JPS63375A - Adhesive for copper-clad laminate - Google Patents
Adhesive for copper-clad laminateInfo
- Publication number
- JPS63375A JPS63375A JP14422186A JP14422186A JPS63375A JP S63375 A JPS63375 A JP S63375A JP 14422186 A JP14422186 A JP 14422186A JP 14422186 A JP14422186 A JP 14422186A JP S63375 A JPS63375 A JP S63375A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- resin
- copper
- comb
- graft copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- -1 acrylic ester Chemical class 0.000 claims abstract description 5
- 229920000578 graft copolymer Polymers 0.000 claims abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 4
- 238000007334 copolymerization reaction Methods 0.000 claims abstract description 3
- 239000000178 monomer Substances 0.000 claims abstract description 3
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 claims description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 claims 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011889 copper foil Substances 0.000 abstract description 7
- 239000005011 phenolic resin Substances 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 abstract description 3
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 3
- 229920001971 elastomer Polymers 0.000 abstract description 2
- 239000011256 inorganic filler Substances 0.000 abstract description 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000005060 rubber Substances 0.000 abstract description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 150000001408 amides Chemical class 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 239000003607 modifier Substances 0.000 description 7
- 239000002585 base Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 240000000249 Morus alba Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、銅張り積７層板の製造に用いられる接着剤に
関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an adhesive used in the production of copper-clad seven-layer laminates.
（従来の技術）
印刷配線板の製造に使用されろ鋼弗り積層板は、一般に
、回路部を形成することになる銅箔に、接着剤溶液を塗
布し、乾燥して未硬化または半硬化状態の接着剤塗膜を
形成し１このち、絶縁板基材と重ね合せ、熱圧して接着
及び積層工程を同時に行って得られる。印刷配憩板を得
るには、回路部分以外の銅箔を化学的に蝕刻して配膳路
を形成する。さらに、この基板に穴あけ加工を施して、
取付部品のターミナルを挿沿し、はんだ浴に浸漬して、
結着を完全にする工程を必要としている。(Prior Art) In order to produce a filtered steel laminate used in the manufacture of printed wiring boards, an adhesive solution is generally applied to the copper foil that will form the circuit section, and the adhesive solution is dried and left uncured or semi-cured. This is obtained by forming an adhesive coating film, and then superimposing it on an insulating board base material and hot pressing to perform adhesion and lamination processes at the same time. To obtain a printed distribution board, the copper foil other than the circuit portion is chemically etched to form the distribution channel. Furthermore, by drilling holes on this board,
Insert the terminal of the mounting part, immerse it in the solder bath,
Requires a process to complete binding.
（発明が解決しようとする問題点）
銅張り積層板に使用される接着剤には、印刷配線板を作
成する際の苛酷な加工条件、すなわち、回路巾が狭少で
ありても、強力な受看力を保つこと、はんだ浴に浸漬し
た場合にフクレを生じないこと、その他、穴あけ加工等
、機械油工注に支障をきたさないこと、また、回路にめ
っきを施す場合、使用される化学桑品に侵されないこと
等が必要である。加えて、電子轡器の進展にともない、
便用条件も、ます復す苛酷な方向にあり、回路巾も、高
密度配籾化のためにますます狭少化してきており、この
ため接若力を維持することが困難となってきた。(Problem to be solved by the invention) The adhesive used for copper-clad laminates has a strong ability to withstand the harsh processing conditions used to create printed wiring boards, that is, even when the circuit width is narrow. It must maintain its receptivity, it must not cause blisters when immersed in a solder bath, it must not cause any problems with drilling or other mechanical lubricating, and it must also be compatible with the chemicals used when plating circuits. It is necessary that it not be attacked by mulberry plants. In addition, with the advancement of electronic clocks,
The operating conditions are becoming increasingly severe, and the width of the circuit is becoming narrower due to higher density arrangement of rice, making it difficult to maintain the attractive force. .
本発明は１．特に銅箔との接着力に優れる銅張り積層板
の製造に便用される接着剤を提供するものである。The present invention consists of 1. The object of the present invention is to provide an adhesive that is conveniently used in manufacturing copper-clad laminates and has particularly excellent adhesive strength with copper foil.
（問題点を解決するための手段）
本発明は、熱硬化性樹脂を必須成分とする接着剤に、ア
クリル酸エステル、またはメタクリル酸エステルの単独
重合または共重合によるマクロモノマーとカルボキシル
基、水酸基、酸アミド基、ポリオキシエチレン基のいず
れかを持つ親水性モノマーとを共重合したクシ型グラフ
ト共重合体を添加するものである。(Means for Solving the Problems) The present invention provides an adhesive containing a thermosetting resin as an essential component, a macromonomer obtained by homopolymerization or copolymerization of an acrylic ester or a methacrylic ester, and carboxyl groups, hydroxyl groups, A comb-shaped graft copolymer copolymerized with a hydrophilic monomer having either an acid amide group or a polyoxyethylene group is added.
