JPS6337999A - Ic card - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an IC (integrated circuit) card,
In particular, it relates to an IC card having an IC having only a memory function or both a memory function and a data processing function.

[Conventional technology]

Currently, many types of magnetic cards are used as credit cards and cash cards. The field is finance,
It has spread to many areas, mainly in the distribution sector, and is becoming an indispensable part of daily life. The magnetic card is made by pasting a band-shaped magnetic tape onto a plastic plate, and allows reading and writing of data.

Due to its structure, this magnetic card has many drawbacks, such as being easily susceptible to various crimes such as forgery and alteration, and having a very small capacity.
Cards are getting a lot of attention.

[Problem that the invention seeks to solve]

However, this IC card also has the disadvantage that the IC incorporated therein may be destroyed by air discharge of static electricity.

Electrostatic damage to ICs occurs because the plastic material that makes up the card is an insulator, so if you wear synthetic clothing and put the card inside it, static electricity builds up on the surface of the card, causing damage to the metal. This happens when a person touches it and an electrical discharge occurs there.

To prevent electrostatic damage to the IC in the IC card, the input MO
Measures have been taken such as increasing the size of the S transistor and inserting a resistor or protection diode into the input. Additionally, if an even higher electrostatic withstand voltage is required, a surge protection element is attached externally. In recent years, other antistatic coatings and antistatic plastics have been developed. Conventional MOS
) The method of making the transistor thicker (or adding a resistor or protection diode to the input) increases the manufacturing cost of the IC chip or module.The same thing also applies to the method of attaching an external surge protection element. Antistatic coatings and antistatic plastics still have problems such as variations in physical properties and environmental resistance.

An object of the present invention is to eliminate electrostatic damage to IC chips in IC cards without causing problems in conventional methods.

[Means for solving problems]

In order to solve the above problems, the present invention is characterized in that ions are implanted into the plastic material constituting the IC card to prevent electrostatic damage to the IC. Ion implantation has been established as a technique for embedding impurities into a material with high precision during the production of semiconductor devices. Thereby, a stable conductive layer (resistance) can be formed on the surface of the plastic material.

In the present invention, the plastic materials include not only those exposed on the surface of the IC card, but also all plastic materials that constitute the IC card, such as the sealing resin that supports the IC and the support for the printed circuit board. Examples of the resin include vinyl chloride, epoxy resin, phenol resin, polyimide, polyester, polyolefin, polyphenylene sulfide, polysulfone, polyether sulfone, polyether ether ketone, and polyether imide diallyl phthalate resin.

The ion implantation conditions include an acceleration energy of 10 to 10
00KeV is preferable, more preferably 30-300
KeV, and the ion implantation amount is lx1016 ions/
C++f or higher is preferable. The ion species to be implanted are:
N, Ar, C, O, Ti, Cu, Zn, B
.

Any element such as P, Fe, Si, etc. can be used.

[For production]

When ions are implanted into the plastic material that makes up the IC card, a stable conductive layer (resistance) is formed on the surface of the plastic material, and the IC chip is prevented from being damaged by static electricity.

〔Effect of the invention〕

The present invention involves a simple operation of ion implantation into a plastic material, and the processing cost is low. Further, by changing the processing conditions, it is possible to change the thickness and conductivity of the conductive portion, and a conductive layer with any stable conductivity can be formed at any position.

〔Example〕

Embodiments of the IC card of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a sectional view of the first embodiment. This embodiment is an embodiment for a laminated IC card in which a part of the electrodes 4.5 of an IC module 10 including an IC chip 1 is covered with a cover film 12. As shown in detail in FIG. 2, in an IC module 10 including an IC chip, an IC chip l is bonded to a sealing resin 2 and a resin (insulating plastic material of a printed circuit board) 3 that supports the IC chip and performs wiring. The IC chip 1 is further connected by a wiring 6 to an external connection electrode 4 provided on the upper surface of a resin 3 that supports the IC chip and performs wiring, and a ground 1 yang 5. . The IC module 10 having such a structure is formed in advance, and this IC module IO
is accommodated in the gap portion 18 of the center core 11 of the IC card, the cover film 12 is inserted into the IC module IO.
Center core 1 so as to cover a part of electrode 4.5 of
1. In this embodiment, ions are implanted into the inner surface of the cover film 12 at a portion that contacts and straddles the external connection electrode 4 and the ground electrode 5, and the ion implantation layer 16a thus formed increases the electrostatic withstand voltage. has been improved.

