JP2012114168A - Optical sensor device and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical sensor device and a manufacturing method therefor, enabling detection of light only incident from a desired angle and direction by allowing the light to reach a light-receiving surface.SOLUTION: The optical sensor device includes: an IR element 10 for detecting an infrared ray; a mold resin 49 for covering the IR element 10; and a lid 60 for covering the mold resin 49. A light-receiving surface 16 of the IR element 10 exposes from the mold resin 49 in a state of being arranged in an identical plane to the surface of the mold resin 49. A penetrating opening 65 is provided on the lid 60 to restrict the view angle of the light-receiving surface 16. Further, with the provision of a lead frame 30, the optical sensor device may also include a hook-like latch unit on the lid 60. In this case, the lid 60 can be fixed to the lead frame 30 by the engagement of the outer circumference portion of the lead frame 30 with the latch unit of the lid 60.

Description

  The present invention relates to an optical sensor device including an optical sensor element that detects light such as infrared rays, and a semiconductor element that processes a signal output from the optical sensor element, and a manufacturing method thereof.

  As this type of prior art, for example, there is one disclosed in Patent Document 1. In this document, as shown in FIG. 2, a sensor element with an optical filter that transmits only infrared rays is covered with a resin except for its end face (that is, a light receiving surface) and exposed from the resin. An infrared sensor having a structure in which the light receiving surface is arranged in the same plane as the surface of the resin (that is, is flush) is disclosed. Further, it is disclosed that the sensor element is a quantum photodiode that generates a photovoltaic effect by infrared rays.

International Publication No. 2006/095834

By the way, in the infrared sensor disclosed in Patent Document 1, the light receiving surface of the sensor element is flush with the surface of the resin. For this reason, infrared rays can be incident on the light receiving surface of the sensor element from various angles and directions, and there is a possibility of detecting infrared rays incident from an unintended angle and direction.
Therefore, the present invention has been made in view of such circumstances, and an optical sensor device that allows only light incident from a desired angle and direction to be detected by reaching the light receiving surface and its manufacture The purpose is to provide a method.

In order to solve the above problems, an optical sensor device according to an aspect of the present invention includes an optical sensor element that detects light, a sealing member that covers the optical sensor element, a lead frame, and a first of the lead frame. And a light receiving surface of the optical sensor element is exposed from the sealing member in a state of being disposed on the same plane as the first surface of the lead frame, The lid is provided with a through opening that restricts the viewing angle of the light receiving surface.
Here, the “viewing angle of the light receiving surface” refers to a range of angles at which light can enter (reach) on the light receiving surface. The viewing angle can be defined with reference to the normal direction of the light receiving surface, for example. For example, as shown in FIG. 19, the viewing angle θ1 can be defined by the intersection angle between the light incident from the normal direction of the light receiving surface and the normal direction.

  On the other hand, according to the optical sensor device of one aspect of the present invention, only light incident from a desired angle and direction is detected by reaching the light receiving surface through the opening provided in the lid. be able to. Thereby, for example, it is possible to detect only directional light or to specify a light emission source. The “photosensor element” corresponds to, for example, an IR element 10 described later. As the “sealing member”, for example, a mold resin 49 described later corresponds. The “photosensor device” corresponds to, for example, a hybrid IR100, 200, 400, or a discrete IR300 described later.

  The optical sensor device may further include an optical filter that covers the light receiving surface of the optical sensor element. Here, the optical filter has a function of selectively transmitting light in a desired wavelength range (that is, having high transmittance). With such a configuration, only light in a desired wavelength range can be detected by reaching the light receiving surface of the optical sensor, and light outside the wavelength range can be blocked by an optical filter, so photoelectric conversion As a result, the S / N ratio of the electrical signal output from the optical sensor element (that is, the light detection signal) can be improved.

  In the above optical sensor device, a recess corresponding to the outer shape and dimensions of the optical filter is provided around the opening of the lid, and the optical filter is accommodated in the recess. It may be a feature. With such a configuration, the alignment of the optical filter with respect to the optical sensor is completed by housing the optical filter in the recess. For this reason, the optical filter can be easily and accurately attached.

Further, in the above optical sensor device, the lid body is provided with a hook-shaped locking portion, and the outer periphery of the lead frame is fitted into the locking portion, whereby the lid body is the lead. It may be characterized by being fixed to a frame. With such a configuration, for example, the lid can be fixed to the lead frame without using an adhesive.
The optical sensor device may further include an adhesive interposed between the lid and the first surface of the lead frame, and the lid is fixed to the lead frame by the adhesive. It may be characterized by being. With such a configuration, for example, the lid can be fixed to the lead frame even if the lid has no locking portion.

  The optical sensor device further includes a semiconductor element that processes a signal output from the optical sensor element, and the semiconductor element is electrically connected to the lead frame and covered with the sealing member. It may be characterized by being broken. With such a configuration, an optical sensor device including an optical sensor element and a semiconductor element in one package can be provided. The “semiconductor element” corresponds to, for example, an IC element 20 described later.

  In the optical sensor device, the lead frame has a second surface opposite to the first surface, and the semiconductor element is attached to the second surface of the lead frame. This may be a feature. With such a configuration, since the optical sensor device can be manufactured by a manufacturing method described later, for example, there is no etching damage on the light receiving surface, and a high quality optical sensor device with respect to light transmittance and the like. Can be provided. In addition, for example, since it is not a stack structure in which optical sensors are stacked on a semiconductor element, but also a structure in which an optical sensor element and a semiconductor element are sealed with a resin including an interposer, an optical sensor device having a small thickness can be provided. it can. The “first surface” corresponds to, for example, an upper surface (back surface) 30a of the lead frame 30 described later. As the “second surface”, for example, the surface of a lead frame 30 described later corresponds.

A method of manufacturing an optical sensor device according to another aspect of the present invention is a method of manufacturing an optical sensor device including an optical sensor element that detects light using a lead frame, and the first surface of the lead frame. Attaching the adhesive surface of the adhesive tape to the adhesive tape, and attaching the light receiving surface of the optical sensor element to the adhesive surface of the adhesive tape exposed in the lead frame; Electrically connecting the lead frame and the optical sensor element; covering the optical sensor element with a sealing member; removing the adhesive tape from the sealing member and the lead frame; A step of cutting the sealing member and the lead frame to form a package; and a step of attaching a lid that covers the first surface of the lead frame. Wherein the opening through limiting the viewing angle of the light receiving surface is provided.
According to such a method, only light incident from a desired angle and direction can be detected by reaching the light receiving surface. For example, only directional light can be detected or a light source can be specified. It is possible to manufacture an optical sensor device that can be used.

