JPS63376A - Adhesive for additive process printed circuit board - Google Patents
Adhesive for additive process printed circuit boardInfo
- Publication number
- JPS63376A JPS63376A JP14422286A JP14422286A JPS63376A JP S63376 A JPS63376 A JP S63376A JP 14422286 A JP14422286 A JP 14422286A JP 14422286 A JP14422286 A JP 14422286A JP S63376 A JPS63376 A JP S63376A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- butadiene rubber
- comb
- graft copolymer
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 30
- 239000000654 additive Substances 0.000 title claims description 8
- 230000000996 additive effect Effects 0.000 title claims description 8
- 238000000034 method Methods 0.000 title claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 8
- -1 acrylic ester Chemical class 0.000 claims abstract description 6
- 229920000578 graft copolymer Polymers 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 4
- 238000007334 copolymerization reaction Methods 0.000 claims abstract description 3
- 239000000178 monomer Substances 0.000 claims abstract description 3
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 claims description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 claims 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 abstract description 10
- 238000007772 electroless plating Methods 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229910052742 iron Inorganic materials 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 239000003054 catalyst Substances 0.000 abstract description 4
- 239000005011 phenolic resin Substances 0.000 abstract description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011256 inorganic filler Substances 0.000 abstract description 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 229920001568 phenolic resin Polymers 0.000 abstract description 2
- 150000001408 amides Chemical class 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 10
- 239000003607 modifier Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000007788 roughening Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 3
- CFRNDJFRRKMHTL-UHFFFAOYSA-N [3-octanoyloxy-2,2-bis(octanoyloxymethyl)propyl] octanoate Chemical compound CCCCCCCC(=O)OCC(COC(=O)CCCCCCC)(COC(=O)CCCCCCC)COC(=O)CCCCCCC CFRNDJFRRKMHTL-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229960001592 paclitaxel Drugs 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- RCINICONZNJXQF-MZXODVADSA-N taxol Chemical compound O([C@@H]1[C@@]2(C[C@@H](C(C)=C(C2(C)C)[C@H](C([C@]2(C)[C@@H](O)C[C@H]3OC[C@]3([C@H]21)OC(C)=O)=O)OC(=O)C)OC(=O)[C@H](O)[C@@H](NC(=O)C=1C=CC=CC=1)C=1C=CC=CC=1)O)C(=O)C1=CC=CC=C1 RCINICONZNJXQF-MZXODVADSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、アディティブ法による印刷配線板の製造に用
いられる接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an adhesive used for manufacturing printed wiring boards by an additive method.
（従来の技術）
アディティブ法による印刷配線板は、接着剤を塗布した
絶縁基板（接着剤付き絶縁基板）に、スルホール穴あけ
→回路となる部分以外に無電解めっきレジスト形成→接
着剤表面の化学的粗化→無電解めっきによる回路形成、
あるいはスルホール穴あけ→接着剤表面の化学的粗化→
全面無電解めっき→回路部以外にレジスト形成−電気め
っき→レジスト除去→クイックエツチングにより回路部
以外のめっぎ除去、などの工程にエリ製造されている。(Prior technology) Printed wiring boards using the additive method are made by drilling through-holes on an insulating substrate coated with adhesive (insulating substrate with adhesive) → forming electroless plating resist on areas other than those that will become circuits → chemically depositing the adhesive on the surface of the adhesive. Roughening → circuit formation by electroless plating,
Or through-hole drilling → chemical roughening of adhesive surface →
The manufacturing process is as follows: full-surface electroless plating → resist formation on areas other than the circuit area - electroplating → resist removal → quick etching to remove plating on areas other than the circuit area.
