JPS6354071B2 - - Google Patents
Info
- Publication number
- JPS6354071B2 JPS6354071B2 JP56061429A JP6142981A JPS6354071B2 JP S6354071 B2 JPS6354071 B2 JP S6354071B2 JP 56061429 A JP56061429 A JP 56061429A JP 6142981 A JP6142981 A JP 6142981A JP S6354071 B2 JPS6354071 B2 JP S6354071B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- printed wiring
- wiring board
- anode
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 23
- 238000007772 electroless plating Methods 0.000 claims description 14
- 230000008021 deposition Effects 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1671—Electric field
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明はプリント配線板のめつき方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for plating printed wiring boards.
従来より電子計算装置、通信機などの電子機器
には回路部品の搭載と配線のためにプリント配線
板が用いられている。このプリント配線板は銅箔
を絶縁板にはり付けた銅張り板より主として次の
２方法でパターンが形成される。その第１の方法
は、スルーホール用孔あけ−無電解めつき−電解
めつき（パネルめつき）−レジスト塗布−パター
ン焼付−現像−電解めつき（パターンめつき）−
半田めつき−レジスト剥離−エツチングの諸工程
を順次行なう方法である。第２の方法はスルーホ
ール用孔あけ−無電解めつき−電解めつき−パラ
ジウム塗布−レジスト塗布−パターン焼付−現像
−無電解めつき−半田めつき−レジスト剥離−エ
ツチングの諸工程を順次行なう方法である。 BACKGROUND ART Printed wiring boards have traditionally been used in electronic devices such as electronic computing devices and communication devices for mounting circuit components and wiring. Patterns on this printed wiring board are formed using a copper-clad board made by gluing copper foil to an insulating board, mainly by the following two methods. The first method is: drilling for through holes - electroless plating - electrolytic plating (panel plating) - resist coating - pattern baking - development - electrolytic plating (pattern plating) -
This is a method in which the steps of solder plating, resist peeling, and etching are sequentially performed. The second method involves sequentially performing the steps of through-hole drilling, electroless plating, electrolytic plating, palladium coating, resist coating, pattern baking, development, electroless plating, solder plating, resist peeling, and etching. It's a method.
ところが第１の方法においてはパターンめつき
の際に電流分布の不均一が避けられず、めつき厚
のバラツキが生ずる。のバラツキによりめつきが
厚くついた部分はレジストの上にもめつきがはみ
出し、レジストの剥離工程において、レジストを
塩化メチレン等の溶剤で膨潤させシヤワー又はブ
ラツシングを掛けてもめつきがはみ出した部分は
レジストが完全に除去されずレジスト残りを生ず
る。このためエツチング時に銅残りを生じパター
ン間のシヨートの原因となる。この対策としてめ
つき時の電流分布を均一にするためプリント配線
板と陽極との間に遮蔽板を挿入しているが、プリ
ント板の種類に応じて多数の遮蔽板を要すること
と作業性が著しく悪くなる欠点がある。また第２
の方法はパターンの無電解めつきの前処理として
析出反応のトリガとなるパラジウムの塗布工程が
必要であり工程が煩雑となる欠点がある。本発明
はこれらの欠点を解消するために案出されたもの
である。 However, in the first method, non-uniform current distribution cannot be avoided during pattern plating, resulting in variations in plating thickness. In the areas where the plating is thick due to variations in the thickness, the plating protrudes onto the resist.In the resist stripping process, even if the resist is swollen with a solvent such as methylene chloride and showered or brushed, the areas where the plating protrudes will remain on the resist. is not completely removed, resulting in resist residue. As a result, copper remains during etching, causing shorts between patterns. As a countermeasure to this problem, a shielding plate is inserted between the printed wiring board and the anode to make the current distribution uniform during plating, but this requires a large number of shielding plates depending on the type of printed wiring board, and it is difficult to work. There are drawbacks that make it significantly worse. Also the second
This method requires a process of applying palladium, which triggers a precipitation reaction, as a pretreatment for electroless plating of a pattern, and has the disadvantage that the process is complicated. The present invention has been devised to overcome these drawbacks.
このため本発明においては、プリント配線板の
パターンめつきを行なうめつき方法において、め
つき液には無電解めつき液を用い、該めつき液に
プリント配線板と陽極とを浸漬し、プリント配線
板を陰極として陽極との間に電圧を印加しながら
めつきを行なつてプリント配線板に析出用の核を
形成し、その後電圧印加を止めて無電解めつきを
行なうことを特徴とするものである。 Therefore, in the present invention, in the plating method for pattern plating a printed wiring board, an electroless plating solution is used as the plating solution, the printed wiring board and the anode are immersed in the plating solution, and the printed wiring board is printed. Plating is performed while applying a voltage between the wiring board as a cathode and an anode to form a nucleus for deposition on the printed wiring board, and then the voltage application is stopped and electroless plating is performed. It is something.
以下、添付図面に基づいて本発明のプリント配
線板のめつき方法を詳細に説明する。 Hereinafter, the printed wiring board plating method of the present invention will be explained in detail based on the accompanying drawings.
第１図に本発明方法を実施している状態を示
す。図により本めつき方法を説明すると、めつき
槽１に無電解めつき液２を満し、このめつき液２
の中にめつきすべきプリント配線板３と陽極４と
を浸漬し、プリント配線板３を陰極として陽極４
との間にある時間だけ電圧を印加しながらめつき
を行ない、その後電圧を印加せずに無電解めつき
を行なうのである。なお無電解めつき液には例え
ばCuSO4、NaOH、HCHO、その他錯化物等を
含む液が用いられ、陽極にはステンレスステイー
ル、カーボン、金、白金等の不溶解性金属が用い
られる。また印加する電圧は銅析出電圧の＋
0.334Vより低い電圧で良く、印加時間はパラジ
ウム核に相当する核が形成される時間で良い。 FIG. 1 shows a state in which the method of the present invention is implemented. To explain the actual plating method using a diagram, a plating tank 1 is filled with an electroless plating solution 2, and this plating solution 2 is
The printed wiring board 3 to be plated and the anode 4 are immersed in the solution, and the printed wiring board 3 is used as the cathode.