  In addition, a window for introducing light into the optical sensor element can be formed in the sealing member without etching the sealing member. Compared with the prior art, an etching process for forming a window in the sealing member is not necessary, so that an increase in the number of processes and an increase in manufacturing cost can be suppressed. Further, since it is not necessary to cause etching damage to the light receiving surface of the optical sensor element, it is possible to prevent the quality of the light receiving performance from deteriorating, for example, light transmittance.

  According to still another aspect of the present invention, there is provided a method of manufacturing an optical sensor device, comprising: an optical sensor device that detects light; and a semiconductor device that processes a signal output from the optical sensor device. A method of manufacturing using a frame, comprising the steps of attaching an adhesive surface of an adhesive tape to a first surface of the lead frame; and the adhesive surface of the adhesive tape, the lead Attaching the light receiving surface of the photosensor element to a region exposed from the frame; attaching the semiconductor element on a second surface opposite to the first surface of the lead frame; and the lead A step of electrically connecting the frame and the semiconductor element, a step of covering the optical sensor element and the semiconductor element with a sealing member, and the adhesive tape from the sealing member and the lead frame. And a step of cutting the sealing member and the lead frame to form a package, and a step of attaching a lid that covers the first surface of the lead frame. Is provided with a penetrating opening for limiting the viewing angle of the light receiving surface.

  According to such a method, the same effect as the above-described method for manufacturing the optical sensor device can be obtained. In addition to the above effects, the structure of the optical sensor device manufactured by the method is not a stack structure in which optical sensors are stacked on a semiconductor element, but the optical sensor element and the semiconductor element are sealed with a resin including an interposer. Since it is not a stopped structure, an optical sensor device having a small thickness can be provided by a relatively simple method.

  Further, an optical sensor device according to still another aspect of the present invention includes an optical sensor element that detects light, a sealing member that covers the optical sensor element, and a lid that covers the sealing member, The light receiving surface of the optical sensor element is exposed from the sealing member in a state of being disposed on the same plane as the upper surface of the sealing member, and the cover body has a through-opening that limits the viewing angle of the light receiving surface. A portion is provided. With such a configuration, it is possible to detect only light incident from a desired angle and direction by reaching the light receiving surface through the opening provided in the lid. Thereby, for example, it is possible to detect only directional light or to specify a light emission source.

  According to the present invention, only light incident from a desired angle and direction can be detected by reaching the light receiving surface.

The figure which shows the structural example of hybrid IR100 which concerns on 1st Embodiment. The figure which shows the structural example of IR element 10 which concerns on 1st Embodiment. The figure which shows the structural example of the signal processing circuit 21 of the IC element 20 which concerns on 1st Embodiment. FIG. 3 is a diagram illustrating a configuration example of a lead frame 30 according to the first embodiment. The figure which shows the structural example of the cover body 60 which concerns on 1st Embodiment. The figure which shows the manufacturing method of hybrid IR100 which concerns on 1st Embodiment (the 1). The figure which shows the manufacturing method of hybrid IR100 (the 2). The figure which shows the manufacturing method of hybrid IR100 (the 3). The figure which shows the manufacturing method of hybrid IR100 (the 4). The figure which shows the manufacturing method of hybrid IR100 (the 5). The figure which shows the manufacturing method of hybrid IR100 (the 6). The figure which shows the manufacturing method of hybrid IR100 (the 7). The figure which shows the manufacturing method of hybrid IR100 (the 8). The figure which shows the manufacturing method of hybrid IR200 which concerns on 2nd Embodiment. The figure which shows the structural example of hybrid IR300 which concerns on 3rd Embodiment. The figure which shows the structural example of discrete IR400 which concerns on 4th Embodiment. The figure which shows the structural example of hybrid IR500 which concerns on 5th Embodiment. The figure which shows the structural example of hybrid IR600 which concerns on 6th Embodiment. The figure for demonstrating a viewing angle.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. Note that, in each drawing described below, parts having the same configuration are denoted by the same reference numerals, and repeated description thereof may be omitted.
(1) First Embodiment (1.1) Schematic Configuration of Hybrid IR FIGS. 1A and 1B are perspective views showing a configuration example of a hybrid IR 100 according to the first embodiment of the present invention. FIG. 1A is a diagram showing the hybrid IR 100 after the lid is attached (that is, in a completed state), and FIG. 1B is a diagram showing a state before the lid is attached.

  As shown in FIGS. 1A and 1B, the hybrid IR 100 includes an IR element 10, an IC element 20, a lead frame 30, a mold resin 49, and a lid body 60. As shown in FIG. 1B, in this hybrid IR 100, the light receiving surface 16 of the IR element 10 is exposed from the mold resin 49 and is flush with the upper surface 30a of the lead frame 30 and the upper surface 49a of the mold resin 49, respectively. (That is, to be flush with each other). Further, the IC element 20 is fixed to the die pad region of the lead frame 30 and is sealed so that all of the IC element 20 is covered with the mold resin 49. The lid 60 is fixed to at least one of the lead frame 30 and the mold resin 49 and covers the upper surface 30 a of the lead frame 30 and the upper surface 49 a of the mold resin 49. The lid 60 is provided with a through opening 65 that limits the viewing angle of the light receiving surface 16. External light reaches the light receiving surface 16 through the opening 65. Hereinafter, each element which comprises hybrid IR100, and its manufacturing method are demonstrated in detail.

(1.2) Configuration of IR Element FIGS. 2A and 2B are diagrams showing a configuration example of the IR element 10 according to the first embodiment of the present invention, and FIG. FIG. 2B is a diagram showing a cross section of the photoelectric conversion element 13. An IR element 10 shown in FIG. 2A is an optical sensor element that detects infrared rays, a light transmission substrate 11 that transmits light such as infrared rays, and a light receiving portion 12 formed on the surface side of the light transmission substrate 11. And comprising.

  Among these, a GaAs substrate is used as the light transmission substrate 11. In addition to the GaAs substrate, for example, a semiconductor substrate such as Si, InAs, InP, GaP, or Ge, or a substrate such as GaN, AlN, sapphire substrate, or glass substrate is used. According to such a substrate, light of a specific wavelength such as infrared light can be efficiently transmitted from the back surface to the front surface of the light transmitting substrate 11.