このアディティブ印刷配線板における接着剤は、今所導
体回路を強固に接着するための化学的粗化を受けやすい
こと、結果として接着力が光分であること、および電子
部品を搭載するための高温はんだ作菓に、１ｉｔえるす
ぐれた耐熱性を有することが基本的な要件である。接着
剤層は、年電解めっきに先立って表面を化学的に粗化す
る必要があるが、このための接着剤としては、一般に、
化学的粗化を受けやすく、柔軟性のある合成ゴム例えば
アクリロニトリルブタジェンゴムを主成分とし、耐熱性
を保持するためにアルキルフェノール町脂で架橋させ、
さらにエポキシ系樹脂等を通直配合してなる接着剤が提
案されてきた。（例えば特公昭４８−２４２５０、特公
昭４５−９８４３、特公昭４５−９９９６、特公昭５５
−１６３９１、特公昭５２−３１５３９）。Adhesives used in additive printed wiring boards are susceptible to chemical roughening in order to firmly adhere conductor circuits, and as a result, adhesive strength is comparable to light, and high temperatures are required to mount electronic components. The basic requirement for solder confectionery is to have excellent heat resistance of more than 1 it. The surface of the adhesive layer needs to be chemically roughened prior to electrolytic plating, and the adhesive for this purpose is generally
Synthetic rubber that is susceptible to chemical roughening and flexible, such as acrylonitrile butadiene rubber, is the main component, and is crosslinked with alkylphenol town fat to maintain heat resistance.
Furthermore, adhesives made by directly blending epoxy resins and the like have been proposed. (For example, Special Publication No. 48-24250, Special Publication No. 45-9843, Special Publication No. 45-9996, Special Publication No. 55
-16391, Special Publication No. 52-31539).
（発明が解決しようとする問題点）
ところが、近年ますます高度化している電子機器に適用
するアディティブ印刷配線板用接着剤としては、さらに
耐熱性を向上させろ必要が生じてきている。(Problems to be Solved by the Invention) However, in recent years, it has become necessary to further improve the heat resistance of adhesives for additive printed wiring boards that are applied to electronic devices that have become increasingly sophisticated.
例えば、搭載部品のはんだづけの作業性や、接続信頼性
の点から２６０℃以上のはんだ浴が使用されろ。さらに
、搭載した電子部品が回路上の不具合から、部品交換さ
れることがあり、か〜る場合には、一般に３００℃以上
、時には４００ないし４２０℃もの高温はんだ鏝を用い
た手はんだ修正作業が行われる。For example, a solder bath with a temperature of 260° C. or higher should be used for ease of soldering the mounted components and connection reliability. Furthermore, installed electronic components may have to be replaced due to circuit defects, and in such cases, manual soldering work using a soldering iron at high temperatures of over 300°C, and sometimes as high as 400 to 420°C, is required. It will be done.
このような高温下では、基板と接着剤界面にふくれを生
ずることがあり、これは配線板として致命的な欠陥であ
る。このような、はんだ作業時のふ（れは、接着剤自体
の耐熱性不足に起因するのみではなく、基材かもの発生
ガスにより接着剤と基材の接着界面が破壊されるためで
ある。At such high temperatures, blistering may occur at the interface between the substrate and the adhesive, which is a fatal defect for wiring boards. Such bulging during soldering is not only due to the lack of heat resistance of the adhesive itself, but also because the adhesive interface between the adhesive and the base material is destroyed by the gas generated by the base material.
本発明は、はんだ耐熱性およびはんだ鏝耐熱性にすぐれ
たアディティブ印刷配線板用の接着剤付き絶縁基板等に
使用される接着剤を提供するものである。The present invention provides an adhesive for use in adhesive-attached insulating substrates for additive printed wiring boards, etc., which has excellent solder heat resistance and soldering iron heat resistance.
（問題点を解決するための手段）
本発明は、アクリロニトリルブタジェンゴム、熱硬化性
樹脂を必須成分とし、これにアクリル酸エステルまたは
、メタクリル酸エステルの単独重合または共重合に：る
マクロモノマーとカルボキシル基、水酸基、酸アミド基
、ポリオキシエチレン基のいずれかを持つ親水性モノマ
ーとを共重合したクシ型グラフト共重合体を添加してな
るものである。(Means for Solving the Problems) The present invention has an acrylonitrile butadiene rubber and a thermosetting resin as essential components, and a macromonomer for homopolymerization or copolymerization of an acrylic ester or a methacrylic ester. It is made by adding a comb-shaped graft copolymer copolymerized with a hydrophilic monomer having either a carboxyl group, a hydroxyl group, an acid amide group, or a polyoxyethylene group.
