JPS633490A - Apparatus for mounting electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an apparatus for mounting electronic components and the like.

In a chip-type electronic component mounting apparatus, which is one of the conventional electronic component mounting apparatuses, as shown in FIG. The electronic component 5 is positioned and mounted.

Conventionally, in an electronic component mounting apparatus, a mounting head performs mounting operations, such as picking up components and regulating components.

Rotation depending on the mounting direction of the component on the printed circuit board.The speed of mounting the two components onto the printed circuit board and the speed of the XY table were each fixed.

Problems to be Solved by the Invention However, with the above method, the following problems occur when attempting to mount components of various shapes with a single mounting device.

For standard-shaped parts, it is possible to perform mounting operations at extremely high speeds. However, for parts with unusual shapes, the operation speed is slowed down to ensure that each mounting operation, such as suctioning the parts, adjusting the parts, rotating the parts according to the mounting direction, and mounting the parts on the printed circuit board, is performed more reliably. There is a need.

For this reason, even for standard-shaped parts, the speed of the mounting operation must be slowed down, resulting in an increase in takt time and a decrease in productivity.

In addition, when a large chip-type electronic component is mounted, the electronic component 5, which was initially mounted as shown in FIG. Misalignment may occur, such as. If the acceleration of the XY table is reduced in order to prevent this, there is a problem in that the tact time increases.

Means for Solving the Problems The technical means of the present invention for solving the above problems is to change the operating speed of the mounting head depending on the shape of the component to be mounted.

Function: With the above-described configuration, the present invention increases the operating speed of the mounting head when the mounted component has a standard shape, and increases the acceleration when starting and stopping the XY table, thereby increasing productivity. When the mounted part has a unique shape, the operation speed of the mounting head is slowed down! By reducing the acceleration of the J, XY table, or a combination of both, the reliability of each mounting operation is ensured, and the positional shift after mounting due to the inertia of the component itself is prevented.
In this way, it is possible to increase the speed of component mounting while maintaining high reliability.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

FIG. 1 shows an electronic component mounting apparatus to which the present invention is applied. In FIG. 1, 1 is a supply section for electronic components, 2 is a mounting head that picks up electronic components from the supply section and mounts them on a printed circuit board 3, and 4 is an X that positions the printed circuit board 3 at a predetermined position.
This is a Y table.

FIG. 3 is an example of a velocity waveform during positioning of the XY table. When the part has a standard shape, the acceleration is increased to shorten the time required for positioning, as shown in FIG. 3a. When a large, heavy component is mounted, the acceleration is reduced as shown in Figure 3 to prevent positional displacement due to the inertia of the component itself. FIG. 4 shows the operating speed of the mounting head and the magnitude of the acceleration of the XY table, which are allowed for six types of components A to E having different component shapes.

The operation of mounting the above-mentioned electronic components will be described below.

Table 1 Vl>V2>V3, α1>α2>α3 Figure 4 shows changes in the operating speed of the mounting head when mounting multiple parts of Table 1 in the order of A, B, C, D, and E. This shows the change in the magnitude of acceleration when the XY table starts and stops. In addition, in the figure, 7 to 11 indicate the respective mounting times of components A to E, respectively. The mounting head 2 picks up the component A from the component supply section 1 at a speed corresponding to ■1 in Table 1, adjusts the component at a speed corresponding to vl, and
The component is rotated at a speed corresponding to the mounting direction of the printed circuit board 3, and the component is mounted onto the printed circuit board 3 at a speed corresponding to (1). After the component mounting, the printed circuit board 3 is positioned by the XY table 4 to the mounting position of the next component at an acceleration α1 at the time of starting and stopping (see mounting time 7 of component A in FIG. 4). Thereafter, the mounting of component A is repeated. When mounting component B following component A, the operating speed of the mounting head 2 is changed to 2 in Table 1.

The mounting head 2 picks up the component B at a speed corresponding to v2,
Mounting operations such as alignment, rotation according to the mounting direction, and mounting on the printed circuit board 3 are performed (see mounting time 8 of component B in FIG. 4). For component C, the operating speed of mounting head 2 is again v
l, and each operation of the implementation is performed at a speed corresponding to vl.