  In addition, the light receiving unit 12 includes a plurality of photoelectric conversion elements 13, a pad unit 14 for outputting an electrical signal photoelectrically converted by the photoelectric conversion element 13, and a wiring 15. Each of the photoelectric conversion elements 13 is a quantum photodiode and is connected in series by a wiring 15. As the number of connected photoelectric conversion elements 13 increases, the generated electromotive force increases, and the sensitivity as a sensor increases.

  As shown in FIG. 2B, the photoelectric conversion element 13 includes an n-type compound semiconductor layer (n layer) such as InSb containing indium (ln) and antimony (Sb) formed on the light transmission substrate 11. ) 13a, a non-doped compound semiconductor layer layer (π layer) 13b formed on the n layer 13a, and an AlInSb layer formed on the π layer 13b and having a larger band gap than the n layer 13a and the π layer 13b. Such a compound semiconductor layer 13c and a p-type compound semiconductor layer (p layer) 13d formed on the compound semiconductor layer 13c and doped with a p-type impurity at a high concentration are configured. Thus, the photoelectric conversion element 13 in which the n layer 13a, the π layer 13b, the compound semiconductor layer 13c having a larger band gap than the n layer 13a and the π layer 13b, and the p layer 13d are sequentially stacked has a thickness of 2000 nm. Infrared light of ˜7400 nm can be detected.

  The pad portion 14 shown in FIG. 2A is provided for outputting an electric signal obtained by photoelectric conversion of the light receiving portion 12 to the IC element. The pad portion 14 includes, for example, a pair of pad electrodes 14a and 14b that are disposed apart from each other. The wiring 15 is electrically connected between one pad electrode 14a and one end of the row of the plurality of photoelectric conversion elements 13, and between the other pad electrode 14b and the other end of the row. .

  By the way, in this IR element 10, the pad portion 14 is arranged in a partial range (center portion) closer to the center of the surface of the IR element 10. A plurality of photoelectric conversion elements 13 are arranged around the pad portion 14. According to such an arrangement, there is an advantage that the light transmitting substrate 11 is not easily lost even when pressure or ultrasonic waves are applied when wire bonding is performed to the pad electrodes 14a and 14b. Further, since the light transmission substrate 11 is not easily damaged, a wire made of Au or the like can be bonded to the pad electrodes 14a and 14b with sufficient pressure or ultrasonic waves. For this reason, a wire can be reliably crimped | bonded by pad electrode 14a, 14b, and the reliability of wire bonding can be improved. Next, a configuration example of the IC element 20 disposed in the same package as the IR element 10 will be described.

(1.3) Configuration of IC Element FIG. 3 is a block diagram showing a configuration example of the signal processing circuit 21 of the IC element 20 according to the first embodiment of the present invention.
As shown in FIG. 3, the signal processing circuit 21 included in the IC element 20 includes a power supply circuit 22 that supplies a bias current or voltage to the IR element 10 and other circuits as necessary, and an electric An amplifier circuit 23 that amplifies the signal, a determination circuit 24 that compares the amplified electric signal with a preset voltage, and a reference value generation circuit 25 that inputs a preset voltage as a reference value to the determination circuit 24 The determination circuit 24 outputs a digital signal as a determination result to the outside. Each element included in the signal processing circuit 21 is electrically connected to a corresponding element.

  In general, since the amplitude or fluctuation amount of the output signal of the optical sensor element including the IR element is as small as several μV to several mV or less, the electric signal is amplified by the amplifier circuit of the signal processing circuit. Therefore, when light enters the light receiving unit 12 of the IR element 10, the incident light is converted into an electric signal and output to the amplifier circuit 23. The amplifier circuit 23 amplifies and outputs the electrical signal. Thereafter, the electrical signal output from the amplifier circuit 23 is input to the determination circuit 24 for determining whether infrared rays from the human body or flame are sensed (note that this electrical signal is output to the outside in analog form). May be.)

At this time, a voltage (reference value voltage) set according to light having a wavelength to be determined by the determination circuit 24, for example, infrared rays from a human body or flame, is input to the determination circuit 24 by the reference value generation circuit 25. The determination circuit 24 compares the reference voltage with the amplified electric signal, and digitally outputs the electric signal of the comparison result to the outside.
Note that the IC element 20 having the signal processing circuit 21 as shown in FIG. 3 is formed on the most common silicon substrate by a CMOS process, a BiCMOS process, a bipolar process, or the like from the viewpoint of mass productivity and design freedom. However, it may be formed on a compound semiconductor substrate such as a GaAs substrate, and an optimal material and process can be selected according to the application, use environment, and the like. Next, a configuration example of the lead frame will be described.

(1.4) Configuration of Lead Frame FIGS. 4A and 4B are plan views showing a configuration example of the lead frame 30 according to the first embodiment of the present invention. 4A shows the front side of the lead frame 30, and FIG. 4B shows the back side of the lead frame 30. As shown in FIG.
In the lead frame 30 shown in FIGS. 4A and 4B, for example, a copper (Cu) plate is selectively etched from the front side and the back side by photolithography technology to obtain nickel (Ni) -palladium. It is formed by performing a plating (plating) treatment such as (Pd) -gold (Au).

  4A, a white region in the lead frame 30 indicates a region (hereinafter also referred to as a through region) 31 penetrating between the front surface and the back surface, and a hatched region is on the front side. A half-etched region (hereinafter also referred to as a half-etched region) 32a is shown. A gray region indicates a region 33a that is not etched (hereinafter, non-etched region) 33a by being masked with a photoresist or the like during etching. Similarly, in FIG. 4B, the white region in the lead frame 30 indicates the through region 31, and the hatched region indicates the half-etched region 32b that is half-etched from the back side. Further, the gray region shows a non-etched region 33b that is not etched by being masked with a photoresist or the like during etching (the non-etched region 33b on the back surface side is the lead frame shown in FIG. 1B). 30 is an upper surface 30a.).

As shown in FIG. 4A, a die pad region 34 for attaching an IC element is set in the half etching region 32a on the surface side of the lead frame 30. Further, a region 35 for placing the IR element 10 is set in the through region adjacent to the die pad region 34 (right adjacent in FIG. 4A).
Further, the outer peripheral portion of the lead frame 30 shown in FIGS. 4A and 4B is a region (referred to as a kerf width) 36 that is cut by a dicing blade or the like in a dicing process described later.

