JPH03225947A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH03225947A JPH03225947A JP2101690A JP2101690A JPH03225947A JP H03225947 A JPH03225947 A JP H03225947A JP 2101690 A JP2101690 A JP 2101690A JP 2101690 A JP2101690 A JP 2101690A JP H03225947 A JPH03225947 A JP H03225947A
- Authority
- JP
- Japan
- Prior art keywords
- plating film
- tin
- plated film
- palladium
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WDHWFGNRFMPTQS-UHFFFAOYSA-N cobalt tin Chemical compound [Co].[Sn] WDHWFGNRFMPTQS-UHFFFAOYSA-N 0.000 claims abstract description 22
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000007747 plating Methods 0.000 claims description 86
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 44
- 229910052763 palladium Inorganic materials 0.000 claims description 22
- 229910000531 Co alloy Inorganic materials 0.000 claims description 20
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 19
- 238000005260 corrosion Methods 0.000 abstract description 23
- 230000007797 corrosion Effects 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 28
- 229910052759 nickel Inorganic materials 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は耐蝕性に優れるリードフレームに関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a lead frame with excellent corrosion resistance.
（従来の技術）
パラジウムめっき皮膜は、ワイヤポンディング性もよく
、またはんだ付は性にも優れるので、リードフレームの
外装めっきとして有利である。すなわち、リードフレー
ムのインナーリードに対するワイヤボンディング性を向
上させるため、インナーリードに金または銀を部分めっ
きするものにおいては、アウターリードのはんだ付は性
を向上させるため、樹脂封止後にアウターリードにめっ
きあるいは浸漬のウェットプロセスによりはんだ皮膜を
形成するようにしているが、パラジウムめっき皮膜をあ
らかじめ全面に形成しておけば、樹脂封止後におけるウ
ェットプロセスが必要なくなるので、湿気の侵入などが
防止でき、信頼性の高い半導体装置を提供できる利点が
ある。(Prior Art) Palladium plating has good wire bonding properties and excellent soldering properties, so it is advantageous as an exterior plating for lead frames. In other words, in order to improve the wire bondability to the inner leads of the lead frame, the inner leads are partially plated with gold or silver, and in order to improve the soldering properties of the outer leads, the outer leads are plated after resin sealing. Alternatively, the solder film is formed by a wet process of dipping, but if a palladium plating film is formed on the entire surface in advance, there is no need for a wet process after resin sealing, which prevents moisture from entering. This has the advantage of providing a highly reliable semiconductor device.
このようにパラジウムめっき皮膜は優れた特性を有し、
リードフレームの外装めっき皮膜として有用であるが、
リードフレーム素材との間で電位差を有するので、素材
金属の耐蝕性に問題があった。In this way, palladium plating film has excellent properties,
It is useful as an exterior plating film for lead frames, but
Since there is a potential difference between the metal and the lead frame material, there was a problem with the corrosion resistance of the metal material.
そこでこの耐蝕性を向上させるため、従来においては、
特公昭６３−４９３８２号公報に示されるように素材金
属とパラジウムめっき皮膜との間にニッケルめっき皮膜
を介在させるか、または米国特許公報４６２８１６５号
に示されるように、パラジウム−ニッケルあるいはパラ
ジウム−コバルトの合金めっき皮膜を介在させるように
してい（発明が解決しようとする課題）
しかしながら上記従来の方法には次のような問題点があ
る。Therefore, in order to improve this corrosion resistance, conventionally,
As shown in Japanese Patent Publication No. 63-49382, a nickel plating film is interposed between the raw metal and the palladium plating film, or as shown in US Pat. No. 4,628,165, palladium-nickel or palladium-cobalt is used. However, the conventional method described above has the following problems.
すなわち、ニッケルめっき皮膜を介在させるときは、ニ
ッケルめっき皮膜はそれ程緻密でなく、多少ともポーラ
スであることから、素材金属と外装めっきのパラジウム
めっき皮膜との間に電気的通路が形成され、したがって
耐蝕性が不十分となる。この場合にニッケルめっき皮膜
を例えば３μｍ程度に厚く形成すれば耐蝕性は比較的解
消されるが、ニッケルめっき皮膜は非常に硬いため、ア
ウターリードの折り曲げによりめっき皮膜にクランクが
発生し、これにより耐蝕性が阻害される。In other words, when a nickel plating film is interposed, since the nickel plating film is not very dense and is more or less porous, an electrical path is formed between the material metal and the palladium plating film of the exterior plating, and therefore corrosion resistance is improved. Sexuality becomes insufficient. In this case, if the nickel plating film is formed thickly, for example, about 3 μm, the corrosion resistance will be relatively eliminated, but since the nickel plating film is very hard, bending the outer lead will cause a crank in the plating film, which will reduce the corrosion resistance. Sexuality is inhibited.