クシ型グラフトポリマーは、「化学と工業」第３８巻第
６号（１９８５）４３２〜４３４頁、特公昭６０−１５
６５９号公報、特開昭５８−１５４７６６号公報、特開
昭５８−１６４６５６号公報、特開昭５８−１６７６０
６号公報、特開昭５９−２０３６０号公報、特開昭５９
−７Ｂ２５６号公報に示されろように優れた界面移行性
を有している表面改質剤であり、接着剤〜基板界面の接
着力を向上させろ作用を有し、高温時のふくれを抑制す
るものである。これら改質剤の添加量はα０１〜５重量
％が良好な結果を与えろ。Ｑ、０１重量％未満では効果
を発揮するのに不光分であり、５重量％を超えるともに
や務加童に応じた効果が得られず、他の特性を低下させ
るおそｎがある。これらは、プラスチックスの改質剤と
して、東亜合成化学工業■から、カルボキシル基型とし
てアロンＧＣ−１０、水酸基型としてアロンＧＨ−２０
などが市販されている。The comb-shaped graft polymer is described in "Kagaku to Kogyo" Vol. 38, No. 6 (1985), pp. 432-434, Japanese Patent Publication No. 60-15.
659, JP 58-154766, JP 58-164656, JP 58-16760
Publication No. 6, JP-A-59-20360, JP-A-59
As shown in Publication No. 7B256, it is a surface modifier that has excellent interfacial migration properties, has the effect of improving the adhesive force at the adhesive-substrate interface, and suppresses blistering at high temperatures. It is something. The addition amount of these modifiers should be α01 to 5% by weight to give good results. Q: If it is less than 0.1% by weight, it will not be effective, but if it exceeds 5% by weight, it will not be possible to obtain the desired effect and other properties may be deteriorated. These are used as modifiers for plastics by Toagosei Kagaku Kogyo ■, including Aron GC-10 as a carboxyl group type and Aron GH-20 as a hydroxyl group type.
etc. are commercially available.
接着剤として、アクリロニトリルブタジェンゴムを必須
成分とし、他にフェノール樹脂、エポキシ樹脂等の熱硬
化性樹脂が使用されろ。As an adhesive, acrylonitrile butadiene rubber is an essential component, and thermosetting resins such as phenol resin and epoxy resin are also used.
また、必要ＶＣより、無電解めっき用の触媒を加えろこ
とや、無機充填材を配合することができろ。In addition, it is possible to add a catalyst for electroless plating or to mix an inorganic filler with the required VC.
無電解めっきを析出させるに際しては、接着剤表面を化
学的に粗化して、接着に適した形状にするとともに無電
解めっきの触媒が表面に露出させる。When depositing electroless plating, the surface of the adhesive is chemically roughened to give it a shape suitable for adhesion, and the catalyst for electroless plating is exposed on the surface.
化学的粗化に用いろ処理液は一般のクロム酸−硫酸、夏
りロム毅−ＴｔＬ酸などが使用できる。As the filtration liquid used for chemical roughening, general chromic acid-sulfuric acid, Natsuri Romu-Toshi-TtL acid, etc. can be used.
無電解めっき浴としては一般の鋼をめっき膜として形成
できるものが使用さｎる。As the electroless plating bath, one that can form a plating film on general steel is used.