  As shown in FIG. 6B, which will be described later, a portion where the front side of the lead frame 30 is a non-etched region 33a and the back side thereof is also a non-etched region 33b (hereinafter also referred to as a first portion). When the thickness of 37 is T1, and the thickness of a portion 38 (hereinafter also referred to as a second portion) 38 where the front side of the lead frame 30 is a half-etched region 32a and the back side is a non-etched region is T2. The magnitude relationship is T1> T2. T1 is, for example, 0.4 [mm], and T2 is, for example, 0.2 [mm]. In addition, the surface of the second part 38 is recessed as compared to the first part 37 (that is, the surface of the second part 38 is lower than the surface of the first part 37). It is in.). The die pad region 34 is set on the surface of such a second portion 38. Next, a method for manufacturing a hybrid IR 100, which is a kind of optical sensor device, using the lead frame 30 will be described.

(1.5) Configuration of lid body FIGS. 5A and 5B are a perspective view showing a configuration example of the lid body 60 according to the first embodiment of the present invention, and this perspective view is represented by X4-X′4. It is sectional drawing cut | disconnected by the line.
As shown in FIGS. 5A and 5B, the lid 60 has, for example, the same shape as the shape of the package of the hybrid IR 100 in plan view (ie, the planar shape) and the same dimensions (actually with respect to the package). In order to facilitate the attachment of the lid 60, the plate portion 61 having a slightly larger size than the package and the outer peripheral side surface of the plate portion 61 (that is, provided so as to surround the plate portion 61). A guide portion 62 and a hook-like locking portion 63 provided on the guide portion 62. A portion corresponding to the IR element of the plate portion 61 (that is, a portion facing the light receiving surface of the IR element when the lid 60 is attached to the package) is penetrated to limit the viewing angle of the light receiving surface. An opening 65 is provided.
The lid 60 having such a configuration is, for example, a liquid crystal polymer used in injection molding and is made of a material having a thermal deformation temperature of 250 ° or more. Thereby, it can endure the reflow conditions (for example, furnace temperature 260 degreeC, time 10 second) at the time of mounting.

Further, as shown in FIG. 1A, when the lid 60 is put on the package, the side surface of the package is covered by the guide portion 62. Thereby, it is possible to prevent light from leaking from the four side surfaces (that is, four sides) of the package to the IR element 10 side.
Further, as will be described later, the lid 60 is fixed to the lead frame by the hook-like locking portion 63 being hooked on the outer peripheral portion of the lead frame. In order to facilitate this latching (that is, the latching portion 63 is easily latched on the outer periphery of the lead frame), the surface 63a of the latching portion 63 that contacts the surface of the lead frame is a horizontal plane (in FIG. It is inclined with respect to the surface of the plate portion 61. The inclination angle θ2 is, for example, 10 °.

  In addition, in FIG.5 (b), although the case where the side surface 65a of the opening part 65 is perpendicular | vertical with respect to a horizontal surface is shown, this is an example to the last. In the first embodiment, the side surface 65a of the opening 65 may be inclined with respect to the horizontal plane. For example, the side surface 65a of the opening 65 may be inclined so that the diameter gradually increases from the light receiving surface of the IR element toward the upper side (that is, the direction in which light enters). The angle of the side surface 65a with respect to the horizontal plane can be arbitrarily set according to a desired viewing angle.

  5A and 5B illustrate a configuration in which the locking portion 63 is provided only on one of the four sides of the guide portion 62 (that is, only on one side of the plate portion 61 in a cross-sectional view). However, this is only an example. In each embodiment of the present invention, for example, as shown in FIG. 13 described later, locking portions 63 are provided on two opposite sides of the four sides of the guide portion 62 (that is, on both sides of the plate portion 61 in a sectional view). It may be a configuration.

(1.6) Manufacturing Method of Hybrid IR FIGS. 6A to 13 are process diagrams showing a manufacturing method of the hybrid IR 100 according to the first embodiment of the present invention. 6A to 12B, (a) is a plan view seen from the front surface side (that is, the second surface side), and (b) is a plan view of (a) from X6-X'6 to X12-. It is sectional drawing when each cut | disconnecting by X'12 line. In FIG. 10A, the illustration of the mold is omitted to avoid complication of the drawing.

  As shown in FIGS. 6A and 6B, first, the adhesive tape 41 is attached to the back surface side of the lead frame 30 ′ (that is, the first surface side). Here, the lead frame 30 shown in FIGS. 4A and 4B is used as one unit pattern, and the lead frame is arranged such that the unit patterns are continuously arranged in the vertical direction and the horizontal direction in plan view. 30 ′ is prepared. And the adhesive tape 41 is affixed on the back surface of this prepared lead frame 30 '. By sticking the adhesive tape 41 to the back surface side of the lead frame 30 ′, the adhesive layer of the adhesive tape 41 is exposed on the bottom surface of the penetrating region 31.

  As the adhesive tape 41, a resin tape having adhesiveness and heat resistance is used. About adhesiveness, the one where the paste thickness of the adhesion layer is thinner is preferable. Moreover, about heat resistance, it is required to endure the temperature of about 150 to 200 degreeC. As such an adhesive tape 41, for example, a polyimide tape can be used. The polyimide tape has heat resistance that can withstand about 280 ° C. Such a polyimide tape having high heat resistance can withstand high heat applied during subsequent molding or wire bonding. In addition to the polyimide tape, the following tape may be used as the adhesive tape 41.

-Polyester tape Heat-resistant temperature, about 130 ° C (however, the heat-resistant temperature reaches about 200 ° C depending on use conditions).
・ Teflon (registered trademark) tape Heat-resistant temperature: about 180 ℃
・ PPS (polyphenylene sulfide) Heat-resistant temperature: about 160 ℃
・ Glass cloth heat resistant temperature: about 200 ℃
・ Nomek Paper Heat-resistant temperature: about 150-200 ℃
In addition, aramid and crepe paper can be used as the adhesive tape 41.

