JPS6333907U - - Google Patents
Info
- Publication number
- JPS6333907U JPS6333907U JP12694786U JP12694786U JPS6333907U JP S6333907 U JPS6333907 U JP S6333907U JP 12694786 U JP12694786 U JP 12694786U JP 12694786 U JP12694786 U JP 12694786U JP S6333907 U JPS6333907 U JP S6333907U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cutting
- pellets
- stage
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12694786U JPS6333907U (ko) | 1986-08-20 | 1986-08-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12694786U JPS6333907U (ko) | 1986-08-20 | 1986-08-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6333907U true JPS6333907U (ko) | 1988-03-04 |
Family
ID=31021231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12694786U Pending JPS6333907U (ko) | 1986-08-20 | 1986-08-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6333907U (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007114331A1 (ja) * | 2006-04-04 | 2007-10-11 | Miraial Co., Ltd. | 薄板収納容器 |
JP2007281053A (ja) * | 2006-04-04 | 2007-10-25 | Miraial Kk | 薄板収納容器 |
KR20170094495A (ko) * | 2016-02-09 | 2017-08-18 | 가부시기가이샤 디스코 | 절삭 장치 |
JP2019055436A (ja) * | 2017-09-20 | 2019-04-11 | 株式会社ディスコ | 被加工物保持装置及び被加工物脱着方法 |
-
1986
- 1986-08-20 JP JP12694786U patent/JPS6333907U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007114331A1 (ja) * | 2006-04-04 | 2007-10-11 | Miraial Co., Ltd. | 薄板収納容器 |
JP2007281053A (ja) * | 2006-04-04 | 2007-10-25 | Miraial Kk | 薄板収納容器 |
KR20170094495A (ko) * | 2016-02-09 | 2017-08-18 | 가부시기가이샤 디스코 | 절삭 장치 |
JP2019055436A (ja) * | 2017-09-20 | 2019-04-11 | 株式会社ディスコ | 被加工物保持装置及び被加工物脱着方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6333907U (ko) | ||
JPH01129065U (ko) | ||
JPH0196287U (ko) | ||
JPH01238907A (ja) | 半導体組立治具 | |
JPH01175166U (ko) | ||
JPH031765U (ko) | ||
JPH02126733U (ko) | ||
JPS61201345U (ko) | ||
JPS645449U (ko) | ||
JPS6112378B2 (ko) | ||
JPH01153208U (ko) | ||
JPH01162244U (ko) | ||
JPH02146431U (ko) | ||
JPS6440505U (ko) | ||
JPS63145332U (ko) | ||
JPS57107039A (en) | Manufacture of semiconductor | |
JPS5811250U (ja) | レ−ザダイオ−ドペレツタイズ治具 | |
JPS62135432U (ko) | ||
JPS605117U (ja) | 半導体製造装置 | |
JPS6223448U (ko) | ||
JPS63132426U (ko) | ||
JPH02101707U (ko) | ||
JPS6237933U (ko) | ||
JPH0325233U (ko) | ||
JPH02126714U (ko) |