実施例１
アクリロニトリルブタジェンゴム
（日本ゼオン■製 Ｎ−１４３２Ｊ）
フェノール樹脂
（スケネクタディ社製 ５ｐ１２６）
３５部
エポキシ樹脂（油化シェル裂 エピコートＥ−１００１
）１０部
ジルコニウムシリケート
（シクロパックス２ＯＡ 白水化学製）３０部
めっき融媒（日立化成工業什勾製
ＰＥＣ−８） ８部
表面改質剤（東亜合成化学工業■灸
アロンＧＣ−１０）（グラフトポリマー２５％溶液）
ｌ１６４部
をニーグーを用いて酢酸セロソルブとメチルエテルケト
ン１：１Ｎ量比の混合溶媒に溶層して固形分２２％の接
着剤溶液を作成した。この接着剤を、ｓｏｏｍｍ角の紙
フェノール積層板（日立化成工業■製画品名ＬＰ−１４
１）および紙エポキシ積層板（同、ＬＥ−１４４，）の
両面に、乾燥後の接着剤膜厚が２５μｍとなるように浸
漬塗布し、７６０℃６０分間加熱乾燥して接着剤付き絶
Ｒ基板を得た。Example 1 Acrylonitrile butadiene rubber (N-1432J, manufactured by Nippon Zeon ■) Phenolic resin (5p126, manufactured by Schenectady) 35 parts epoxy resin (oiled shell split Epicoat E-1001)
) 10 parts Zirconium silicate (Cyclopax 2OA, manufactured by Hakusui Chemical) 30 parts Plating solvent (PEC-8, manufactured by Hitachi Chemical Juko) 8 parts Surface modifier (Toagosei Chemical Co., Ltd. Moxibustion Aron GC-10) (Graft polymer 25% solution)
An adhesive solution having a solid content of 22% was prepared by dissolving 164 parts of 1 in a mixed solvent of cellosolve acetate and methyl ether ketone in a 1:1N ratio using a Nigu. Apply this adhesive to a zoomm square paper phenol laminate (Hitachi Chemical, product name LP-14).
1) and paper epoxy laminate (LE-144), dip coated on both sides so that the adhesive film thickness after drying was 25 μm, and heated and dried at 760°C for 60 minutes to obtain an adhesive-coated extreme R board. I got it.
次いでクロム酸混液（Ｃｒｙ３５５ ｇ、濃硫酸２１０
１！＋１を水で稀釈し全体を１２とする）に４０℃で１
５分間浸漬して化学的粗化処理を行い水洗した。次Ｋｉ
！解めっきを６７°Ｃで３０時間行った。Next, a mixture of chromic acid (355 g of Cry, 210 g of concentrated sulfuric acid
1! +1 diluted with water to make a total of 12) at 40°C.
It was immersed for 5 minutes to perform chemical roughening treatment and washed with water. Next Ki
! Deplating was carried out at 67°C for 30 hours.
得られた銅の厚さは３５μである。水洗後１６０℃で６
０分間加熱乾燥した。The thickness of the copper obtained is 35μ. 6 at 160℃ after washing with water
It was heated and dried for 0 minutes.
とのもの〜、耐熱性試験結果を表１に示す。The heat resistance test results are shown in Table 1.
実施例２
アクリロニトリルブタジェンゴム
（日本ゼオン■製 Ｎ−１００１）７０部２エノー／Ｌ
−樹脂（スケネクタディ社製５Ｐ１２６）
３０部フェノール樹脂（スケネクタディ社表
５Ｐ６６００） １部部エポキシ樹脂
（ダウケミカル社製
ＤＥＮ４３８） １０部ジルコニウム
シリケート（白水化学■製ミクロパックス ２０Ａ）
３（３部めっき触媒（日立化成工業■製
ＰＥＣ−８） ８部表面改質
剤（東亜合成化学工業固装
アロンＧＨ−２０） ６．４部を実施
例１と同様にして接着剤を作成し基板に塗布乾燥して接
着剤付き絶縁基板を得た。Example 2 Acrylonitrile butadiene rubber (N-1001 manufactured by Nippon Zeon ■) 70 parts 2 eno/L
-Resin (Schenectady 5P126)
30 parts phenol resin (Schenectady Table 5P6600) 1 part epoxy resin (DEN438 manufactured by Dow Chemical Company) 10 parts zirconium silicate (Micropax 20A manufactured by Hakusui Kagaku ■)
3 (3 parts plating catalyst (PEC-8 made by Hitachi Chemical Co., Ltd.) 8 parts surface modifier (Toagosei Chemical Industry Solid Aron GH-20) 6.4 parts to prepare an adhesive in the same manner as in Example 1 The mixture was coated on a substrate and dried to obtain an insulating substrate with an adhesive.
このもの−１無電解めっき後の耐熱性試験結果を表１に
示す。Table 1 shows the heat resistance test results after this product-1 electroless plating.
比較例１
実施例１の組成より表面改質剤を除去した接着剤を作成
し実施例１と同様にしてプリント配線板とした。この特
性を表１に示す。Comparative Example 1 An adhesive was prepared from the composition of Example 1 with the surface modifier removed, and a printed wiring board was prepared in the same manner as in Example 1. This characteristic is shown in Table 1.