  Next, as shown in FIGS. 7A and 7B, the adhesive tape 41 has a sticky surface and is exposed from the lead frame 30 ′ (among them, FIG. 4A and FIG. 7). The IR element 10 is affixed to the region 35) for arranging the IR element shown in FIG. This sticking (that is, die bonding of the IR element) is performed using the back surface 16 of the IR element 10 as the sticking surface. Note that a protective film (not shown) may be formed in advance on the back surface 16 of the IR element 10 at the time of attachment. As the protective film, for example, a photoresist can be used. Such a protective film can be formed, for example, before dicing the light-transmitting substrate 11 that is the base material of the IR element 10.

  Next, as shown in FIGS. 8A and 8B, the IC element 20 is attached to the die pad region set on the surface of the lead frame 30 ′. This attachment (that is, die bonding of the IC element) is performed using, for example, silver (Ag) with the back surface of the IC element 20 (that is, the surface opposite to the surface on which the above-described signal processing circuit 21 or the like is formed) as the attachment surface. This is done through an adhesive such as a paste.

  Next, as shown in FIGS. 9A and 9B, the IC element 20 and the lead frame 30 ′, and the IC element 20 and the IR element 10 are electrically connected. Here, the pad electrode 26 on the surface of the IC element 20 and the bonding terminal portion 39 of the lead frame 30 ′ are connected by a wire 45 made of Au or the like, and the pad electrode 27 on the surface of the IC element 20 and the IR element are connected. The pad electrodes 14a and 14b on the surface of 10 are connected by a wire 46 made of Au or the like (that is, wire bonding is performed).

  The connection between the IC element 20 and the lead frame 30 ′ is preferably performed by so-called reverse bonding in which the wire 45 is extended from the bonding terminal portion 39 of the lead frame 30 ′ toward the pad electrode 26 of the IC element 20. That is, the 1st bond accompanied with the formation of the ball is performed on the bonding terminal portion 39 of the lead frame 30 ′, and the 2nd bond is performed on the pad electrode 26 of the IC element 20. In such a method, since the bonding terminal portion 39 of the lead frame 30 ′ is at a lower position than the pad electrode 27 of the IC element 20, the lead frame 30 ′ Compared with so-called positive bonding in which the wire 45 is extended toward the bonding terminal portion 39, the height of the wire 45 after bonding can be reduced.

  The IR element 10 and the IC element 20 are connected by extending the wire 46 from the pad electrodes 14a and 14b of the IR element 10 toward the pad electrode 27 of the IC element 20 (that is, reverse bonding as viewed from the IC element 20). ) Is preferable. That is, the 1st bond accompanied with the formation of the ball is performed on the pad electrodes 14 a and 14 b of the IR element 10, and the 2nd bond is performed on the pad electrode 26 of the IC element 20. With such a method, since the pad electrodes 14a and 14b of the IR element 10 are at a lower position than the pad electrode 27 of the IC element 20, the height of the wire 46 after bonding can be lowered. .

  Next, as shown in FIGS. 10A and 10B, the upper mold 47 is disposed on the front surface side of the lead frame 30 ′, and the lower mold 48 disposed on the back surface side of the lead frame 30 ′ is disposed. . Then, the lead frame 30 ′ is sandwiched between the upper mold 47 and the lower mold 48, and a mold resin is injected from the side into the space sandwiched between the upper mold 47 and the lower mold 48 and filled. Thus, as shown in FIGS. 11A and 11B, the IR element 10, the IC element 20, and the wires 45 and 46 are sealed with the mold resin 49 on the surface side of the lead frame 30 ′.

  As the mold resin 49, for example, an epoxy resin can be used. Further, in this resin sealing step, the upper die and the non-etched region 33a on the surface side of the lead frame 30 'are in contact with each other without any gap, and the lower die and the non-etched region on the back surface side of the lead frame 30' The mold resin 49 is supplied from the side of the space formed by the overlapping of both molds in a state in which it is in contact with the gap 33b. For this reason, as shown in FIG. 11A, the non-etched region 33a is exposed from the mold resin 49 after the resin sealing. Further, since the mold resin 49 is not supplied also to the half-etched region 32 a surrounded by the non-etched region 33 a, the region 32 a is also exposed from the mold resin 49.

Next, the adhesive tape is removed from the back side of the lead frame 30 '. After the adhesive tape is removed, post-cure and wet blasting are performed, and when a protective film (not shown) is formed on the back surface of the IR element 10, the protective film is removed.
Thereafter, the mold resin 49 and the lead frame 30 ′ are diced by a dicing device, and the kerf width 36 is cut. Thereby, as shown in FIGS. 12A and 12B, the mold resin and the lead frame are separated into individual products (ie, individual hybrid IRs 100) and packaged.

  Next, a lid is attached to the surface of the package (a lid attaching step). Here, as shown in FIGS. 12A and 12B, on the outer peripheral side surface of each packaged hybrid IR 100, there is a second portion 38 of the lead frame 30, from the mold resin 49. There is an exposed second portion 38a. Therefore, as shown in FIG. 13, in the attaching process of the lid 60, the inside of the lid 60 (that is, the side where the locking portion 63 exists) is the surface of the package (that is, the upper surface 30a of the lead frame 30). In this state, the engaging portion 63 is hooked on the second portion 38a of the lead frame 30 and stopped. That is, the second portion 38 a protruding in the horizontal direction in the cross-sectional view is fitted into the hook-shaped locking portion 63. Thereby, the lid body 60 is fixed to the lead frame 30. After fixing in this way, the viewing angle limiting opening 65 is positioned directly above the light receiving surface 16 of the IR element 10.

The lead frame 30 includes a die pad region to which the IC element 20 is fixed as described above, and a plurality of terminal portions that are electrically connected to the IC element 20. These terminal portions are formed integrally with the bonding terminal portion 39 covered with the mold resin 49 and the bonding terminal portion 39, and a part thereof is exposed from the mold resin 49. Terminal portion 42 (for example, see FIG. 12A). When the hybrid IR 100 is incorporated into various devices, the external wiring board connecting terminal portion 42 is electrically connected to a terminal portion of a wiring board such as an interposer. As a result, the hybrid IR 100 can be mounted on the wiring board without blocking the light receiving surface 16.
As described above, according to the first embodiment of the present invention, only the light incident from a desired angle and direction is received by the IR element 10 by the viewing angle limiting opening 65 of the lid 60. It can be detected by reaching the surface 16. Thereby, for example, it is possible to detect only directional light or to specify a light emission source.