このため高価なパラジウムを用いたパラジウムめっき皮
膜を厚くして耐蝕性を向上させる必要がありコストが高
くなるという問題点がある。For this reason, it is necessary to increase the thickness of the palladium plating film using expensive palladium to improve the corrosion resistance, resulting in an increase in cost.
また中間めっき層としてパラジウム−ニッケルあるいは
パラジウム−コバルトの合金めっき皮膜を介在させると
きは、耐蝕性を向上させることができるが、これらの高
価なパラジウムを含むめっきはコストが高くなるという
問題点を有する。Furthermore, when a palladium-nickel or palladium-cobalt alloy plating film is interposed as an intermediate plating layer, corrosion resistance can be improved, but these platings containing expensive palladium have the problem of increasing costs. .
そこで本発明は上記問題点を解消すべくなされたもので
、その目的とするところは、コスト的にも安く、かつ耐
蝕性にも優れるリードフレームを提供するにある。The present invention has been made to solve the above problems, and its purpose is to provide a lead frame that is low in cost and has excellent corrosion resistance.
（課題を解決するための手段）
上記目的による本発明では、パラジウムめっき皮膜を外
装めっき皮膜とするリードフレームにおいて、パラジウ
ムめっき皮膜の下地に錫−ニッケル合金めっき皮膜また
は錫−コバルト合金めっき皮膜を形成したことを特徴と
している。(Means for Solving the Problems) In the present invention according to the above object, in a lead frame having a palladium plating film as an exterior plating film, a tin-nickel alloy plating film or a tin-cobalt alloy plating film is formed on the base of the palladium plating film. It is characterized by what it did.
（作用）
錫−ニッケル合金めっき皮膜または錫−コバルト合金め
っき皮膜はニッケルめっき皮膜に比して緻密であるので
、素材金属と外装めっきのパラジウムめっき皮膜との間
の電気的通路がなくなり、パラジウムめっき皮膜の厚さ
を薄＜シても素材金属の腐蝕を有効に防止できる。また
錫−ニッケル合金めっき皮膜または錫−コバルト合金め
っき皮膜を厚付けしなくとも十分に腐蝕防止の効果があ
るから、めっき皮膜にクランクを発生させることなく、
アウターリードの折り曲げが行なえる。(Function) Since the tin-nickel alloy plating film or the tin-cobalt alloy plating film is denser than the nickel plating film, there is no electrical path between the raw metal and the palladium plating film of the exterior plating, and the palladium plating film Corrosion of the raw metal can be effectively prevented even if the thickness of the film is reduced. In addition, since the tin-nickel alloy plating film or the tin-cobalt alloy plating film is sufficiently effective in preventing corrosion without having to thicken it, it can be used without causing cranking in the plating film.
The outer lead can be bent.
（実施例） 以下に添付図面に基づいて実施例を詳細に説明する。(Example) Embodiments will be described in detail below based on the accompanying drawings.
本実施例では、第１図に示すように、リードフレーム１
０の全面にまず錫−ニッケル合金めっき皮膜または錫−
コバルト合金めっき皮膜１２を形成し、この錫−ニッケ
ル合金めっき皮膜または錫コバルト合金めっき皮膜１２
上に外装めっきとしてパラジウムめっき皮膜１４を形成
する。In this embodiment, as shown in FIG.
First, tin-nickel alloy plating film or tin-
A cobalt alloy plating film 12 is formed, and this tin-nickel alloy plating film or tin-cobalt alloy plating film 12 is formed.
A palladium plating film 14 is formed thereon as exterior plating.
リードフレーム１０素材としては、銅、銅合金、４２７
０イ（鉄−ニッケル合金）などを用いる。The lead frame 10 material is copper, copper alloy, 427
0i (iron-nickel alloy) etc. are used.
外装めっきのパラジウムめっき皮膜１４の厚さは特に限
定されないが、インナーリードにおけるワイヤポンディ
ング性、アウターリードにおけるはんだ付は性を考慮し
て決定され、０．０３μｍ〜０．５μｍ、通常０．１ｔ
Ｉｍ程度で十分である。The thickness of the palladium plating film 14 of the exterior plating is not particularly limited, but the wire bonding properties of the inner leads and the soldering properties of the outer leads are determined in consideration of the properties, and are 0.03 μm to 0.5 μm, usually 0.1 t.
