacturing joined body |
| TWI615929B (en) * | 2012-12-06 | 2018-02-21 | 三菱綜合材料股份有限公司 | Power module substrate, power module substrate having heatsink, power module, method for producing power module substrate, paste for connecting copper plate, and method for producing laminated body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0738424B2 (en) | 1995-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4122232A (en) | Air firable base metal conductors | |
| JPS59146103A (en) | Conductive paste | |
| US5165986A (en) | Copper conductive composition for use on aluminum nitride substrate | |
| CA1110053A (en) | Silver compositions | |
| WO2021200242A1 (en) | Brazing material, method for producing same, and method for producing metal-ceramics bonded substrate | |
| JP7164775B2 (en) | Conductive paste for bonding | |
| JPS6342153A (en) | Hybrid integrated circuit board and manufacture thereof | |
| JP7317397B2 (en) | COPPER OXIDE PASTE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | |
| JPH0367403A (en) | Conductor paste, manufacture thereof, and circuit board and electronic circuit module using it | |
| JPS63256291A (en) | Material for adhesion | |
| JPS6342152A (en) | Hybrid integrated circuit board and manufacture thereof | |
| JP3482580B2 (en) | High heat dissipation metal composite plate and high heat dissipation metal substrate using the same | |
| JP7132591B2 (en) | Conductive paste and sintered body | |
| JP3522295B2 (en) | Metal plate bonded ceramic substrate and method of manufacturing the same | |
| JPH05238857A (en) | Method for metallizing substrate of aluminum nitride | |
| JPH05226515A (en) | Aluminum nitride substrate having metallized layer and the metallizing method thereof | |
| JPH01206508A (en) | Conductive paste for aluminum nitride substrate | |
| TWI789698B (en) | Copper oxide paste and method for producing electronic parts | |
| JP5953003B2 (en) | Conductive paste for ceramic multilayer circuit boards | |
| JPS6387790A (en) | Manufacture of high heat radiation circuit board | |
| JPH03155493A (en) | Gold alloy solder paste for semiconductor device | |
| JPS58130590A (en) | Ceramic circuit board and thick film hybrid ic using same board | |
| JPS6387791A (en) | Manufacture of high heat radiation circuit board | |
| JP4189792B2 (en) | Conductive composition | |
| JPH0468138B2 (en) |