  Further, since the upper surface 30a of the lead frame 30 is covered with the lid 60, for example, even when a droplet or the like is dropped from above the package, the droplet adheres to the upper surface 30a of the lead frame 30. Therefore, the IR element 10 and the lead frame 30 can be prevented from being short-circuited through the droplet. Furthermore, since the upper surface 30a of the lead frame 30 is covered with the lid 60 and cannot be seen from the outside, for example, the user mistakes the upper surface 30a of the lead frame 30 as the light receiving surface 16 of the IR element 10. There is no such thing. Although not shown, it is possible to mark the name of the hybrid IR 100, the lot number, and the like on the surface of the lid 60 by a method such as laser or printing.

Furthermore, the first embodiment of the present invention has various effects other than the above.
That is, according to the first embodiment of the present invention, resin sealing is performed in a state where the IR element 10 is attached to the adhesive tape 41 with the light receiving surface 16 of the IR element 10 as the attachment surface, and then the adhesive tape 41 is attached. Remove. Thereby, light can be incident on the light receiving surface of the IR element 10 without etching the mold resin 49. Compared with the prior art, it is not necessary to etch the mold resin 49 in order to form a window for introducing light, and an etching process and a photolithography process associated therewith are not required. An increase in manufacturing cost can be suppressed. In addition, since it is not necessary to cause etching damage to the light receiving surface 16 of the IR element 10, it is possible to prevent a deterioration in the quality of light reception performance such as light transmission.

Furthermore, according to the first embodiment of the present invention, since the IR element 10 is not stacked on the IC element 20, the IR element 10 and the IC element 20 are not sealed with a resin including an interposer. The hybrid IR 100 having a small thickness can be manufactured by a relatively simple method.
In the first embodiment, the die pad region 34 of the lead frame 30 is set to the surface of the second portion 38 that has been half-etched (that is, the half-etched region 32a). For this reason, for example, the mounting position of the IC element 20 can be lowered as compared with the case where the IC element is mounted on a lead frame whose thickness is generally uniform (that is, the surface is not half-etched). it can. Thereby, the thickness of hybrid IR100 can be made thinner. Together with the above reverse bonding, it can contribute to further miniaturization and thinning of the hybrid IR100.

  Further, in the first embodiment, the IR element 10 and the IC element 20 are arranged in one package. For this reason, it is possible to shorten the distance between the IR element 10 and the IC element 20 as compared with the case where they are prepared separately and mounted on a wiring board such as an interposer, which contributes to an improvement in mounting density. can do. Further, since the number of parts for mounting on the wiring board can be reduced, the cost for mounting can be reduced. Furthermore, since all of the wiring (for example, the wire 46 shown in FIG. 9A) that electrically connects the IR element 10 and the IC element 20 can be sealed with the mold resin 49, the IR element 10 and the IC element 20 are sealed. The reliability of electrical connection with can be improved.

(2) Second Embodiment By the way, in the present invention, an optical filter having a function of selectively transmitting light having a desired wavelength (that is, having high transmittance) is disposed on the light receiving surface of the IR element. Only light in a desired wavelength range may be allowed to reach the light receiving surface by a filter. In this case, the optical filter may be attached to the light receiving surface of the IR element using, for example, an adhesive. Alternatively, an optical filter may be sandwiched between the lid and the IR element.

  14A to 14C are process diagrams showing a method for manufacturing the hybrid IR 200 according to the second embodiment of the present invention. In the second embodiment, a lid 70 is prepared as shown in FIG. The lid body 70 is different from the lid body 60 shown in FIGS. 5A and 5B, for example, in that a concave portion 67 for accommodating the IR element 10 is provided inside the lid body 60. The recess 67 has the same shape as the outer shape of the optical filter and has the same dimensions (actually slightly larger than the optical filter in order to easily fit the optical filter into the recess 67).

  Next, as shown in FIG. 14B, the optical filter 68 is fitted into the recess. As described above, the outer shape and dimensions of the recess correspond to the outer shape and dimensions of the optical filter 68. Therefore, by fitting the optical filter 68 into the recess, the attachment of the optical filter 68 and the alignment with the IR element 10 are completed at the same time. Since the shape and size of the recess correspond to those of the optical filter 68, the mounting operation of the optical filter 68 can be performed easily and with high accuracy.

  Next, as shown in FIG. 14C, a lid 70 in which the optical filter 68 is fitted is attached to the hybrid IR 100) packaged by dicing. The method of attaching the lid 70 is the same as that of the first embodiment, for example. That is, the inner side of the lid 60 faces the surface of the package, and in this state, the locking portion 63 is hooked on the second portion 38a of the lead frame 30 and stopped. Thereby, the hybrid IR having the optical filter 68 is completed.

  The type of the optical filter 68 is not particularly limited as long as it has a function of transmitting infrared rays. Or you may have a function which selectively permeate | transmits the infrared rays of a specific wavelength among infrared rays. For example, the optical filter 68 has a function of not transmitting infrared light having a long wavelength, a short wavelength, or both of the optical member and a thin film formed in a multilayer on the optical member. As a result of combining the transmission functions, it may have a function of transmitting only infrared rays having a specific wavelength.

The optical filter 68 may perform a function of transmitting only infrared rays having a specific wavelength, or may use a plurality of optical filters depending on circumstances. In addition, as a material of the optical member, a material that transmits predetermined infrared rays such as silicon (Si), glass (SiO ₂ ), sapphire (Al ₂ O ₃ ), Ge, ZnS, ZnSe, CaF ₂ , and BaF ₂ is transmitted. The thin film materials used and deposited on this include silicon (Si), glass (SiO ₂ ), sapphire (Al ₂ O ₃ ), Ge, ZnS, TiO ₂ , MgF ₂ , SiO ₂ , ZrO ₂ , Ta ₂ O ₅ or the like is used. In addition, the dielectric multilayer filter in which dielectrics having different refractive indexes are laminated in layers on the optical member may be formed on both sides with a predetermined thickness configuration different on the front and back sides, or formed only on one side. May be. Further, for the purpose of preventing unnecessary reflection, an antireflection film may be formed on the front surface, both surfaces on the back surface, or the outermost layer on one surface.

