JPS6333886A - Photo-semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the malfunction of an integrated circuit due to optical incidence by fitting at least one light-intercepting plate among a plurality of semiconductor elements including one semiconductor element for light emission or light reception. CONSTITUTION:Output beams from a semiconductor laser 101 are taken out to the outside by an optical fiber 110. Only one light-intercepting plate 111 is used at that time, but wirings 202 passing in the light-intercepting plate 111 penetrates light-intercepting plates 201. An upper cover 206 hermetically seals the inside of a package by adhesives, and the inside of the package is filled with nitrogen. Accordingly, since the possibility of a malfunction due to beams is eliminated by the light-intercepting plate 111, elements are easily connected electrically by the wirings 202 shaped in the light-intercepting plate 201, and wire length can be shortened, high frequency is easily passed, the inside of the package can be filled with an inert gas, etc., selectively by employing the light-intercepting plates 111, 201, and the usage of the gas can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention incorporates a light emitting element such as a semiconductor laser or a light emitting diode, a light receiving element such as a PIN photodiode or an avalanche photodiode, a multiplexer, a demultiplexer, etc. Integrated circuit or disk IJ-
The present invention relates to a hybrid integrated circuit in which various electrical elements are mounted.

Prior Art FIG. 5 shows an example of the prior art. It is a hybrid configuration in which a GaAs semiconductor laser 5o1, a photodiode 503 for optical power monitoring, and an integrated circuit 50E5 using silicon are mounted on a package 507.
Each device is connected to each other or to wire bond pads 606 by gold or aluminum wires. The optical output of the semiconductor laser 501 is extracted to the outside through an optical fiber 609.

FIG. 6 shows another example of the prior art. Ga As
A photodiode 601 made of silicon or Ge is bonded onto an integrated circuit 602 using silicon.
An optical signal enters the photodiode 01 from an optical fiber 603.

Problems to be Solved by the Invention However, in the case of the above configuration, the semiconductor laser 50
The output light from 1 and the optical signal from the optical fiber (indicated by arrows in Fig. 6) are reflected or scattered by the semiconductor element and the top cover of the package (not shown in Fig. 5), and are integrated. There was a risk that the light would enter the circuits 505 and 602, generate holes and electrons, and cause malfunction. Furthermore, in the case of a long wire like the wire 510 in FIG.
High frequency signals pass through the street. Furthermore, when filling the inert gas to extend the life of the semiconductor laser 601, it was necessary to fill the entire inside of the package.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a light shielding plate between an electric element or integrated circuit and a light emitting or light receiving element, so that light does not pass through the electric element or integrated circuit. This prevents the light from entering the circuit.

Function According to the present invention, the risk of malfunction due to light is eliminated by the light shielding plate. Further, the wiring provided in the light shielding plate facilitates electrical wiring of the elements, and the length of the wire can be shortened, making it easier for high frequencies to pass through. Furthermore, the inside of the package can be selectively filled with an inert gas or the like using a light shielding plate, thereby reducing the amount of gas used.

Example FIG. 1 shows an embodiment of the present invention.

A semiconductor laser 101 is bonded onto a silicon plate 102. A monitor photodiode 103 is bonded onto an inclined table 104 as shown in FIG. A multiplexer 105 converts a plurality of input signals and sends a high-speed signal to the semiconductor laser 1o1. These elements and lead wires 106 are connected to the package 10.
It is electrically connected to the wiring 108 in 7 by a wire 109. The lead wire 106 and the wiring 108 are of a flat plate type that can handle high frequencies. The output light of the semiconductor laser 101 is extracted to the outside through an optical fiber 110. In this example, there is only one light shielding plate 111. The wiring 202 passing through this passes through the light shielding plate 201'i as shown in FIG. Further, the top lid 206 seals the inside of the package with an adhesive. The inside of the package is filled with nitrogen.

FIG. 3 shows parts of another embodiment of the invention.

The configuration is almost the same as the embodiment shown in FIGS. 1 and 2, and only the differences are shown in FIG. 3. As shown in the figure a, the light shielding plate 301 has notches 302, which are used to connect the elements 303 on both sides of the light shielding plate 3C)1 as shown in the same figure.
．． Wire with 304i wire 305. In addition, notch 30
The sides of 2 are coated with light-absorbing paint.

FIG. 4 is a top view of the third embodiment of the present invention before wire wiring. This embodiment constitutes an optical repeater, and the light incident on the photodiode 4o1 is converted into electricity, waveform-shaped and amplified by the waveform-shaping integrated circuit 402, and then converted into light again by the 7 semiconductor laser 403. It is emitted as 403 is an element in which photodiodes are monolithically integrated, and automatic light output intensity control can be performed using this element. Optical input and output are achieved by connecting optical fibers to an optical input section and an optical output section that are provided with a rod lens 405 and an optical connector 406.

In the above embodiments, there is no problem in using a light emitting diode, a semiconductor laser with an external modulator, a semiconductor laser incorporated in a dedicated package together with a monitoring light receiving element, or the like as the light emitting element. Further, there is no problem in using a lead wire other than a flat lead wire.

Moreover, when using a demultiplexer, a discriminator, etc. as an integrated circuit, there is no problem even if a similar configuration is used.

Effects of the Invention According to the present invention, it is possible to easily prevent malfunction of an integrated circuit due to light incidence, and therefore it is practically useful.

[Brief explanation of drawings]

FIG. 1 is a top view showing an optical semiconductor device according to an embodiment of the present invention, and FIG. 2 is a top view showing a semiconductor device according to another embodiment of the present invention. figure,
FIG. 4 is a top view of an optical semiconductor device according to a third embodiment of the present invention, and FIGS. 5 and 6 are diagrams showing conventional configuration examples. 101... Semiconductor laser, 103...
Photodiode, 109...Wire, 111
... Light shielding plate, 305 ... Wire. Name of agent: Patent attorney Toshio Nakao and one other person (o
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Claims (3)

[Claims] (1) An optical semiconductor device characterized in that at least one light shielding plate is installed between a plurality of semiconductor elements including at least one semiconductor element for light emission or light reception. (2) The optical semiconductor device according to claim 1, wherein the semiconductor elements are electrically connected to each other using a conductor provided through the light shielding plate. (3) Claim 1, characterized in that at least the semiconductor element for light emission is sealed by a light shielding plate, an outer wall, a bottom plate, and a top cover, and is placed in nitrogen or other inert gas. Or the optical semiconductor device according to item 2.