JPS6333832A - Photodetecting chip element and manufacture thereof - Google Patents

Abstract

PURPOSE:To improve the heat resistance of a color filter thereby to enable to thermal wire bonding to a spectral function element by using the color filter made of a polyimide resin which contains an organic pigment on the photodetecting surface of a chip element. CONSTITUTION:A chip element 10 on which color filters 3, 4 and 5 made of polymide resin which contains an organic pigment are formed on its photodetecting surface is connected by a thermal wire bonding method to an electric connection member. That is, the polyimide resin has high heat resistance and the organic pigment also has high heat resistance. Accordingly, the heat resistance for the color filters is improved sufficiently to withstand temperature conditions up to approx. 300 deg.C. Thus, it can endure against the working tempera ture conditions of a thermocompression bonding method or other thermal wire bonding method to thermally wire bond the element 10 having the filter.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention provides electrical connection of a chip element with a color filter attached to a light receiving surface by a wire bonding method involving heating such as a thermocompression bonding method or a thermosonic method. The present invention relates to a light-receiving chip element and a method of manufacturing the same.

(Prior Art) Conventionally, as a wire bonding method for semiconductor chip elements, a thermocompression bonding method, a thermosonic method, a laser method, an ultrasonic method, etc. have been used. Among these methods, the ultrasonic method uses an Al wire (aluminum wire) as a bonding wire and performs bonding using ultrasonic vibration, and therefore does not particularly require substrate heating. however,
In the ultrasonic method, the bonding wire is an Al wire, so there are cases where sufficient bonding strength cannot be obtained with the Al wire due to surface roughness, etc., and there are also problems such as the Al wire is prone to corrosion. be.

The other three methods are all bonding methods that involve heating. In the thermocompression method and thermosonic method, Au wire (gold wire) or Cu wire (copper wire) is used as the bonding wire.The thermocompression method uses heat and load, and the thermosonic method uses heat, load, and ultrasonic vibration to perform bonding. Both require substrate heating. The substrate heating temperature is 300 to 350°C in the case of the thermocompression bonding method, and 150 to 250°C in the case of the thermosonic method. In the case of the thermocompression bonding method, the temperature is higher than that of the thermosonic method, so it is not used much these days.

In addition, although the thermosonic method heats the substrate at a lower temperature than the thermocompression bonding method, it is only 150 to 250 degrees Celsius, and when the elements to be wire bonded are only silicon semiconductor chips, there are thermal problems. rarely occurs, but
When a member with poor heat resistance is attached to a semiconductor chip, there is a risk that the member may be deteriorated. Note that the laser bonding method performs wire bonding by irradiating a heating laser beam onto a bonding location, and is also a bonding method that involves heating.

On the other hand, as a color filter for a light-receiving element, an organic film color filter in which a dye substrate such as gelatin, casein, or polyvinyl alcohol is dyed with a dye has been proposed. A light receiving element having such an organic film color filter has the advantage that it can be constructed at low cost.

(Problems to be Solved by the Invention) If a light-receiving element having an organic film color filter as described above can be connected to an electrical connection member by a heating wire bonding method, a light-receiving device that is inexpensive and can be mounted in high density can be realized. It is believed that a chip element can be provided.However, conventional organic film color filters have poor heat resistance, and it has been impossible to use the heating wire bonding method that requires the above-mentioned working temperature conditions.In other words,
Conventional organic film color filters are formed by dyeing dyeing substrates such as gelatin, casein, or polyvinyl alcohol with dyes, but -a
In addition, these materials have poor heat resistance (the limit is around 140°C), and deteriorate at temperatures lower than the above-mentioned working temperature conditions, resulting in changes in the properties of color filters.

The present invention has been made in view of these points, and its purpose is to heat wire bonding a chip element having a color filter by using a highly heat-resistant color filter made of polyimide resin. It is an object of the present invention to provide a light-receiving chip element that can be electrically connected by a method and that can be mounted at low cost and with high density, and also to provide a method for manufacturing the same.

In the light-receiving chip element according to the present invention, in order to solve the above-mentioned problems, a color filter made of polyimide resin containing an organic pigment is used as the light-receiving surface of the light-receiving chip element. The chip element provided on the device is connected to an electrical connection member by a heated wire bonding method.

Further, the manufacturing method according to the merged invention includes a step of providing a color filter made of polyimide resin containing an organic pigment on the light-receiving surface of the wafer, and dicing the wafer provided with the color filter to form each chip element. The method includes the step of cutting the chip into pieces, and the step of connecting each chip element to an electrical connection member by a heated wire bonding method.