クシ型グラフトポリマーは、「化学と工業」第３８巻第
６号（１９８５ン４３２〜４３４頁、特公昭６０−１５
６５９号公報、特開昭５８−１５４７６６号公報、特開
昭５８−１６４６５６号公報、特開昭５８−１６７６０
６号公報、特開昭５９−２０３６０号公報、特開昭５９
−７８２３６号公報に示されるように優れた界面移行性
を有している表面改質剤であり銅箔界面の接着力を向上
させる。これら改質剤の伶加量は０．０１〜５重積％が
良好な結果を与えろ。α０１７４景％未満では、強力な
接着力が発揮されず、５重量％を超えると、脩加量に応
じた効果が得られず、他の特性を低下させるおそれがあ
るためである。熱硬化性樹脂としては、エポキシ樹脂、
フェノール樹脂、ポリエステル樹脂、などが便用でき、
適宜熱可塑性樹脂、ゴム、無機充填材などを配合するこ
とができる。これらは、プラスチックスの改質剤として
、東亜合成化学工業■から、カルボキシル基型としてア
ロンＧＣ−１０、水酸基型としてアロンＧＨ−２０など
が市販されている。The comb-shaped graft polymer is described in "Chemistry and Industry" Vol.
659, JP 58-154766, JP 58-164656, JP 58-16760
6, JP-A-59-20360, JP-A-59-Sho.
As shown in Japanese Patent No. 78236, it is a surface modifier that has excellent interfacial migration properties and improves the adhesive strength at the copper foil interface. Good results are obtained when the amount of these modifiers is 0.01 to 5% by volume. This is because if the amount of α0 is less than 174% by weight, strong adhesive force will not be exhibited, and if it exceeds 5% by weight, the effect corresponding to the amount of expansion will not be obtained and other properties may be deteriorated. As thermosetting resins, epoxy resins,
Phenol resin, polyester resin, etc. can be used conveniently.
Thermoplastic resin, rubber, inorganic filler, etc. can be blended as appropriate. These are commercially available as modifiers for plastics, such as Aron GC-10 as a carboxyl group type and Aron GH-20 as a hydroxyl group type, from Toagosei Kagaku Kogyo (1).
実施例１
エポキシ樹脂（シェル化学■製エピコート１００１）：
３０部（重量部、以下同じ）、夷フェノール樹脂（アル
カリ触媒フェノールホルマリン樹脂、ゲル化時間１６０
”Ｃ，６０秒）：６０部（固形分５０％）、及び熱可塑
性樹脂として積木化学工業■製ポリビニルブチラール樹
脂、エスレックＢＸ−１ニア０部、表面改質剤として東
亜合成化学工業＠製アロンＧＣ１０：２゜６部（固形分
２５％）をメチルエチルケトン５５０部に混合溶解して
従清剤を作成した。Example 1 Epoxy resin (Epicoat 1001 manufactured by Shell Chemical ■):
30 parts (parts by weight, same hereinafter), phenol resin (alkali catalyst phenol formalin resin, gelation time 160
"C, 60 seconds): 60 parts (solid content 50%), polyvinyl butyral resin manufactured by Block Chemical Industry ■ as a thermoplastic resin, 0 parts of S-LEC BX-1 Nia, and Aron manufactured by Toagosei Chemical Industry @ as a surface modifier A secondary clearing agent was prepared by mixing and dissolving 6 parts of GC10:2° (solid content 25%) in 550 parts of methyl ethyl ketone.
該接着剤を＠箔に塗布し、乾燥して得た接着剤付銅箔と
、紙基材にフェノール樹脂を主成分とする積層基材とを
重ね合せ、１６０℃、６０分、８０ｋｇ／ａｍ’のプレ
ス条件で積層して′ｊ１１ｉＩ帳積層板を詐取した。Ｊ
ＩＳ、Ｃ−６４８１に準拠して測定した。このものＮ特
性を表１に示す。The adhesive-coated copper foil obtained by applying the adhesive to @foil and drying it and a laminated base material whose main component is phenol resin on a paper base material were superimposed, and heated at 160°C for 60 minutes at 80 kg/am. The laminate was laminated under the pressing conditions of 'j11iI' and was stolen. J
Measured in accordance with IS, C-6481. Table 1 shows the N characteristics of this product.
