JPS63330U

JPS63330U -

Info

Publication number: JPS63330U
Application number: JP1986093020U
Authority: JP
Priority date: 1986-06-18
Filing date: 1986-06-18
Publication date: 1988-01-05

Description

[Brief explanation of the drawing]

第１図Ａは本考案一実施例のカメラ用測光装置
にかかる受光素子搭載基板を示す正面図、第１図
Ｂはその部分的な裏面図、第２図は本実施例の受
光素子チツプを示す正面図、第３図はその第１図
Ａの―線断面図、第４図はその等価回路を示
す回路図、第５図は本実施例の受光素子搭載基板
を配置したカメラ用測光装置を示す斜視図、第６
図はそのペンタプリズムホルダーの斜視図、第７
図は本実施例においてペンタプリズムホルダーと
受光素子チツプとの相対的な位置関係を調整する
ために設けられた調整機構を示す斜視図、第８図
は別の実施例の受光素子搭載基板を示す正面図、
第９図は本考案に含まれる測光装置の等価回路を
示す回路図である。２；フレキシブルプリント基板、２ａ，２ａ_１，２ａ_２，２ａ_３，２ａ_４，２ａ_５，２ａ_６，２
ａ_７；そのボンデイング用パターン、２ｂ，２ｂ
_１，２ｂ_２，２ｂ_３，２ｂ_４，２ｂ_５，２ｂ_６，
２ｂ_７；その接続用パターン、２ｃ，２ｃ_１，２
ｃ_２，２ｃ_３，２ｃ_４，２ｃ_５，２ｃ_６，２ｃ_７；その配線用パターン、４，４ａ，４ｂ，４ｃ，
４ｄ，４ｅ，４ｆ；受光素子チツプ、６；基板。 FIG. 1A is a front view showing a light-receiving element mounting board of a camera photometry device according to an embodiment of the present invention, FIG. 1B is a partial back view thereof, and FIG. 3 is a cross-sectional view taken along line A in FIG. 1, FIG. 4 is a circuit diagram showing its equivalent circuit, and FIG. 5 is a photometry device for a camera in which the light-receiving element mounting board of this embodiment is arranged. Perspective view showing 6th
The figure is a perspective view of the pentaprism holder, number 7.
The figure is a perspective view showing an adjustment mechanism provided for adjusting the relative positional relationship between the pentagonal prism holder and the light-receiving element chip in this embodiment, and FIG. 8 shows a light-receiving element mounting board of another embodiment. Front view,
FIG. 9 is a circuit diagram showing an equivalent circuit of the photometric device included in the present invention. 2; Flexible printed circuit board, 2a, 2a ₁ , 2a ₂ , 2a ₃ , 2a ₄ , 2a ₅ , 2a ₆ , 2
a ₇ ; bonding pattern, 2b, 2b
₁ , 2b ₂ , 2b ₃ , 2b ₄ , 2b ₅ , 2b ₆ ,
2b ₇ ; connection pattern, 2c, 2c ₁ , 2
c ₂ , 2c ₃ , 2c ₄ , 2c ₅ , 2c ₆ , 2c ₇ ;The wiring pattern, 4, 4a, 4b, 4c,
4d, 4e, 4f; light receiving element chip; 6; substrate.

Claims

[Scope of Claim for Utility Model Registration] 1. A substrate having a photodetector chip, a processing circuit for processing an output signal from the photodetector chip, a bonding pattern to which the photodetector chip is bonded, and a bonding pattern separated from the bonding pattern by a predetermined distance. A photometric device for a camera, comprising: a flexible printed circuit board having a connection pattern connected to the substrate, and a wiring pattern connecting the bonding pattern and the connection pattern. . 2 The light receiving element chip is a multi-division light receiving element chip that has multiple light receiving surfaces and outputs electrical signals according to the light intensity of each light receiving surface, and the bonding pattern of the flexible printed circuit board is attached to each light receiving surface. A photometric device for a camera according to claim 1, characterized in that it has a plurality of corresponding patterns. 3. The photometry device for a camera according to claim 2, which is characterized by having a position adjustment mechanism that allows relative position adjustment of the photodetector chip with respect to the photometry target. 4. The camera photometry device according to claim 1, wherein the flexible printed circuit board further includes a guard ring pattern and a shield pattern provided on both sides of the wiring pattern.