(Function) In the light-receiving chip element according to the present invention, a color filter made of polyimide resin containing an organic pigment is used as a color filter provided on the light-receiving surface of the chip element. Polyimide resin has higher heat resistance than the gelatin color substrate used in color filters, and organic pigments have higher heat resistance than conventionally used dyes. has been improved to 300℃
It can withstand temperature conditions up to a certain degree. For this reason, the working temperature condition of thermosonic method is 150℃.
It can easily withstand temperatures of ~250℃, and can withstand most of the working temperature conditions of thermocompression bonding and other heated wire bonding methods, making it possible to heat wire bonding of light-receiving chip elements with color filters. This is the result.

Further, in the manufacturing method according to the combined invention, a color filter made of polyimide resin containing an organic pigment is provided on the light-receiving surface of the wafer, and after the process of forming the color filter is completed, the wafer is diced. Since the wafer is cut into individual chip elements and each chip element is connected to an electrical connection member by a heating wire bonding method, the process of forming a color filter can be efficiently performed on a single wafer basis.

(Example) Preferred embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing the appearance of a light-receiving chip element according to an embodiment of the present invention. Tab portion 2 of lead frame 20
1, a chip element 10 is mounted. A plurality of bonding pad portions 7 are formed at the edge of the chip element 10.

One end of each bonding wire 30 is bonded to the bonding pad section 7. Further, the other end of each bonding wire 30 is bonded to the inner lead end portion 22 of the lead frame 20. As the bonding wire 30, for example, an Au wire (gold wire) is used. The lead frame 20 is the chip element 10
Both are housed in a ceramic package with a light-transmitting window or a transparent resin molded package, and outer leads (not shown) protruding from the outside of the package are electrically connected to the inner lead ends 22, respectively. It is something that will be done.

FIG. 2 is an explanatory diagram of a heating wire bonding process such as the thermosonic method. The bonding wire 30 wound around the wire spool 31 is attached to the clamper 3
2 and guided above the bonding pad section 7 via the capillary chip 33. Bonding wire 30 led out from capillary chip 33
A discharge electrode 34 is arranged near the. By performing electric discharge in an argon gas atmosphere, the lower end portion of the bonding wire 30 is heated, and a bonding ball 34 is formed as shown in FIG. 2(A). As described above, the bonding pad portion 7 made of an aluminum film is formed on the edge of the chip element 10.
The ball 3 in a molten state is attached to this bonding pad portion 7.
5, one end of the bonding wire 30 is bonded to the bonding pad portion 7, as shown in FIG. 2(b). At this time, the chip element 10 including the bonding pad section 7 is heated in advance so that the molten ball 35 and the bonding pad section 7 are well fused together. The other end of the bonding wire 30 is connected to the lead frame 2 as shown in FIG.
It is pressed against the inner lead end 22 at 0 and wedge bonded. Thereafter, as shown in FIG. 2(d), the bonding wire 30 is cut by the upward movement of the capillary chip 33, and wire bonding is completed. In such a bonding method, a molten metal ball 35 formed by electric discharge is pressed against the bonding pad section 7, or the chip element 10 is heated in advance, so that the color filter of the light receiving section is heated. is naturally heated, but since the color filter in the present invention is made of polyimide resin containing organic pigments, it is heat resistant up to about 300°C, and its optical properties will not change due to heat during bonding. do not have. The present inventors have confirmed that the optical characteristics of the color filter do not change under the heating conditions used during bonding in a normal semiconductor manufacturing process.

Figure 4 shows the chip element 1 to be heated wire bonded.
2 is a diagram illustrating a cross-sectional structure of 0. This light-receiving element is used as a white balance sensor for color video cameras, and it detects R (red light), G (green light), and B
A light receiving section 2 is formed on the surface of a silicon substrate 1 using a normal semiconductor manufacturing process.
A red filter 3, a green filter 4, and a blue filter 5 are respectively provided on the surface of the light receiving surface so as to cover the light receiving surface and the vicinity thereof. A top coat M6 is applied to the surface of each filter 3 to 5 to flatten the surface. A bonding pad portion 7 made of an aluminum film is exposed at the edge of the silicon substrate 1.

