JPH03179800A - Component mounting method - Google Patents

Abstract

PURPOSE:To enable various types of components to be mounted at a high speed by a method wherein component feed sections are previously arranged at the same space with mounting heads, and part feed sections possessed of component common to the mounting heads are arranged. CONSTITUTION:First of all, components of the same type (feed sections 7, 8) are taken out by mounting heads 2 and 3 and mounted on printed wiring boards 5 and 6. Then, a component is taken out from a feed section 9 by the mounting head 2 and mounted on the board 5. At this point, the mounting head 3 is not put in a take-out operation. The same as the above-mentioned, a component is taken out from the feed section 9 by the mounting head 3 and mounted on the printed board 6. At this point, the mounting head 2 is not put in a take-out operation.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a component mounting method that increases the number of types of components that can be mounted.

BACKGROUND OF THE INVENTION In recent years, there has been a demand for electronic component mounting machines that are fast and can mount a wide variety of components.

Hereinafter, the above-mentioned conventional electronic component mounting machine will be described with reference to the drawings.

In Fig. 2, 1 is a component supply section that sets parts to be mounted, 2 and 3 are mounting heads that take out components from the component supply section and mount the components on the object to be mounted, and 4 moves the object to the mounting position. 5.6 is a printed circuit board to be mounted.

The operation of the electronic component mounting machine that has been bottomed out as described above will be described below.

1. Based on the program, the printed circuit board 6.6 on the cheap mounting section 4 is moved to the mounting position.

At the same time, the designated component to be mounted is moved to the take-out position by the component supply section 1, and taken out by the mounting head section 2-3. The parts to be mounted taken out by the mounting head section 2.3 are simultaneously mounted onto a printed circuit board 5.6 which is an object to be mounted. Repeat this according to the program.

Problems to be Solved by the Invention However, with the above-mentioned electronic component mounting machine, the production time per printed circuit board can be cut in half compared to an electronic component mounting machine with one mounting head; Since the number of types of components that can be mounted on the electronic component mounting unit is halved, two electronic component mounting machines are required when mounting more types of components than there are in the component supply section. Alternatively, the same electronic component mounting machine has to be used to mount the electronic components again, making it impossible to mount a wide variety of components at high speed.

In view of the above-mentioned problems, the present invention provides a high-speed, multi-product mounting machine for electronic components.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a first step in which component supply sections are arranged in advance at intervals equal to the intervals between each mounting head, and a step in which each mounting head shares a second step in which a shared component supply section having components to be taken out is arranged, and a second step in which each mounting head simultaneously takes out a predetermined component from each component supply section and simultaneously mounts it on each board when the component is not a shared component. 3 steps, in the case of shared parts, a 4th step in which one mounting head takes out the component from the shared component supply section and mounts it on a predetermined board, and this 4th step is sequentially repeated with other mounting heads. It has a fifth step.

Effects According to the present invention, with the above configuration, by providing a shared supply section and an individual supply section, it is possible to mount a wide variety of components at high speed.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1, 3, and 4.

In FIG. 3, reference numeral 7 denotes a supply section for taking out parts from the mounting head section 2, and numeral 8 denotes a supply section for taking out parts from the mounting head section 3. In this case, the type of parts is 10% of the parts supply section.
It is. If the type of printed circuit board parts to be produced is less than 10% of the parts supplied by the component supply unit, supply unit 7. The supply section 8 is loaded with parts of exactly the same type, and the mounting head 2. At the same time, the mounting head 3 takes out the printed circuit board 5. It is mounted on the printed circuit board 6.

When the number of types of parts of printed circuit boards to be produced is as large as % of the number of parts in the parts supply section 1, as shown in FIG. It is divided into a supply section 8 from which parts are taken out at the mounting head section 3 and a supply section 9 from which parts can be taken out at either the mounting head section 2 or the mounting head section 3.

1. First, parts of the same type (supply section 7, supply section 8) are placed in the mounting head section 2. At the same time, the mounting head section 3 takes out the printed circuit board 6. It is mounted on the printed circuit board 6. Thereafter, the mounting head 2 takes out the components from the supply section 9 and mounts them on the printed circuit board 6.

At this time, the mounting head section 3 does not perform a take-out operation.

Similarly, the mounting head section 3 takes out components from the supply section 9 and mounts them on the printed circuit board 6. At this time, the mounting head section 2 does not perform a take-out operation.

Repeat this according to the program.

As described above, by dividing the parts into parts that are taken out from a common supply section and mounted at the same time and parts that are taken out from the common supply part using individual mounting heads, it is possible to perform high-speed mounting of a wide variety of products.

Effects of the Invention As described above, the present invention provides a component mounting method in which the component supply section includes a shared supply section and an individual supply section.
A wide variety of parts can be mounted at high speed.

[Brief explanation of drawings]

FIG. 1 is a flowchart of a component mounting method in an embodiment of the present invention, FIG. 2 is a perspective view of an electronic component mounting machine, and FIG.
The figure shows the constituent countries of a conventional parts supply department, and FIG. 4 shows the constituent countries of a parts supply department in an embodiment of the present invention. 2.3... Mounting head section? , 8.9...
...Supply department.

Claims (1)

[Claims] In a component mounting method in which components are respectively taken out from a plurality of component supply sections using a plurality of mounting heads and mounted on a predetermined board, a first method in which the component supply sections are arranged in advance at intervals equal to the intervals between the respective mounting heads. and a second step in which a common parts supply section having parts shared by each mounting head is arranged, and when the parts are not shared, each mounting head simultaneously takes out predetermined parts from each component supply section. , a third step in which components are mounted on each board at the same time, and a fourth step in which, in the case of shared components, a component is taken out from a shared component supply section using one mounting head and mounted on a predetermined board; and a fifth step of sequentially repeating using other mounting heads.