FIG. 3 is a sectional view of a second embodiment of the invention.

Embodiment N is an embodiment for an insert-type IC card in which an IC module is fitted into a recess 18 of a laminate formed by laminating a pack film 17, a center core 11, and a cover film 12. In this embodiment, ions are implanted into the insulating plastic material between the external connection electrode 4 and the ground electrode 5 to form an ion implantation layer 16b, thereby improving the electrostatic withstand voltage.

4 and 5 are cross-sectional views of a third embodiment and a fourth embodiment of the present invention, respectively, and are examples for a laminated type and an embedded type IC card, respectively. In either embodiment, ion implantation is performed on the surfaces of the cover film 12 and the pack film 17, thereby forming an ion implantation layer 16C116d. Ion implantation over the entire exposed surface of the card in this way has a remarkable effect in preventing charging of the IC card.

FIG. 6 is a sectional view of a fifth embodiment of the present invention.

This embodiment is an embodiment for a laminated IC card, in which ion implantation is performed on the inner surfaces of the cover film 12 and the pack film 17, and the ion implantation layers 16a and 1
6b is formed, which is effective in both improving the electrostatic withstand voltage of the IC and preventing charging.

In addition to the above, parts that are effective in imparting conductivity include the resin 3 that supports the IC and performs wiring, the resin part 2 that seals the back of the IC chip, and the part of the pack film 17 that contacts the sealing resin 2. can be mentioned.

Great effects can be obtained even when any of these parts and any of the above embodiments are combined.

The process of imparting conductivity to the resin part that supports the IC is
This is done before sealing with resin. Further, when the sealing resin is made to have conductivity, the effect is multiplied by passing the ground wire from the electrode to the resin surface.

The resistance of the conductive layer formed by ion implantation can be set to a desired value by changing the implantation conditions, such as acceleration voltage and implantation amount. Relatively low resistance values in the range of 1010 Ω/port are required; relatively high resistance values are sufficient to prevent charging of IC cards.

Figure 7 shows N”, Ar”, and C” on the polyvinyl chloride substrate.
The graph shows the change in surface resistance with respect to the ion implantation amount when implanted.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a first embodiment of the IC card of the present invention, and is a sectional view of the embodiment for a laminated IC card. FIG. 2 is an exploded perspective view of an IC module. FIG. 4 is a sectional view showing a second embodiment, and FIG. 5 is a sectional view showing an embodiment for a built-in type IC card. FIG. 4 and FIG. FIG. 6 is a sectional view showing a fifth embodiment of the present invention, and FIG. 7 is a sectional view of an embodiment for a laminated IC card. Graph showing changes in surface resistance with respect to ion implantation amount when N'', Ar'', and C'' are implanted into a substrate. 1... IC chip, 2... Sealing resin, 3... I
Resin supporting the C chip and performing wiring, 4... External connection electrode, 5... Grounding electrode, 6... Wiring, 10...
- IC module, 11... Center core, 12... Cover film, 16a, 16b, 16c, 16d, 16e... Ion implantation layer, 17... Pack film. Engraving of the drawings (no changes to the contents) Figure 1 Figure 2 Figure 3 Figure 4 Figure 7 Injection M (ions-cm) Procedural amendment (method) Commissioner of the Patent Office Kuro 1) Mr. Akihiro 1, of the case Display 1986 Patent Axis No. 181535
No. 2, Title of the invention IC card 3, Relationship with the amended person's case Name of applicant (679) RIKEN Takayu Co., Ltd. 4, Agent

Claims (1)

[Claims] An IC card with a built-in IC chip and an external terminal, characterized in that a plastic material constituting the card is ion-implanted.