FIG. 5 is a diagram showing the manufacturing process for creating a color filter. Moreover, FIGS. 6 to 8 are explanatory diagrams of each process. Hereinafter, the manufacturing process of a light receiving element having a color filter will be explained with reference to these figures. still,
Each process in FIGS. 6 and 7 is performed on a single wafer, but the drawings show only one chip.

Further, in FIGS. 6 and 7, wiring is omitted.

(i) Color paste application, semi-curing process (6th
(See Figure (a)) First, heat-resistant color paste 8 for color filters is applied to the surface of silicon substrate 1 on which light-receiving elements are formed. At this stage, the silicon substrate 1 is being processed not in units of individual chips but in units of wafers. The heat-resistant color paste 8 consists of a solvent, an organic pigment insoluble in the solvent, and a polyimide precursor. When coating, the silicon substrate 1 on which the light-receiving element is formed is heated with N at 200°C.
After drying in two gases for 10 minutes, a small amount of the first color color paste 8 was dropped onto the silicon substrate 1, and then dried at 500 r using a spinner (for example, IH-DS type manufactured by Mikasa).
A coating film is formed under the conditions of 5 seconds at a rotation speed of pm and 30 seconds at a rotation speed of about 3000 rpm.

This coated film is semi-cured for 30 minutes in air at 140° C. using a ventilation dryer. 1st color color paste 8
Any color among red, green, and blue may be used as the color.

FIG. 9 is a diagram showing how the color paste 8 is applied using a spinner. A color paste 8 is obtained by mixing an organic pigment with a mixture of a solvent and a polymer, and this color paste 8 is poured onto the surface of the silicon substrate 1 from, for example, a beaker (see FIG. 9(a)). The silicon substrate 1 is rotated at high speed using a spinner, and the color paste 8 poured onto the surface of the silicon substrate 1 is uniformly dispersed over the surface of the silicon substrate 1 by centrifugal force (Fig. 9). (b
)reference). FIG. 10 is a diagram showing the relationship between the rotation speed of the spinner and the coating film thickness. As is clear from this figure, by increasing the number of rotations of the spinner, the thickness of the coating film can be reduced. In addition, in Figure 10, each line indicates the characteristics when applying color paste (red ○ mark, green Δ
mark, blue mark).

Examples of the components of the heat-resistant color paste used in the color paste application process are as follows.

Butler Paste ■ General Formula However, R1: aromatic hydrocarbon ring or heterocycle R2: polymer 10 represented by hydrogen or a hydrocarbon group having 1 to 10 carbon atoms
0g, for organic pigment, as red pigment, color index No. 7390
Quinacridone pigments such as No. 5 Pigment Red 209 and No. 46500 Pigment Violet 19; or as a green pigment, Color Index No. No. 017416
Phthalocyanine green pigments such as No. 0 Pigment Green 36, Pigment No. 74260, Pigment Green 7, etc.; Or, as a blue pigment, Color Index No. No. 087416
0 Pigment Blue15-3, same N0074160
Phthalocyanine blue pigment represented by Pigment Blue 15-4 etc.: A heat-resistant color paste for color filters, which is prepared by mixing 10 to 300 g of any of the following.

Anti-lift - color paste ■ General formula: However, R1, aromatic hydrocarbon ring or heterocycle R2: polymer 10 represented by hydrogen or a hydrocarbon group having 1 to 10 carbon atoms
For 0g of organic pigment, the color paste (
A heat-resistant color paste for a color filter, which is made by mixing 10 to 300 g of the same red pigment, green pigment, or blue pigment as used in I).

Arc resistance color paste 1 to ■) General formula, where R3: aromatic hydrocarbon ring or heterocycle R2: polymer 10 represented by hydrogen or a hydrocarbon group having 1 to 10 carbon atoms
For 0g of organic pigment, the color paste (
A heat-resistant color paste for color filters, which is made by mixing 10 to 300 g of the same red pigment, green pigment, or blue pigment as used in 1).

The color paste applied to the silicon substrate 1 is as follows:
Any color paste among the above (1) to (I[[) may be used. Note that before applying the color paste, a transparent polyimide layer may be applied to the light-receiving surface in order to flatten the unevenness of the light-receiving surface.

(ii) Resist coating and pre-bake process (Fig. 6(b)
) After applying the color paste 8 and semi-curing the silicon substrate 1, take it out of the ventilation dryer, wait for it to cool down, and then apply the photoresist. In this example,
A positive resist, ``Microposit Photoresist 1400-3.1'' (product name) manufactured by Sibley, was used. Photoresist 9 was also applied using a spinner for 5 seconds at a rotation speed of 500 rpm. , and 20 more
A coating film is formed at a rotation speed of 0 Orpm for 30 seconds. Prebaking is performed for 30 minutes in nitrogen gas (N2 gas) at 90° C. using a ventilation dryer.

