JPS6334810A - Making of electronic part - Google Patents
Making of electronic partInfo
- Publication number
- JPS6334810A JPS6334810A JP17688486A JP17688486A JPS6334810A JP S6334810 A JPS6334810 A JP S6334810A JP 17688486 A JP17688486 A JP 17688486A JP 17688486 A JP17688486 A JP 17688486A JP S6334810 A JPS6334810 A JP S6334810A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- terminal
- weight
- copper
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000007747 plating Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
Landscapes
- Contacts (AREA)
- Non-Insulated Conductors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Of Switches (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、樹脂製のボディから端子が突出したような
電子部品の製法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method of manufacturing an electronic component having a terminal protruding from a resin body.
リレーやスイッチ等の電子部品は、そのボディから突出
する端子（接触子）を半田付けすることにより、プリン
ト配線板等に搭載されることがある。この端子は、その
半田付は性をよくするために、従来は、端子となる材料
にあらかじめすず一鉛系の半田をめっきしておき、リレ
ーやスイッチ等の電子部品の樹脂製ボディを成形すると
同時に、ボディに端子材料を埋め込むことによりボディ
と一体化されることがある。Electronic components such as relays and switches are sometimes mounted on printed wiring boards and the like by soldering terminals (contactors) that protrude from their bodies. In order to improve the soldering properties of these terminals, conventionally, the terminal material was plated with tin-lead solder in advance, and the resin bodies of electronic components such as relays and switches were molded. At the same time, it may be integrated with the body by embedding terminal material in the body.
ところが、すず−鉛系の半田は、融点が低く１、同時成
形時に樹脂の成形熱のために半田が溶けてしまい、溶け
た部分においてでボディと端子の基部との間に隙間が生
じ電子部品のシール性が悪くなるという問題があった。However, tin-lead solder has a low melting point (1), and during simultaneous molding, the solder melts due to the heat of molding the resin, creating a gap between the body and the base of the terminal at the melted part, which can cause damage to electronic components. There was a problem that the sealing performance of the
この問題を解決するために、鉛の含有量を減らして半田
の融点を上げようとすると、すずのウィスカ（ホイスカ
）が発生するという問題が生じるので、樹脂中に埋め込
まれる部分のみをマスキングして半田めっきを行うか、
小さくてマスキングが不可能な場合などには半田めっき
を全くせずに同時成形を行・）ことが行われている。こ
れらの方法では、シール性が悪くなるという問題がなく
なるのであるが、マスキングを行う方法では、半田めっ
きの作業工程が複雑となる問題があり、半田めっきをし
ない場合には、電子部品をプリント配線板などに搭載す
る時に半田付は性が悪いと言う問題があった。In order to solve this problem, if we try to reduce the lead content and raise the melting point of the solder, the problem of tin whiskers will occur, so we mask only the part that will be embedded in the resin and solder. Do plating or
If the product is too small to be masked, simultaneous molding is performed without any solder plating. These methods eliminate the problem of poor sealing performance, but the masking method has the problem of complicating the solder plating process, and if solder plating is not used, electronic components cannot be printed with printed wiring. There was a problem that soldering was poor when mounting it on a board or the like.
この発明は、このような事情に鑑みて、同時成形しても
ボディと端子の基部とのシール性がよ（、しかも、ウィ
スカの問題もない電子部品の製法を提供することを目的
としている。In view of these circumstances, it is an object of the present invention to provide a method for manufacturing an electronic component that provides good sealing between the body and the base of the terminal even when molded simultaneously (and is free from whisker problems).
この発明は、このような目的を達成するために、樹脂製
のボディから端子が突出した電子部品を同時成形で得る
にあたり、前記端子として、これを構成する端子素材の
表面を、すずが３０〜９５重量％含まれる銅−すず系合
金によってめっきしたものを用いることを特徴とする電
子部品の製法を要旨としている。In order to achieve such an object, the present invention provides an electronic component in which a terminal protrudes from a resin body by simultaneous molding. The gist of this invention is a method for manufacturing electronic parts, characterized by using parts plated with a copper-tin alloy containing 95% by weight.
以下に、この発明の詳細な説明する。The present invention will be explained in detail below.
銅−すず系合金には、ニッケルを含有するものも含まれ
る。Copper-tin alloys include those containing nickel.
めっきされる合金中のずずの量は、３０〜９５重量％、
好ましくは、５０〜６０重量％であれば、半田付は性が
よく、すずのウィスカが発生することがない。しかも、
同時成形してもボディへの端子の埋込部のシール性が保
持できる。なお、５０〜６０笛量％の場合、その融点は
、４００〜６００℃となる。The amount of tin in the alloy to be plated is 30-95% by weight,
Preferably, when the content is 50 to 60% by weight, soldering properties are good and tin whiskers are not generated. Moreover,
Even when molded simultaneously, the sealing properties of the terminal embedded in the body can be maintained. In addition, in the case of 50 to 60% by weight, the melting point is 400 to 600°C.
一方、３０笛量％未満であると、酸化され変色しやすく
、しかも、半田付は性がわるい。つまり、ぬれ性が劣る
。９５重量％を越えると、すずのウィスカが発生する。On the other hand, if the amount is less than 30%, it will be easily oxidized and discolored, and the soldering properties will be poor. In other words, the wettability is poor. If it exceeds 95% by weight, tin whiskers will occur.
