JPS6341356U - - Google Patents
Info
- Publication number
- JPS6341356U JPS6341356U JP13419686U JP13419686U JPS6341356U JP S6341356 U JPS6341356 U JP S6341356U JP 13419686 U JP13419686 U JP 13419686U JP 13419686 U JP13419686 U JP 13419686U JP S6341356 U JPS6341356 U JP S6341356U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- motor
- optical sensor
- molten solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 238000001514 detection method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図乃至第３図は本考案の一実施例を示すも
ので、第１図ははんだ槽の縦断側面図、第２図は
同縦断正面図、第３図は全体の正面図であり、第
４図及び第５図は従来例を示す第１図及び第２図
相当図である。
図中、１１はプリント配線基板搬送コンベア、
１７はポンプ、１９はモータ、２４は溶融はんだ
、２４ａは噴出液面、２６はプリント配線基板、
２８は光センサ、３２はインバータ（制御装置）
を示す。
1 to 3 show an embodiment of the present invention, in which FIG. 1 is a vertical side view of a solder bath, FIG. 2 is a vertical front view of the same, and FIG. 3 is a front view of the whole. 4 and 5 are views corresponding to FIGS. 1 and 2 showing a conventional example. In the figure, 11 is a printed wiring board conveyor;
17 is a pump, 19 is a motor, 24 is molten solder, 24a is a jetting liquid level, 26 is a printed wiring board,
28 is a light sensor, 32 is an inverter (control device)
shows.
Claims (1)
だをコンベアに載置されて移動するプリント配線
基板の下面部に向けて噴出させることによりこの
プリント配線基板にはんだ付けするものにおいて
、前記溶融はんだの噴出液面の高さを検出する光
センサと、この光センサの高さ検出信号に応じて
前記モータの回転数を制御する制御装置とを設け
たことを特徴とする自動はんだ付け装置。 In a method for soldering to a printed wiring board by spouting molten solder toward the lower surface of the printed wiring board placed on a conveyor and moving by a pump driven by a motor, the surface of the spouted molten solder is An automatic soldering apparatus comprising: an optical sensor that detects height; and a control device that controls the rotation speed of the motor in accordance with a height detection signal from the optical sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13419686U JPS6341356U (en) | 1986-09-03 | 1986-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13419686U JPS6341356U (en) | 1986-09-03 | 1986-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6341356U true JPS6341356U (en) | 1988-03-18 |
Family
ID=31035213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13419686U Pending JPS6341356U (en) | 1986-09-03 | 1986-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6341356U (en) |
-
1986
- 1986-09-03 JP JP13419686U patent/JPS6341356U/ja active Pending
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