(iii) Exposure process (see FIG. 6(e)) Next, after adjusting the exposure position on the silicon substrate 1 using a mask aligner, exposure of 70IIIJ is performed to expose the photo only on the light-receiving surface and its vicinity. Exposure to ultraviolet light is performed through a photomask 11 so that the resist 9 remains.

(iv) Resist development and etching process (Fig. 6(d)
) Next, the photoresist on the exposed silicon substrate 1 is developed. As the developer, a 1:1 mixture of Microposit'MF-312 developer (trade name) manufactured by Sibley and water was used, and the solution was heated at 22°C for 6 hrs.
Resist development is performed for 0 seconds. After that, the extra color paste layer is etched. After etching, the silicon substrate 1 is rinsed with water and dried by spraying with N2 gas.

(v) Resist stripping, rinsing, and curing process (Fig. 6 (
(See e)) Next, in order to peel off the photoresist 9 remaining on the color paste layer, the silicon substrate 1 is immersed and stirred in ethyl acetate, taken out after 5 minutes, and rinsed with isopropyl alcohol. Dry by blowing N2 gas, then dry in N2 gas at 300℃ in a ventilation dryer for 30 minutes.
Let it cure for a minute.

In addition, in the example, an example was shown in which a positive resist was used as the photoresist, but a negative resist (for example, a positive resist was used)
Negative resist "'RU-1100N" manufactured by Hinei Kogyo Co., Ltd.
” (product name)) may be used.

(vi) Step of creating the second color filter Next,
Now let's start creating the second color filter.In creating the second color filter, the same processes (i) to (V) as for the first color are repeated until color paste 8 is applied and cured. . The second color may be any of red, green, and blue, excluding the first color. For example, if the first color is green,
The second color may be red.

(vii) Process of creating a third color filter Repeat the same processes (i) to (v) as for the first color. The third color is the remaining one of red, green, and blue, excluding the first and second colors.
Becomes a color. For example, if the first color is green and the second color is red, the third color is blue.

In this way, in the case of a light-receiving element having multiple light-receiving surfaces, by repeating the photolithography method as described above using color paste containing organic pigments of different colors,
Color filters of different colors can be attached to each light-receiving surface, and a spectral detection light-receiving element having spectral characteristics determined mainly by the type of organic pigment contained in each color filter can be formed.

(vii)) Coating process of the top coat film (see FIG. 7(,)) After completing the creation of the three color filters 3, 4, and 5 on the same silicon substrate 1, the top coat film 6 is finally formed. . To form the top coat film 6, for example, JSR polyimide "JIA-1-2" manufactured by Japan Synthetic Rubber Co., Ltd.
"(trade name) is applied to a film thickness of O-5μ+n and baked. The baking conditions are 1 hour in an atmosphere of 150°C. In addition to this, as the top coat film 6, for example, Nippon Gosei Rubber Co., Ltd. It may also be formed using a surface flattening agent "JSS-17°' (trade name) manufactured by Co., Ltd.

The purpose of applying this top coat film 6 is to
On the surface of the colored polyimide color filter formed by the step vii>, so-called orange beer-like roughness occurs, which often leads to a decrease in light transmittance due to diffuse reflection on the surface. This is to flatten the surface to prevent diffuse reflection on the surface and improve light transmittance. As shown in FIGS. 12 to 14,
The light transmittance is increased by the top coating.
Improved by a few percent. Figures 12 to 14 are diagrams showing the spectral transmittance characteristics of blue, red, and green color filters created by the above-mentioned process, respectively, and the characteristics shown by solid lines are the same as those shown by broken lines when there is no top coating. The properties shown are those with a top coating.

In addition, Figure 11 shows the change in spectral transmittance characteristics when the film thickness is changed for a blue color filter without top coating, and ■ indicates when the final rotation speed of the spinner is 2000 rpm. A place where ■
If is 3000 rpm, ■ is 4000 rpm
The spectral transmittance characteristics in the case of pm are shown respectively. Furthermore, Fig. 15 shows the blue color provided on the silicon chip.
It shows the characteristics of green and red color filters.

In order to obtain this characteristic, an infrared cut filter having the characteristics shown in FIG. 16 is externally attached.