  As described above, according to the second embodiment of the present invention, only light in a desired wavelength range (for example, infrared rays or infrared rays having a specific wavelength among infrared rays) is allowed to reach the light receiving surface of the IR element 10. Since the light that can be detected and deviates from the wavelength range can be blocked by the optical filter 68, the S / N ratio of the electrical signal (that is, the infrared detection signal) output from the IR element 10 by photoelectric conversion is detected. Can be improved.

(3) Third Embodiment In the first and second embodiments described above, the case where the lid 60 is attached by hooking the locking portion 63 onto the lead frame 38 has been described. However, the present invention is not limited to this. For example, you may attach the cover body 60 to the upper surface of a package using an adhesive agent. Specifically, the configuration shown in FIGS. 15A to 15C may be used.

FIGS. 15A to 15C are a perspective view and a cross-sectional view showing a configuration example of a hybrid IR 300 according to the third embodiment of the present invention. FIG. 15A shows a state before the lid 60 is attached, and FIGS. 15B and 15C show a state after the lid 60 is attached.
In this hybrid IR 300, for example, the difference from the hybrid IRs 100 and 200 shown in FIGS. 1A and 1B and FIGS. 12A to 14C is the method of fixing the lid 60 to the lead frame 38. And only the structure of the lid 60 due to the difference in the fixing method.

  That is, as shown in FIG. 15C, in the third embodiment, the lid 60 is not provided with a locking portion, and the outer peripheral portion of the lead frame 30 is not fitted to the locking portion. . Instead, as shown in FIG. 15A, an adhesive 69 is applied to the upper surface 30a of the lead frame 30, and then the lid 60 is placed on the package to heat and cure the resin. Or although not shown in figure, the adhesive agent 69 is dripped at the inner surface of the cover body 60 (an optical filter may be attached previously), Then, the cover body 60 is mounted on a package, and resin is heat-hardened. By these methods, the lid 60 is fixed to the lead frame 30 as shown in FIGS.

  That is, the lid 60 is fixed to the lead frame 30 by interposing the adhesive 69 between the lid 60 and the upper surface 30 a of the lead frame 30. When the adhesive 69 is dropped on the inner surface of the lid 60, a slight dent (from the outside of the lid) is formed on the inner surface of the lid 60 in order to suppress spreading of the adhesive 69 around the periphery. If you see, you may give a slight bulge). Thus, even if it is the form using the adhesive agent 69, there can exist an effect similar to said 1st, 2nd embodiment.

Also in the form using the adhesive 69, the lid body 60 may have the guide portion 62. Since the guide portion 62 covers the side surface of the package, it is possible to prevent light from leaking from the side surface of the package to the IR element 10 side.
As can be seen by comparing FIG. 15B and FIG. 1A, in the third embodiment, the lid 60 is provided with an opening other than the opening 65 for limiting the viewing angle. It is not done. This is to prevent the adhesive 69 from protruding onto the lid 60 through the opening.
Such an embodiment using the adhesive 69 can also be applied to the discrete IR 400 described below.

(4) Fourth Embodiment In the first and second embodiments, the case where the present invention is applied to a hybrid IR in which an IR element and an IC element are mixedly mounted has been described. However, the present invention is not limited to this. The present invention is also applicable to individual parts for infrared detection (so-called discrete).
FIGS. 16A and 16B are a plan view and a cross-sectional view showing a configuration example of a discrete IR 400 according to the fourth embodiment of the present invention. FIG. 16A is a view showing the surface side (that is, the second surface side) of the discrete IR 400 before the lid body 70 is attached, and FIG. 16B is a view after the lid body 70 is attached. It is a figure which shows the cross section of discrete IR400.

  As shown in FIG. 16 (a), in this discrete IR 400, for example, in FIGS. 1 (a) and (b), FIGS. 12 (a) to 14 (c), and FIGS. 15 (a) to 15 (c). Differences from the illustrated hybrid IRs 100, 200, and 300 are that there is no IC element and that there is no die pad area on the lead frame for mounting the IC element. In the discrete IR 400, the IR element 10 and the bonding terminal portion 39 of the lead frame are electrically connected by a wire 46 made of Au or the like.

  Even with such a configuration, only the light incident from a desired angle and direction reaches the light receiving surface 16 of the IR element 10 and is detected by the viewing angle limiting opening 65 of the lid 70. be able to. Thereby, for example, it is possible to detect only directional light or to specify a light emission source. Further, by arranging the optical filter 68, only light in a desired wavelength range can be detected by reaching the light receiving surface of the IR element 10, and light outside the wavelength range is blocked by the optical filter 68. Therefore, for example, it is possible to improve the S / N ratio for infrared detection signals.

(5) 5th Embodiment Moreover, said 1st Embodiment demonstrated the case where the IR element 10 and the IC element 20 were electrically connected only via the wire 46 at the wire bonding process. However, in the present invention, the connection method between the IR element 10 and the IC element 20 is not limited to this.
FIG. 17 is a plan view showing a configuration example of a hybrid IR 500 according to the fifth embodiment of the present invention. As shown in FIG. 17, in the present invention, the pad electrodes 14a, 14b of the IR element 10 and the bonding terminal portion 40 of the lead frame 30 are electrically connected by a wire 46a made of Au or the like, and this bonding terminal The portion 40 and the pad electrode 27 of the IC element 20 may be electrically connected by a wire 46b made of Au or the like. That is, the IR element 10 and the IC element 20 may be electrically connected via the bonding terminal portion 40 of the lead frame 30. Even with this method, the same effects as those of the first embodiment can be obtained.

In addition, as shown in FIG. 17, when the IR element 10 and the IC element 20 are connected via the bonding terminal portion 40 of the lead frame 30, the connection between the IR element 10 and the bonding terminal portion 40, and The connection between the IC element 20 and the bonding terminal 40 is preferably performed by reverse bonding. That is, it is preferable to extend the wire 46 a from the bonding terminal portion 40 of the lead frame 30 toward the pad electrodes 14 a and 14 b of the IR element 10, and from the bonding terminal portion 40 of the lead frame 30 to the pad electrode 27 of the IC element 20. It is preferable to extend the wire 46b.
With such a method, the height of the wires 46a and 46b after bonding can be reduced as compared with the case of positive bonding, which can contribute to the reduction in size and thickness of the hybrid IR.

