JPH0431886U - - Google Patents
Info
- Publication number
- JPH0431886U JPH0431886U JP7209590U JP7209590U JPH0431886U JP H0431886 U JPH0431886 U JP H0431886U JP 7209590 U JP7209590 U JP 7209590U JP 7209590 U JP7209590 U JP 7209590U JP H0431886 U JPH0431886 U JP H0431886U
- Authority
- JP
- Japan
- Prior art keywords
- light
- white balance
- auto white
- lead frame
- balance module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 claims 1
- 230000003595 spectral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Processing Of Color Television Signals (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
- Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
- Color Television Image Signal Generators (AREA)
Description
第1図は本考案第一実施例に係るAWBモジユ
ールの構造を示しており、同図aはそのAWBセ
ンサーの横断面図、同図bは同じくその縦断面図
、同図cはAWBモジユールの全体構造を示す図
である。第2図は本考案第二実施例に係るAWB
モジユールの構造を示しており、同図aはそのA
WBセンサーの横断面図、同図bは同じくその縦
断面図である。第3図は本考案第三実施例に係る
AWBモジユールの構造を示しており、同図aは
そのAWBセンサーの横断平面図、同図bは同じ
くその縦断側面図、同図cはAWBモジユールの
全体構造を示す縦断正面図、同図dはAWBモジ
ユールをカメラ本体側のコネクタに接続した状態
を示す図である。第4図は従来のAWBモジユー
ルの構造を示しており、同図aはそのAWBセン
サーの平面図、同図bは同じくその側面図、同図
cはAWBモジユールの全体構造を示す図である
。
1……AWBセンサー、2a,2b,2c……
受光素子、3……電子部品(ICチツプ)、4…
…リードフレーム、20……透光性樹脂体、20
a……受光面、21……遮光性樹脂体、40a〜
40g……信号端子。
Fig. 1 shows the structure of an AWB module according to the first embodiment of the present invention, in which Fig. 1a is a cross-sectional view of the AWB sensor, Fig. 1b is a longitudinal sectional view thereof, and Fig. 1c is a longitudinal sectional view of the AWB sensor. It is a figure showing the whole structure. Figure 2 shows an AWB according to the second embodiment of the present invention.
The structure of the module is shown, and a in the figure shows its A.
A cross-sectional view of the WB sensor, and FIG. 1B is a vertical cross-sectional view thereof. Figure 3 shows the structure of the AWB module according to the third embodiment of the present invention, in which Figure a is a cross-sectional plan view of the AWB sensor, Figure b is a longitudinal cross-sectional side view, and Figure c is the AWB module. Figure d is a longitudinal sectional front view showing the overall structure, and shows a state in which the AWB module is connected to the connector on the camera body side. FIG. 4 shows the structure of a conventional AWB module; FIG. 4A is a plan view of the AWB sensor, FIG. 4B is a side view thereof, and FIG. 4C is a diagram showing the overall structure of the AWB module. 1...AWB sensor, 2a, 2b, 2c...
Light receiving element, 3...Electronic component (IC chip), 4...
... Lead frame, 20 ... Transparent resin body, 20
a... Light-receiving surface, 21... Light-shielding resin body, 40a~
40g...Signal terminal.
Claims (1)
ンスセンサーを備え、撮像管の光学的色調を自動
調整するオートホワイトバランスモジユールにお
いて、前記オートホワイトバランスセンサーは、
互いに分光感度の異なる複数の受光素子と、該各
受光素子によつて得られた信号を信号処理するオ
ートホワイトバランス調整用電子部品とがリード
フレームに搭載され、これらを透光性樹脂にて一
次モールドして透光性樹脂体が形成され、該透光
性樹脂体の受光面を除いて遮光性樹脂にて二次モ
ールドして遮光性樹脂体が形成されて成ることを
特徴とするオートホワイトバランスモジユール。 2 請求項1記載のオートホワイトバランスモジ
ユールにおいて、リードフレームが回路網を構成
するようパターン形成されたことを特徴とするオ
ートホワイトバランスモジユール。 3 請求項1記載のオートホワイトバランスモジ
ユールにおいて、リードフレームの外部への接続
に必要な信号端子が同一方向に引き出されたこと
を特徴とするオートホワイトバランスモジユール
。[Claims for Utility Model Registration] 1. In an auto white balance module that includes an auto white balance sensor that detects the color temperature of a light source and automatically adjusts the optical color tone of an image pickup tube, the auto white balance sensor comprises:
A plurality of light-receiving elements with mutually different spectral sensitivities and an electronic component for automatic white balance adjustment that processes the signals obtained by the light-receiving elements are mounted on a lead frame, and these are mounted on a lead frame using a transparent resin. Auto white characterized by molding to form a light-transmitting resin body, and secondary molding with a light-shielding resin except for the light-receiving surface of the light-transmitting resin body to form a light-shielding resin body. balance module. 2. The auto white balance module according to claim 1, wherein the lead frame is patterned to form a circuit network. 3. The auto white balance module according to claim 1, wherein signal terminals necessary for connecting the lead frame to the outside are drawn out in the same direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7209590U JPH0431886U (en) | 1990-07-05 | 1990-07-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7209590U JPH0431886U (en) | 1990-07-05 | 1990-07-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0431886U true JPH0431886U (en) | 1992-03-16 |
Family
ID=31609724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7209590U Pending JPH0431886U (en) | 1990-07-05 | 1990-07-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0431886U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007506935A (en) * | 2003-06-20 | 2007-03-22 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Optical sensor device and corresponding manufacturing method |
JP2012114168A (en) * | 2010-11-22 | 2012-06-14 | Asahi Kasei Electronics Co Ltd | Optical sensor device and manufacturing method therefor |
-
1990
- 1990-07-05 JP JP7209590U patent/JPH0431886U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007506935A (en) * | 2003-06-20 | 2007-03-22 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Optical sensor device and corresponding manufacturing method |
JP4662930B2 (en) * | 2003-06-20 | 2011-03-30 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Optical sensor device and corresponding manufacturing method |
JP2012114168A (en) * | 2010-11-22 | 2012-06-14 | Asahi Kasei Electronics Co Ltd | Optical sensor device and manufacturing method therefor |
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