About Im is sufficient.
錫−ニッケル合金めっき皮膜または錫−コバルト合金め
っき皮膜１２の厚さは０．１８ｍ〜１．５μｍ、好まし
くは０．３ μｍ〜０．７ μｍとする。錫ニッケル合
金めっき皮膜または錫−コバルト合金めっき皮膜はニッ
ケルめっき皮膜に比して緻密であり、錫−ニッケル合金
めっき皮膜または錫−コバルト合金めっき皮膜１２を介
在させることによって、リードフレーム１０とパラジウ
ムめっき皮膜１４との間に直接的な電気的通路がなくな
り、もって素材金属の腐蝕を防止でき、耐蝕性が向上す
るのである。腐蝕を防止する上で、錫−ニッケル合金め
っき皮膜または錫−コバルト合金めっき皮膜１２の厚さ
は前記のように最低でも０．１ μｍ、好ましくは０．
３μｍ以上とする。一方、錫−ニッケル合金めっき皮膜
あるいは錫−コバルト合金めっき皮膜１２の硬度はニッ
ケルめっき皮膜と同様に高い。したがって錫−ニッケル
合金めっき皮膜または錫−コバルト合金めっき皮膜１２
の厚さをあまり厚くするとリードフレーム１０のアウタ
ーリードの折り曲げ加工の際にめっき皮膜にクラックが
入るおそれがあるので、錫−ニッケル合金めっき皮膜ま
たは錫−コバルト合金めっき皮膜１２の厚さの上限を１
．５ μｍとする。このようなめっき厚であっても、ニ
ッケルめっき皮膜であれば外層めっきのパラジウムめっ
き皮膜を０゜５μｍ程度以上の厚さにしなければ耐蝕性
が不十分であったが、錫−ニッケル合金めっき皮膜また
は錫−コバルト合金めっき皮膜１２とすることで、パラ
ジウムめっき皮膜の厚さを０．１ μｍ程度と薄くシて
も素材金属の腐蝕を十分に防止できる。The thickness of the tin-nickel alloy plating film or the tin-cobalt alloy plating film 12 is 0.18 m to 1.5 μm, preferably 0.3 μm to 0.7 μm. The tin-nickel alloy plating film or the tin-cobalt alloy plating film is denser than the nickel plating film, and by interposing the tin-nickel alloy plating film or the tin-cobalt alloy plating film 12, the lead frame 10 and the palladium plating film can be bonded. There is no direct electrical path between the material and the coating 14, thereby preventing corrosion of the raw metal and improving corrosion resistance. In order to prevent corrosion, the thickness of the tin-nickel alloy plating film or the tin-cobalt alloy plating film 12 should be at least 0.1 μm, preferably 0.1 μm, as described above.
The thickness shall be 3 μm or more. On the other hand, the hardness of the tin-nickel alloy plating film or the tin-cobalt alloy plating film 12 is as high as that of the nickel plating film. Therefore, the tin-nickel alloy plating film or the tin-cobalt alloy plating film 12
If the thickness of the tin-nickel alloy plating film or the tin-cobalt alloy plating film 12 is too thick, cracks may occur in the plating film when bending the outer leads of the lead frame 10. 1
．． The diameter shall be 5 μm. Even with such a plating thickness, a nickel plating film would have insufficient corrosion resistance unless the outer layer palladium plating film was approximately 0.5 μm or more thick, but a tin-nickel alloy plating film Alternatively, by using the tin-cobalt alloy plating film 12, corrosion of the raw metal can be sufficiently prevented even if the thickness of the palladium plating film is as thin as about 0.1 μm.
表１に比較例と実施例の耐蝕性のデータを示す。Table 1 shows corrosion resistance data for Comparative Examples and Examples.
表１ （試験条件：塩水噴霧テスト ８Ｈ ） 第２図は他の実施例を示す。Table 1 (Test conditions: salt spray test 8H ) FIG. 2 shows another embodiment.
本実施例では、リードフレーム１０と錫−ニッケル合金
めっき皮膜または錫−コバルト合金めっき皮膜１２との
間にさらにニッケルめっき皮膜１６を介在させている。In this embodiment, a nickel plating film 16 is further interposed between the lead frame 10 and the tin-nickel alloy plating film or the tin-cobalt alloy plating film 12.
