JPS6335780A - Noble metal plating method - Google Patents
Noble metal plating methodInfo
- Publication number
- JPS6335780A JPS6335780A JP17761086A JP17761086A JPS6335780A JP S6335780 A JPS6335780 A JP S6335780A JP 17761086 A JP17761086 A JP 17761086A JP 17761086 A JP17761086 A JP 17761086A JP S6335780 A JPS6335780 A JP S6335780A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- noble metal
- metal
- soln
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 33
- 229910000510 noble metal Inorganic materials 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 150000003839 salts Chemical class 0.000 claims description 10
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 claims description 5
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 claims description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 5
- 239000010970 precious metal Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000004020 conductor Substances 0.000 abstract description 3
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 abstract 2
- 239000002904 solvent Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 11
- 229910052737 gold Inorganic materials 0.000 description 11
- 239000010931 gold Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/06—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、メッキ浴を用いない簡便な貴金属メッキ方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a simple noble metal plating method that does not use a plating bath.
プリント回路基板の端子部や電子部品の端子部などには
腐食防止のため金メッキが施されている。Terminals of printed circuit boards and electronic components are plated with gold to prevent corrosion.
従来、このような電子回路部材の導体（１１１常は消ま
たは銅合金）に金メッキを施す場合には、被メッキ部分
を金メッキ浴に’ｔ４ ？ｉすることにより行っている
。Conventionally, when gold plating is applied to the conductor (111 usually blank or copper alloy) of such an electronic circuit member, the part to be plated is placed in a gold plating bath. This is done by doing i.
しかし上記のようにメッキ浴を使用する方法では、メッ
キ浴の成分がメッキ回数に応じて変化していくため、メ
ッキ浴の管理が面倒であると共に、−回の浸漬では充分
なメッキが得られないため工程が多くなる等の問題があ
る。However, in the method using a plating bath as described above, the components of the plating bath change depending on the number of times of plating, so managing the plating bath is troublesome, and sufficient plating cannot be obtained with -1 times of immersion. Because there is no such thing, there are problems such as an increase in the number of steps.
本発明は、上記のような従来技術の問題点に迄み、メッ
キ浴を用いずに簡単に行える貴金属メッキ方法を提供す
るもので、その方法は、７ビエチン酸の貴金属塩を含む
粘８！］溶液を、上記塩に含まれる貴金属よりイオン化
傾向の大きい被メッキ金属の表面に塗布した後、加熱し
て、上記塩から貴金属イオンを分離し、上記被メッキ金
属の表面に貴金属を析出させることを特徴とするもので
ある。The present invention overcomes the problems of the prior art as described above by providing a precious metal plating method that can be easily performed without using a plating bath. ] Applying the solution to the surface of the metal to be plated, which has a greater ionization tendency than the noble metal contained in the salt, and then heating to separate the noble metal ions from the salt and depositing the noble metal on the surface of the metal to be plated. It is characterized by:
アビエチン酸は松脂の主成分であり、次のような構造を
有している。Abietic acid is the main component of pine resin and has the following structure.
このアビエチン酸のカルボキシル基のＨを金属で置換し
た塩を、その金属よりイオン傾向の大きい金属基材の表
面に塗布して、高温に加熱すると、上記塩から金属イオ
ンが分離して、イオン化傾向の差により、その金属イオ
ンが上記金属基村上に金属として析出する現象が見られ
る。When this salt in which the H of the carboxyl group of abietic acid is replaced with a metal is applied to the surface of a metal substrate that has a higher ionic tendency than the metal and is heated to a high temperature, the metal ions are separated from the salt and the ionization tendency is increased. Due to the difference in the amount of metal, there is a phenomenon in which the metal ions are precipitated as metal on the metal base layer.
本発明は、このような現象を利用したものである。The present invention utilizes such a phenomenon.
アビエチン酸と金の金属塩を有機溶剤に溶かして粘稠溶
液を得た。プリント回路基板の回路導体（銅）の端子部
に、Ｎｉ メッキを施した後、その表面に、上記粘稠溶
液を塗布した。次にそれを約２００℃で１時間加熱した
後、残滓を洗浄により取り除いた。その結果、Ｎｉメブ
キ面上に金が析出し、均一な金メッキを得ることができ
た。Abietic acid and gold metal salt were dissolved in an organic solvent to obtain a viscous solution. After Ni plating was applied to the terminal portion of the circuit conductor (copper) of the printed circuit board, the above viscous solution was applied to the surface thereof. It was then heated at about 200° C. for 1 hour, after which the residue was removed by washing. As a result, gold was deposited on the Ni plating surface, and uniform gold plating could be obtained.