めっきは、通常の合金めっき法により行うことができる
。Plating can be performed by a normal alloy plating method.
端子素材としては、銅、銅−亜鉛系合金など、導電性の
良好なものであれば、特に限定されない。成形等、その
他の工程は通常のとおりに行われる。The terminal material is not particularly limited as long as it has good conductivity, such as copper or copper-zinc alloy. Other processes such as molding are performed as usual.
つぎに、実施例を説明する。Next, an example will be explained.
（実施例１）
銅−亜鉛系のフープ材の表面に亜鉛の移行防止のために
、厚み１μｍのニッケルめっきを施した。このフープ材
の端子部となる部分に５０重量％のすずを含む銅−すず
合金を電気めっきした。この端子部をボディの成形型に
入れ、ボディを同時成形し、リレーを作製した。(Example 1) The surface of a copper-zinc hoop material was plated with nickel to a thickness of 1 μm in order to prevent zinc migration. A copper-tin alloy containing 50% by weight of tin was electroplated on the portion of this hoop material that would become the terminal portion. This terminal part was put into a mold for the body, and the body was simultaneously molded to create a relay.
（実施例２）
すずの含有量を３０重量％とじた以外は、実施例１と同
様にしてリレーを作製した。(Example 2) A relay was produced in the same manner as in Example 1 except that the tin content was reduced to 30% by weight.
（実施例３）
すずの含有量を９５重量％とした以外は、実施例１と同
様にしてリレーを作製した。(Example 3) A relay was produced in the same manner as in Example 1 except that the tin content was 95% by weight.
（比較例１）
すずの含有量を２０重量％とじた以外は、実施例１と同
様にしてリレーを作製した。(Comparative Example 1) A relay was produced in the same manner as in Example 1 except that the tin content was reduced to 20% by weight.
（比較例２）
すずの含有量を９７重量％とした以外は、実施例１と同
様にしてリレーを作製した。(Comparative Example 2) A relay was produced in the same manner as in Example 1 except that the tin content was 97% by weight.
（比較例３）
鉛の含有量が１５重目％のすず一鉛半田をめっきした以
外は、実施例１と同様にしてリレーを作製した。(Comparative Example 3) A relay was produced in the same manner as in Example 1, except that tin-lead solder having a lead content of 15% by weight was plated.
以上の実施例および比較例で得たリレーの端子部のシー
ル性の良否、ウィスカの有無、および、耐食性について
特性を凋査し、その結果を第１表に示した。The properties of the terminal portions of the relays obtained in the above Examples and Comparative Examples were examined in terms of sealability, presence or absence of whiskers, and corrosion resistance, and the results are shown in Table 1.
第 １ 表
第１表から明らかなように、実施例で得たリレーは、い
ずれも各特性が良好であった。Table 1 As is clear from Table 1, all the relays obtained in the Examples had good characteristics.
この発明にかかる電子部品の製法は、上記実施例に限定
されない。The method for manufacturing an electronic component according to the present invention is not limited to the above embodiments.
実施例では、ニッケルを下地としてめっきしていたが、
端子素材が亜鉛を含まないものであれば、なくても構わ
ない。In the example, plating was performed using nickel as the base, but
If the terminal material does not contain zinc, it is not necessary.
この発明の電子部品の製法は、以上のように、樹脂製の
ボディから端子が突出した電子部品を同時成形で得るに
あたり、前記端子として、これを構成する端子素材の表
面を、すずが３０〜９５重量％含まれる銅−すず系合金
によってめっきしているので、ボディと端子の基部との
シール性がよく、しかも、ウィスカの問題もない。As described above, in the method for manufacturing an electronic component of the present invention, when an electronic component in which a terminal protrudes from a resin body is obtained by simultaneous molding, the surface of the terminal material constituting the terminal is coated with tin of 30 to 30% tin. Since it is plated with a copper-tin alloy containing 95% by weight, the sealing properties between the body and the base of the terminal are good, and there is no problem with whiskers.
代理人 弁理士 松 本 武 彦 ａ１−Agent: Patent Attorney Takehiko Matsumoto a1-
Claims (1)
時成形で得るにあたり、前記端子として、これを構成す
る端子素材の表面を、すずが３０〜９５重量％含まれる
銅−すず系合金によってめっきしたものを用いることを
特徴とする電子部品の製法。(1) When obtaining an electronic component with a terminal protruding from a resin body by simultaneous molding, the surface of the terminal material constituting the terminal is made of a copper-tin alloy containing 30 to 95% by weight of tin. A method for manufacturing electronic parts characterized by using plated parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17688486A JPS6334810A (en) | 1986-07-28 | 1986-07-28 | Making of electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17688486A JPS6334810A (en) | 1986-07-28 | 1986-07-28 | Making of electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6334810A true JPS6334810A (en) | 1988-02-15 |
Family
ID=16021448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17688486A Pending JPS6334810A (en) | 1986-07-28 | 1986-07-28 | Making of electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6334810A (en) |
-
1986
- 1986-07-28 JP JP17688486A patent/JPS6334810A/en active Pending
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