本実施例ではニッケルめっき皮膜１６を介在させている
ので、錫−ニッケル合金めっき皮膜または錫−コバルト
合金めっき皮膜１２を若干薄くすることができる。ニッ
ケルめっき皮膜１６の厚さは０．２ μｍ〜０．５μｍ
程度とする。このとき、錫−ニッケル合金皮膜または錫
コバルト合金めっき皮膜１２の厚さを０．１ μｍ〜１
．５ μｍ、好適には０．１ μｍ〜０．３ μｍとす
る。In this embodiment, since the nickel plating film 16 is interposed, the tin-nickel alloy plating film or the tin-cobalt alloy plating film 12 can be made slightly thinner. The thickness of the nickel plating film 16 is 0.2 μm to 0.5 μm.
degree. At this time, the thickness of the tin-nickel alloy film or tin-cobalt alloy plating film 12 is set to 0.1 μm to 1 μm.
．． 5 μm, preferably 0.1 μm to 0.3 μm.
本実施例でも素材金属の腐蝕を防止でき、耐蝕性が向上
した。In this example as well, corrosion of the raw metal could be prevented and the corrosion resistance improved.
表２に耐蝕性のデータを示す。Table 2 shows the corrosion resistance data.
＝８
表２
（試験条件：塩水噴霧テス）４８Ｈ）
以上、本発明の好適な実施例について種々述べて来たが
、本発明は上述の実施例に限定されるのではなく、発明
の精神を逸脱しない範囲で多くの改変を施し得るのはも
ちろんである。=8 Table 2 (Test conditions: Salt water spray test) 48H) Various preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments, but is based on the spirit of the invention. Of course, many modifications can be made without departing from the scope.
（発明の効果）
以上のように本発明に係るリードフレームによれば、素
材金属の腐蝕を防止でき、耐蝕性に優れると共に、アウ
ターリードの折り曲げの際にめっき皮膜にクランクを発
生させるおそれを解消できた。また錫−ニッケル合金め
っき皮膜または錫コバルト合金めっき皮膜をパラジウム
めっきの下地に形成することで高価なパラジウムめっき
皮膜の厚さを大幅に薄くできるので、コストの低いリー
ドフレームを提供できるものである。(Effects of the Invention) As described above, according to the lead frame of the present invention, corrosion of the raw metal can be prevented and corrosion resistance is excellent, and the possibility of occurrence of cranks in the plating film when bending the outer lead is eliminated. did it. Furthermore, by forming a tin-nickel alloy plating film or a tin-cobalt alloy plating film on the base of palladium plating, the thickness of the expensive palladium plating film can be significantly reduced, so that a low-cost lead frame can be provided.
第１図および第２図はそれぞれリードフレームの部分断
面図を示す。
１０・ ・ ・リードフレーム、
１２・・・錫−ニッケル合金めっき皮膜、錫−コバルト
合金めっき皮膜、
１４・・・パラジウムめっき皮膜、
１６・・・ニッケルめっき皮膜。1 and 2 each show a partial cross-sectional view of a lead frame. 10... Lead frame, 12... Tin-nickel alloy plating film, tin-cobalt alloy plating film, 14... Palladium plating film, 16... Nickel plating film.
Claims (1)
ドフレームにおいて、 パラジウムめっき皮膜の下地に錫−ニッケ ル合金めっき皮膜または錫−コバルト合金めっき皮膜を
形成したことを特徴とするリードフレーム。[Claims] 1. A lead frame having a palladium plating film as an exterior plating film, characterized in that a tin-nickel alloy plating film or a tin-cobalt alloy plating film is formed on the base of the palladium plating film. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2101690A JPH03225947A (en) | 1990-01-31 | 1990-01-31 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2101690A JPH03225947A (en) | 1990-01-31 | 1990-01-31 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03225947A true JPH03225947A (en) | 1991-10-04 |
Family
ID=12043249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2101690A Pending JPH03225947A (en) | 1990-01-31 | 1990-01-31 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03225947A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0538019A3 (en) * | 1991-10-17 | 1994-03-09 | Shinko Electric Ind Co | |
| EP0621633A2 (en) * | 1993-04-10 | 1994-10-26 | W.C. Heraeus GmbH | Leadframe for integrated circuits |
-
1990
- 1990-01-31 JP JP2101690A patent/JPH03225947A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0538019A3 (en) * | 1991-10-17 | 1994-03-09 | Shinko Electric Ind Co | |
| EP0621633A2 (en) * | 1993-04-10 | 1994-10-26 | W.C. Heraeus GmbH | Leadframe for integrated circuits |
| EP0621633A3 (en) * | 1993-04-10 | 1995-01-11 | Heraeus Gmbh W C | Leadframe for integrated circuits. |
| US5486721A (en) * | 1993-04-10 | 1996-01-23 | W.C. Heraeus Gmbh | Lead frame for integrated circuits |
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