金メッキ層の厚さは、粘稠溶液内の金属塩の濃度と、加
熱温度および時間によりコントロール可能である。The thickness of the gold plating layer can be controlled by the concentration of metal salt in the viscous solution and the heating temperature and time.
なおＮｉ メッキを施したのは、析出した金中へ銅が拡
散するのを防止するためである。The purpose of Ni plating is to prevent copper from diffusing into the deposited gold.
上記実施例ではプリント回路基板の端子部に金メッキを
施す場合を説明したが、各種電子部品の端子部、コネク
タのコンタクトなどへの金メッキも可能である。また本
発明は、金メッキだけでなく、恨メンキや白金メッキに
も適用できる。In the above embodiment, the case where gold plating is applied to the terminal portion of a printed circuit board has been described, but gold plating can also be applied to the terminal portions of various electronic components, contacts of connectors, and the like. Further, the present invention can be applied not only to gold plating but also to plating and platinum plating.
以上説明したように本発明によれば、アビエチン酸の貴
金属塩を含む粘稠溶液を塗布して加熱するだけで簡単に
貴金属メッキを施すことができ、またメッキ条件の管理
も極めて簡単である。さらにメッキ箇所に粘稠溶液を塗
布する方式であるから、部分メッキも極めて簡単に行え
る。As explained above, according to the present invention, noble metal plating can be easily performed by simply applying and heating a viscous solution containing a noble metal salt of abietic acid, and control of plating conditions is also extremely simple. Furthermore, since the method involves applying a viscous solution to the plating area, partial plating can be performed extremely easily.
・二＼
出願人代理人 弁理士 若林広志・’、、ソ：ｒ、 、
？嶌＼−＼−
−」・2＼ Applicant's agent Patent attorney Hiroshi Wakabayashi・',, So:r, ,
? Shima＼－＼－－”
Claims (1)
含まれる貴金属よりイオン化傾向の大きい被メッキ金属
の表面に塗布した後、加熱して、上記塩から貴金属イオ
ンを分離し、上記被メッキ金属の表面に貴金属を析出さ
せることを特徴とする貴金属メッキ方法A viscous solution containing a noble metal salt of abietic acid is applied to the surface of the metal to be plated, which has a greater tendency to ionize than the noble metal contained in the salt, and then heated to separate the noble metal ions from the salt and remove the metal to be plated. A precious metal plating method characterized by depositing a precious metal on the surface of
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17761086A JPS6335780A (en) | 1986-07-30 | 1986-07-30 | Noble metal plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17761086A JPS6335780A (en) | 1986-07-30 | 1986-07-30 | Noble metal plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6335780A true JPS6335780A (en) | 1988-02-16 |
| JPH0564235B2 JPH0564235B2 (en) | 1993-09-14 |
Family
ID=16034015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17761086A Granted JPS6335780A (en) | 1986-07-30 | 1986-07-30 | Noble metal plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6335780A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0379100A (en) * | 1989-08-22 | 1991-04-04 | Matsushita Electric Ind Co Ltd | Light transmission paste and precipitating method for metal copper using the same |
| EP0513821A2 (en) * | 1991-05-18 | 1992-11-19 | Horiba, Ltd. | Method of producing metallic thin film |
| US5695571A (en) * | 1993-06-01 | 1997-12-09 | Fujitsu Limited | Cleaning method using a defluxing agent |
-
1986
- 1986-07-30 JP JP17761086A patent/JPS6335780A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0379100A (en) * | 1989-08-22 | 1991-04-04 | Matsushita Electric Ind Co Ltd | Light transmission paste and precipitating method for metal copper using the same |
| EP0513821A2 (en) * | 1991-05-18 | 1992-11-19 | Horiba, Ltd. | Method of producing metallic thin film |
| EP0513821A3 (en) * | 1991-05-18 | 1994-03-16 | Horiba Ltd | |
| US5695571A (en) * | 1993-06-01 | 1997-12-09 | Fujitsu Limited | Cleaning method using a defluxing agent |
| US6050479A (en) * | 1993-06-01 | 2000-04-18 | Fujitsu, Ltd. | Defluxing agent cleaning method and cleaning apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0564235B2 (en) | 1993-09-14 |
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