When the first component C is mounted, the acceleration of the XY table 4 when it starts and stops is changed to α2 (see mounting time 9 for component C in FIG. 4). Thereafter, the mounting of the component E is also carried out by switching the speed of each mounting operation and the magnitude of the XY child table acceleration depending on the shape of each (Mounting time of the component E in Figure 4 10.Mounting time of the component E) (see 11)
.

As described above, according to this embodiment, by providing the function of varying the operating speed of the mounting head and the function of changing the acceleration of the XY child table, it is possible to reliably attract, align, and mount parts of different shapes and masses. Each mounting operation such as rotation according to the direction and mounting on a printed circuit board is performed, and it is possible to speed up component mounting while preventing positional shift due to inertia of the component itself.

Figure 5 shows the changes in the operating speed of the mounting head and the magnitude of the acceleration when starting and stopping the XY child table when the parts listed in Table 1 are mounted in the order of A, C, B, D, and E. It is. In the figure, 12 to 16 are parts A and C, respectively.
, B, D, and H. When mounting component C, the acceleration when starting and stopping the XY child table is α2 (see mounting time B for component C in FIG. 5). Next time component B is mounted, the XY child table acceleration should be changed (see mounting time 14 for component B in FIG. 5). This is because the XY child table acceleration can be α1 for component B, but in order to prevent the position shift of component C that has already been mounted,
This is because the child table acceleration cannot be greater than α2 allowed for part B.

Table 2: α1>α2>α3 Table 4: Table 5: Allowable XY table speed is α3 Table 6: Tables 2 to 6 are cases where the mounting order rearrangement function is used. When the components are mounted in the order of the program (hereinafter referred to as the NC program) that records the mounting position, mounting direction, mounting order, etc. on the printed circuit board, as shown in the second example, the components that have already been mounted The XY child table acceleration is limited by . Therefore, the allowed XY
If a component with a small child table acceleration is mounted first, the acceleration of the r' pull will remain small thereafter, resulting in a problem of low productivity. Therefore, the above-mentioned problem can be improved by mounting the components in the order of the allowable acceleration αn of the xY table, rather than in the order of the NC program. For example, parts A, C, B, and D in Table 1 in an NC program.

If component B is mounted in this order, the XY child table acceleration when component B is mounted becomes α2.

Using the sorting function that compares the allowable XY table acceleration αn, if A, B, C, D, and E are mounted in the order, the XY child table acceleration when mounting B component will be α1, and the mounting will be faster than when not sorted. It is possible to aim for Table 2 shows an example of the order of implementation in the NC program, Tables 3 to 5 show the process of sorting Table 2, and Table 6 sorts Table 2 in order of allowable ruled table acceleration. It is something that

Effects of the Invention As described above, the present invention uses a mounting head whose moving body speed is variable and an XY child table whose acceleration at startup and stop is variable, so that components can be mounted at an optimal speed depending on the shape of the component. This makes it possible to perform each mounting operation reliably and to prevent positional displacement of components after mounting.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus which is an embodiment of the present invention, FIGS. Figure 3 (a
), Cb) are diagrams showing the moving speed of the XY child table, and Figures 4 and 5 show the operating speed of the mounting head when mounting parts and changes in the magnitude of acceleration when starting and stopping the XY child table. FIG. 1...Component supply department, 2...Mounting head, 3...Printed circuit board, 4...XY child table Name of agent Patent attorney Satoshi Nakao Man and 1 other personFigure 1 1-Shizuka? Oral tradition cadre 2 - 11 feelings - the old man, 1 - 7' son μ lack of nutrition

Claims (3)

[Claims] (1) a supply means for supplying electronic components; a table that holds a printed circuit board and is movable in a plane; and a table capable of adsorbing electronic components from the supply means and mounting them on the printed circuit board;
and an electronic component mounting apparatus having a mounting head whose operating speed is variable depending on the mass or shape and size of the electronic component. (2) The electronic component mounting apparatus according to claim 1, wherein the table is a table in which acceleration at startup and deceleration at stop are variable. (3) The electronic component mounting apparatus according to claim 2, wherein the table is provided with electronic components selected in advance such that acceleration and deceleration are gradually lowered.