Plating is performed while applying voltage for a certain period of time, and then electroless plating is performed without applying voltage. The electroless plating solution is a solution containing, for example, CuSO 4 , NaOH, HCHO, or other complexes, and the anode is made of an insoluble metal such as stainless steel, carbon, gold, or platinum. In addition, the applied voltage is + of the copper deposition voltage.
A voltage lower than 0.334V may be used, and the application time may be set to a time during which nuclei corresponding to palladium nuclei are formed.
実施例としては−3Vを２秒間印加し、その後
１時間めつき液中に放置して十分な銅の析出が得
られた。これに対し電圧を印加せずに１時間めつ
き液中に浸漬しておいた場合には全く銅の析出は
なかつた。 In an example, -3V was applied for 2 seconds, and then the sample was left in a plating solution for 1 hour to obtain sufficient copper deposition. On the other hand, when the sample was immersed in the plating solution for 1 hour without applying any voltage, no copper was deposited at all.
このようにパターンめつきを行なうことによ
り、プリント配線板に析出する銅は主として無電
解めつきにより析出されるため、または電圧を印
加してもその電圧は低く且つ短時間であるためめ
つき厚さのバラツキは殆んど無く、従つてレジス
トの剥離を阻害するようなことは皆無となる。ま
たパラジウムの塗布を必要としないため処理工程
が節減できる。さらに従来の電解めつき法では第
２図の如く銅イオン供給源としての陽極４が必要
であり一様な電流分布を期待すると１度にできる
処理枚数が少ないが本発明方法では電流は単に核
を作るのみで良いので第１図に示した如く１度に
多数枚の処理が可能である。 By performing pattern plating in this way, the plating thickness can be reduced because the copper deposited on the printed wiring board is mainly deposited by electroless plating, or even if a voltage is applied, the voltage is low and for a short time. There is almost no variation in the thickness, and therefore there is no possibility of hindering the peeling of the resist. Furthermore, since palladium coating is not required, processing steps can be reduced. Furthermore, in the conventional electrolytic plating method, as shown in Fig. 2, an anode 4 is required as a copper ion supply source, and if a uniform current distribution is expected, the number of sheets that can be processed at one time is small, but in the method of the present invention, the current is simply a nucleus. Since it is only necessary to make , it is possible to process a large number of sheets at one time as shown in FIG.
以上説明した如く本発明のプリント配線板のめ
つき方法は、パターンめつき時に無電解めつき液
を用い被処理プリント配線板に電圧を印加してめ
つきを行なうことによりレジストの剥離性を向上
してパターン間のシヨートを防止可能とし、また
処理工程の短縮及び処理能力の向上を可能とした
ものである。 As explained above, the printed wiring board plating method of the present invention improves the removability of the resist by plating by applying a voltage to the printed wiring board to be processed using an electroless plating solution during pattern plating. This makes it possible to prevent shorts between patterns, shorten processing steps, and improve processing capacity.
第１図は本発明にかかるプリント配線板のめつ
き方法を実施している状態を説明する説明図、第
２図は従来のめつき方法を実施している状態を説
明する説明図である。
１……めつき槽、２…無電解めつき液、３……
プリント配線板、４……陽極。
FIG. 1 is an explanatory diagram illustrating a state in which a printed wiring board plating method according to the present invention is being implemented, and FIG. 2 is an explanatory diagram illustrating a state in which a conventional plating method is being implemented. 1...Plating tank, 2...Electroless plating solution, 3...
Printed wiring board, 4... anode.
Claims (1)
つき方法において、めつき液には無電解めつき液
を用い、該めつき液にプリント配線板と陽極とを
浸漬し、プリント配線板を陰極として陽極との間
にある時間電圧を印加しながらめつきを行なつて
プリント配線板に析出用の核を形成し、その後電
圧印加を止めて無電解めつきを行なうことを特徴
とするプリント配線板のめつき方法。1 In a plating method for pattern plating a printed wiring board, an electroless plating solution is used as the plating solution, the printed wiring board and an anode are immersed in the plating solution, and the printed wiring board is used as the cathode and the anode is used as the anode. A printed wiring board characterized in that plating is performed while applying a voltage for a period of time to form nuclei for deposition on the printed wiring board, and then the voltage application is stopped and electroless plating is performed. Plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6142981A JPS57177966A (en) | 1981-04-24 | 1981-04-24 | Plating method for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6142981A JPS57177966A (en) | 1981-04-24 | 1981-04-24 | Plating method for printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57177966A JPS57177966A (en) | 1982-11-01 |
| JPS6354071B2 true JPS6354071B2 (en) | 1988-10-26 |
Family
ID=13170810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6142981A Granted JPS57177966A (en) | 1981-04-24 | 1981-04-24 | Plating method for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57177966A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100434670B1 (en) * | 2001-10-22 | 2004-06-04 | 엘지.필립스 엘시디 주식회사 | Method for reducing resistivity of electroless-plated copper film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59588A (en) * | 1982-06-23 | 1984-01-05 | Toshiba Corp | Rotary compressor |
-
1981
- 1981-04-24 JP JP6142981A patent/JPS57177966A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59588A (en) * | 1982-06-23 | 1984-01-05 | Toshiba Corp | Rotary compressor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57177966A (en) | 1982-11-01 |
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