比較例２
実施例２の組成より表面改質剤を除いた接着剤を作成し
実施例２と同様にしてプリント配線板としたらこの特性
を表１に示す。Comparative Example 2 An adhesive was prepared from the composition of Example 2 except for the surface modifier, and a printed wiring board was prepared in the same manner as in Example 2. The characteristics are shown in Table 1.
表１
測定方法
り ＪＩＳ、Ｃ−’５４ｓ１て準拠。２６０℃はんだ浴
における破壊する１での秒数。Table 1 Measurement method Based on JIS, C-'54s1. 1 seconds to failure in a 260°C solder bath.
２）スルホール部に搭載した電子部品を２６０℃に調整
したフローンルダーを使用してはんだ接続したのち２８
０℃に調整した、はんだ吸取器を用いてはんだを除き電
子部品を交換し、次いで４２０℃に調整したはんだゴテ
を使用してはんだ接続およびはんだ吸増器による部品交
換をくりかえし行いスルホール部のランド破壊、ふくれ
等、接続欠損する迄の回数を測定する。2) After soldering the electronic components mounted in the through hole using a flon luder adjusted to 260℃,
Remove the solder and replace the electronic components using a solder sucker adjusted to 0°C, then repeat solder connections using a soldering iron adjusted to 420°C and parts replacement using a solder absorber to remove the land in the through-hole area. Measure the number of times until connection loss occurs due to breakage, blistering, etc.
（発明の効果ン
本発明の接着剤は、例えばアディティブ印刷配線板の耐
熱性、特に、はんだ耐熱性、はんだゴテ耐熱性にすぐｎ
たものである。(Effects of the Invention) The adhesive of the present invention improves the heat resistance of, for example, additive printed wiring boards, particularly the soldering heat resistance and soldering iron heat resistance.
It is something that
Claims (1)
必須成分とし、これにアクリル酸エステルまたはメタク
リル酸エステルの単独重合または共重合によるマクロモ
ノマーとカルボキシル基、水酸基、酸アミド基、ポリオ
キシエチレン基のいずれかを持つ親水性モノマーとを共
重合したクシ型グラフト共重合体を０．０１〜５重量％
添加、分散させてなるアディティブ法配線板用接着剤。1. Acrylonitrile butadiene rubber, thermosetting resin as an essential component, and a macromonomer obtained by homopolymerization or copolymerization of acrylic acid ester or methacrylic acid ester and either carboxyl group, hydroxyl group, acid amide group, or polyoxyethylene group. 0.01 to 5% by weight of a comb-shaped graft copolymer copolymerized with a hydrophilic monomer having
Additive method adhesive for wiring boards made by adding and dispersing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14422286A JPS63376A (en) | 1986-06-20 | 1986-06-20 | Adhesive for additive process printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14422286A JPS63376A (en) | 1986-06-20 | 1986-06-20 | Adhesive for additive process printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63376A true JPS63376A (en) | 1988-01-05 |
Family
ID=15357083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14422286A Pending JPS63376A (en) | 1986-06-20 | 1986-06-20 | Adhesive for additive process printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63376A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4801253A (en) * | 1985-11-11 | 1989-01-31 | Aktiebolaget Electrolux | Oil pump |
| JPWO2008096670A1 (en) * | 2007-02-07 | 2010-05-20 | 株式会社きもと | Electroless plating forming material, catalyst adhesion coating solution, electroless plating forming method, and plating method |
-
1986
- 1986-06-20 JP JP14422286A patent/JPS63376A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4801253A (en) * | 1985-11-11 | 1989-01-31 | Aktiebolaget Electrolux | Oil pump |
| JPWO2008096670A1 (en) * | 2007-02-07 | 2010-05-20 | 株式会社きもと | Electroless plating forming material, catalyst adhesion coating solution, electroless plating forming method, and plating method |
| JP4673412B2 (en) * | 2007-02-07 | 2011-04-20 | 株式会社きもと | Electroless plating forming material, catalyst adhesion coating solution, electroless plating forming method, and plating method |
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