(ix) Resist coating process (see FIG. 7(b)) Next, top coat II! A photoresist 12 is applied to expose the bonding pad portion 7 made of an aluminum film covered with the bonding pad portion 6, and a photoresist 12 is applied so that only the portion of the photoresist 12 corresponding to the bonding pad portion 7 is removed. The bonding pad portion 7, which is exposed to ultraviolet light through the mask 13, is formed at the edge of the silicon substrate 1. Therefore, for example, FIG. 6(a) may be slightly exaggerated as shown in FIG. 8. It is now possible to

(x) Etching process of top coat film (Fig. 7(c)
Next, the exposed silicon substrate 1 is developed and the top coat [6] corresponding to the bonding pad portion 7 is removed by etching.

(xi) Resist stripping step (see FIG. 7(d)) Furthermore, the photoresist 12 covering the top coat film 6 is
is removed with ethyl acetate or acetone. Through the above steps (ix) to (xi), the top coat film 6 in the portion corresponding to the bonding pad portion 7 is removed, and the bonding pad portion 7 is exposed.

The light-receiving element with the color filter manufactured by the above process has heat resistance that can withstand heat up to 300 degrees Celsius due to the use of polyimide resin and organic pigments as materials for the color filter. There is no need to worry about the thermal conditions in the heating wire bonding process.

In addition to the white balance sensor exemplified in this example, the light-receiving elements to be heated wire-bonded include a concentration circuit chip (IC chip) having a processing circuit and a light-receiving element on a common chip, and a luminance measurement device. Possible sensors include sensors, two-dimensional image sensors (solid-state image sensors using CCD and MOS), color embellishment sensors, and the like.

(xi) Assembly process (see Figures 1 and 2) Next,
A wafer test is performed to determine whether the wafer is good or bad, and after dicing into individual chips, only the chip elements 10 of good quality are die-bonded to the tab portion 21 of the lead frame 20. Die bonding is performed by a low-temperature curing method using an adhesive made of conductive epoxy resin, but a soldering method that requires high temperatures may also be used. After die bonding is completed, the wire is cured at 100° C. for 1 hour, and then the Au wire is wire-bonded using the thermosonic method for connection. The substrate heating temperature during wire bonding is 150~2
The temperature is 50°C. When wire bonding is completed, resin molding is performed using transparent acrylic resin, epoxy resin, silicone resin, or the like using a transfer molding method. The molding temperature at this time is about 180° C. at the highest, and both the organic pigment and the polyimide resin can be sufficiently heat resistant. Note that before resin molding, a transparent polyimide layer or epoxy resin layer may be formed on the color filter by coating. This can prevent internal stress in the molded resin portion and heat during molding from being directly transmitted to the color filter. Furthermore, when resin molding is performed in the assembly process, the molding resin can improve surface roughness of the color filter, so it is not necessarily necessary to provide a top coat film. Any shape such as DIP, SIL, or flat package can be used as the shape of the package. Note that instead of the transparent resin mold, a ceramic package having a light-transmitting window may be used.

By the way, regarding the wire bonding process, as mentioned above, Au wire (gold wire) is bonded using the thermosonic method.
In addition to the method of bonding, there are methods exemplified below, and any method may be selected.

(2) Laser Bonding Method FIG. 3 is a perspective view showing a schematic configuration of an apparatus for performing wire bonding by the laser bonding method.0 A wiring board 25 is placed on a work table 40. As shown in FIG. A chip element 10 with color filters 3.4.5 directly attached to the light receiving part is mounted on the substrate 25. A plurality of bonding pad sections 27 are formed on the surface of the substrate 25 so as to correspond to the bonding pad sections 7 of the chip element 10. The bonding pad portions 7 and 27 are connected by a bonding wire 30. The bonding wire 30 is positioned by clampers 41 and 42,
The lower end of the bonding wire 30 is guided to a position where it contacts the bonding pad portion 7 or 27. In this state, the bonding portion is irradiated with a heating laser beam B from the laser irradiation device 43, and heating wire bonding is performed. After bonding pad portions 7 and 27 are connected by bonding wire 30, cutter 44 is driven by actuator 45 in order to cut bonding wire 30 as described with reference to FIG. 2(d). Note that the clampers 41 and 42 are driven by actuators 46 and 47. Even in such a laser bonding method, the chip element 10 and the color filter 3°4.5 on the chip element 10 are heated by laser and -lx B irradiation, but as described above,
Since the color filter in the present invention is made of polyimide resin containing an organic pigment, it has heat resistance up to about 300° C., and its optical characteristics are not changed by heat during bonding.