比較例１
表面改質剤を除いたほかは実施例１と同様にして銅張り
積層板を作成した。この特性を表１に示す。Comparative Example 1 A copper-clad laminate was produced in the same manner as in Example 1 except that the surface modifier was removed. This characteristic is shown in Table 1.
実施例２
エポキシ＠脂（ダウケミカル−１ＤＥＮ−４３８：２０
部、フェノール樹脂（アルカリ融媒フェノールホルマリ
ン樹脂、ゲル化時間１６０℃、６０秒フン：０部（固形
分５０％）、メチル化メラミン樹脂：１０部、熱町塑注
伏脂として、電気化学工業＠裂ポリビニルブチラール樹
脂、デンカブチラール５０００ニア０部、表面改質剤と
して、東亜合成化学工莱■製、アロンＧＨ−２０：α８
５部（固形分２５％）を実施例１）と同様にして、接着
剤を作成し、鋼箔に塗布して接着剤付銅箔を得た。次い
で紙基材に、エポキシ樹脂を主成分とする積層基材と重
ね合せ、熱圧プレスして銅張り積層板を作成した。Example 2 Epoxy @ fat (Dow Chemical-1DEN-438:20
part, phenol resin (alkali melting phenol formalin resin, gelling time 160°C, 60 seconds), 0 parts (solid content 50%), methylated melamine resin: 10 parts, Netsumachi plastic pouring resin, Denki Kagaku Kogyo. @Cracked polyvinyl butyral resin, Denka Butyral 5000 Nia 0 parts, as a surface modifier, manufactured by Toagosei Kagaku Korai ■, Aron GH-20: α8
An adhesive was prepared using 5 parts (solid content 25%) in the same manner as in Example 1) and applied to steel foil to obtain an adhesive-coated copper foil. Next, a paper base material was laminated with a laminated base material containing an epoxy resin as a main component, and hot-press pressed to create a copper-clad laminate.
この特性を表１に示す。This characteristic is shown in Table 1.
比較例２
表面改質剤を除いたほかは、笑施列２と同様にして＠張
り積層板を作成した。Comparative Example 2 A @-strapped laminate was produced in the same manner as in Stretching 2, except that the surface modifier was omitted.
この特性を表１に示す。This characteristic is shown in Table 1.
表１
（発明の効果）
本発明の接着剤に工り、銅張積層板における砲箔の接着
力を向上させることができる。Table 1 (Effects of the Invention) By using the adhesive of the present invention, it is possible to improve the adhesive strength of gun foil in copper-clad laminates.
Claims (1)
ステルまたはメタクリル酸エステルの単独重合または共
重合によるマクロモノマーと、カルボキシル基、水酸基
、酸アミド基、ポリオキシエチレン基のいずれかを持つ
親水性モノマーとを共重合したクシ型グラフト共重合体
を０．０１〜５重量％添加分散させてなる銅張り積層板
用接着剤。1. A hydrophilic product that has a thermosetting resin as an essential component, a macromonomer obtained by homopolymerization or copolymerization of an acrylic acid ester or a methacrylic acid ester, and a carboxyl group, a hydroxyl group, an acid amide group, or a polyoxyethylene group. An adhesive for copper-clad laminates, which is made by adding and dispersing 0.01 to 5% by weight of a comb-shaped graft copolymer copolymerized with a synthetic monomer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14422186A JPS63375A (en) | 1986-06-20 | 1986-06-20 | Adhesive for copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14422186A JPS63375A (en) | 1986-06-20 | 1986-06-20 | Adhesive for copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63375A true JPS63375A (en) | 1988-01-05 |
Family
ID=15357061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14422186A Pending JPS63375A (en) | 1986-06-20 | 1986-06-20 | Adhesive for copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63375A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0357229A2 (en) * | 1988-08-01 | 1990-03-07 | E.I. Du Pont De Nemours And Company | Acrylic hot melt pressure sensitive adhesive compositions |
| US6716915B2 (en) * | 2000-09-14 | 2004-04-06 | Rohm And Haas Company | Method of forming toughened thermoset articles and toughened thermoset articles produced thereby |
-
1986
- 1986-06-20 JP JP14422186A patent/JPS63375A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0357229A2 (en) * | 1988-08-01 | 1990-03-07 | E.I. Du Pont De Nemours And Company | Acrylic hot melt pressure sensitive adhesive compositions |
| US6716915B2 (en) * | 2000-09-14 | 2004-04-06 | Rohm And Haas Company | Method of forming toughened thermoset articles and toughened thermoset articles produced thereby |
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