■Cu wire bonding method Pole bonding using Au wire (gold wire) is widely used for electrical connection of semiconductor chips, but the AU wire tends to cause interdiffusion with aluminum, which is the bonding pad material, and as a result, bonding It has been pointed out that there is a problem that intermetallic compounds are formed in the wire, causing wire separation. In order to solve this problem, pole bonding methods using materials other than Au have been investigated.Cu bonding methods do not have the above disadvantages, and have high strength and low electrical resistivity. ) It has the advantage of being easy to make (), and has a high (strength/specific gravity), so it has better looping characteristics, and is advantageous for high-speed bonding, so it can replace the Au wire bonding method. It's coming.

However, in the Cu wire bonding method, it is necessary to heat the substrate to approximately 280°C, and the issue is whether the chip side has heat resistance.However, in the present invention, as a material for the organic film color filter, Since a polyimide resin containing an organic pigment is used and has heat resistance up to about 300°C, the Cu wire bonding method can be adopted.

Regarding the method of storing the color filter, as mentioned above, it is preferable to directly attach the color filter to the light receiving surface of the chip element using the photolithography method. The present invention can also be applied to the case where the attached glass substrate is attached externally to the front of the light receiving section. We attempted to electrically connect the chip element attached to the front of the unit using the heating wire bonding method, and confirmed that the optical characteristics of the color filter did not change at all under the heating wire bonding conditions used in normal semiconductor manufacturing processes. There is.

(Effects of the Invention) As described above, in the light-receiving chip element according to the present invention, a color filter made of polyimide resin containing an organic pigment is used as a color filter provided on the light-receiving surface of the chip element. Because of this, the heat resistance of color filters has been improved, making it possible to conduct heating wire bonding of spectroscopic functional elements in which organic film color filters are attached to the light-receiving surface of chip elements.
This has the effect of reducing manufacturing costs and enabling high-density packaging.

Further, in the manufacturing method according to the merged invention, a color filter made of polyimide resin containing an organic pigment is provided on the light-receiving surface of the wafer, and the wafer provided with the color filter is diced and cut into each chip element. Since each chip element is connected to the electrical connection member using a heated wire bonding method, the process of providing a color filter on the light receiving surface can be performed efficiently on a single wafer basis, thus reducing manufacturing costs. This has the effect of making further reduction possible.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the appearance of a light-receiving chip element according to an embodiment of the present invention, FIG. 2 is an explanatory diagram showing the heating wire bonding process in the manufacturing method according to an embodiment of the combined invention, The figure is a perspective view of an apparatus used for laser bonding according to another embodiment of the combined invention, FIG. 4 is a cross-sectional view of a light-receiving element having a color filter used in each of the above manufacturing methods, and FIG. 5 shows the manufacturing process of the same. Process diagram shown, No. 6
Figures 8 through 8 are explanatory diagrams for explaining each of the manufacturing processes described above, Figure 9 (aHb) is an explanatory diagram showing the color paste coating process, and Figure 10 is an explanatory diagram showing the rotation speed of the spinner and the coating film thickness. Figures 11 to 15 are diagrams showing the spectral transmittance characteristics of color filters, and Figure 16 is a diagram showing the spectral transmittance characteristics of an infrared color filter externally attached to the light receiving element. . 3.4.5 is a color filter, 7 is a bonding pad section, ]0 is a chip element, 20 is a lead frame, 30
is a bonding wire.

Claims (6)

[Claims] (1) A light-receiving chip element comprising a chip element whose light-receiving surface is provided with a color filter made of polyimide resin containing an organic pigment, and connected to an electrical connection member by heating wire bonding. (2) The light-receiving chip element according to claim 1, wherein the heating wire bonding method is a thermocompression bonding method. (3) The light-receiving chip element according to claim 1, wherein the heating wire bonding method is a thermosonic method. (4) The light-receiving chip element according to claim 1, wherein the heating wire bonding method is a laser bonding method. (5) The light-receiving chip element according to claim 1, wherein the heating wire bonding method is a solder bonding method. (6) A step of providing a color filter made of polyimide resin containing an organic pigment on the light-receiving surface of the wafer, a step of dicing the wafer provided with the color filter and cutting it into each chip element, and a step of cutting each chip element. 1. A method for manufacturing a light-receiving chip element, comprising the step of connecting it to an electrical connection member by a heating wire bonding method.