(6) Sixth Embodiment FIGS. 18A to 18D are a perspective view, a plan view, and a cross-sectional view showing a configuration example of a hybrid IR 600 according to a sixth embodiment of the present invention. 18A to 18C show a state before the lid 60 is attached, and FIG. 18D shows a state after the lid 60 is attached.
As shown in FIGS. 18A to 18D, the hybrid IR 600 includes, for example, a wiring board 70 such as an interposer, the IR element 10 mounted face down on the wiring board 70, and a face on the wiring board 70. The IC element 20 mounted up, the mold resin 49 that covers and seals the IR element 10 and the IC element 20 on the wiring board 70, and a lid that covers the upper surface of the mold resin 49 (ie, the upper surface of the package) 60.

  The IR element 10 and the wiring board 70 are electrically connected through, for example, the bump electrode 17. The IC element 20 and the wiring board 70 are electrically connected to a wire 45 made of Au or the like via an electrode 71 provided on the wiring board 70. That is, the IR element 10 and the IC element 20 are electrically connected via the wiring board 70, and the IC element 20 processes an electric signal output from the IR element 10.

  Also in this hybrid IR 600, as shown in FIG. 18 (c), the back surface (that is, the light receiving surface) 16 of the IR element 10 is arranged on the same plane as the top surface of the mold resin 69, and the mold resin 69 is placed. Is exposed from. The lid 60 is provided with a through opening 65 that limits the viewing angle of the light receiving surface 16 of the IR element 10. The lid body 60 is attached to the upper surface of the mold resin 49 by an adhesive 69, for example.

Even in such a configuration, only the light incident from a desired angle and direction reaches the light receiving surface 16 of the IR element 10 and is detected by the viewing angle limiting opening 65 of the lid 60. be able to. Therefore, as in the other embodiments, it is possible to detect only directional light or specify the light source.
The wiring board 70 includes a case where the wiring board 70 is manufactured by PLP (Plating Lead Package).

(7) Other Embodiments In the first embodiment, for example, as shown in FIG. 2A, a pair of pads is provided at the center of the surface of the IR element 10 as the pad part 14 of the IR element 10. Although the structure in which the electrodes 14a and 14b are arranged is shown, this is merely an example. In the present invention, the pad portion 14 of the IR element 10 may be composed of, for example, three or more pad electrodes that are spaced apart from each other at the center of the surface of the IR element 10. Further, the arrangement position of each pad electrode may be not the central portion of the surface of the IR element 10 but, for example, the peripheral portion of the light receiving unit 12. Even with such a configuration, the IR element 10 and the IC element 20 can be electrically connected, and an electrical signal can be output from the IR element 10.

  Furthermore, in each of the above embodiments, an IR element capable of detecting infrared rays of 2000 nm to 7400 nm is illustrated as an example of the optical sensor element. However, in the present invention, the optical sensor element is not limited to this. In the present invention, the optical sensor element may be, for example, an element that detects only ultraviolet rays, or may be an element that detects both ultraviolet rays and infrared rays.

  For example, in the photoelectric conversion element 13 in which an n layer, a π layer, a compound semiconductor layer having a larger band gap than the n layer and the π layer, and a p layer are sequentially stacked on the light transmitting substrate 11. If other materials such as AlN, InGaP, InGaAsP, and InAsSb are used for the n layer instead of InSb, it is possible to create an optical sensor element that can detect ultraviolet rays with a wavelength of about 250 nm to infrared rays with a wavelength of about 12 μm. It is. In such a case, an optical sensor device is provided that includes an optical sensor element that detects ultraviolet rays to infrared rays, and an IC element 20 that processes an electrical signal output from the optical sensor element, in one package. be able to.

  In this case, the optical filter 68 may also have a function of transmitting only ultraviolet rays, for example, or may transmit both ultraviolet rays and infrared rays. The wavelength range in which the optical filter 68 can be transmitted can be arbitrarily set according to the wavelength range that can be detected by the optical sensor element.

DESCRIPTION OF SYMBOLS 10 IR element 11 Light transmissive substrate 12 Light receiving part 13 Photoelectric conversion element 14 Pad part 14a Pad electrode 14b Pad electrode 15 Wiring 16 Back surface (light receiving surface)
17 Bump electrode 20 IC element 21 Signal processing circuit 22 Power supply circuit 23 Amplifying circuit 24 Judgment circuit 25 Reference value generating circuit 26, 27 Pad electrode 30, 30 'Lead frame 30a Upper surface (rear surface) of the lead frame
31 Through region 32a Half-etched region 32b Half-etched region 33a Non-etched region 33b Non-etched region 34 Die pad region 35 Region for placing IR element 36 Dicing street 37 First part 38 Second part 39, 40 Lead frame Bonding terminal section 41 Adhesive tape 42 Lead frame external wiring board connection terminal sections 45, 46, 46a, 46b Wire 47 Upper mold 48 Lower mold 49 Mold resin 49a Mold resin upper surface 60 Lid 61 Plate section 62 Guide Part 63 Locking part 65 Opening part 68 Optical filter 69 Adhesive 70 Wiring board 71 Electrode 100, 200, 300, 500 Hybrid IR
400 Discrete IR

Claims (10)

An optical sensor element for detecting light;
A sealing member covering the photosensor element;
A lead frame;
A lid fixed to the first surface of the lead frame,
The light receiving surface of the optical sensor element is exposed from the sealing member in a state of being arranged in the same plane as the first surface of the lead frame,
The optical sensor device according to claim 1, wherein the lid is provided with a through opening that limits a viewing angle of the light receiving surface.   The optical sensor device according to claim 1, further comprising an optical filter that covers the light receiving surface of the optical sensor element.   The concave portion corresponding to the outer shape and dimensions of the optical filter is provided around the opening of the lid, and the optical filter is accommodated in the concave portion. Optical sensor device. The lid is provided with a hook-shaped locking portion,
The said cover is being fixed to the said lead frame by the outer peripheral part of the said lead frame fitting to the said latching | locking part, The Claim 1 characterized by the above-mentioned. Optical sensor device. An adhesive interposed between the lid and the first surface of the lead frame,
The optical sensor device according to claim 1, wherein the lid is fixed to the lead frame by the adhesive. A semiconductor element for processing a signal output from the photosensor element;
The optical sensor device according to claim 1, wherein the semiconductor element is electrically connected to the lead frame and covered with the sealing member. The lead frame has a second surface opposite the first surface;
The optical sensor device according to claim 6, wherein the semiconductor element is attached to the second surface of the lead frame. A method of manufacturing an optical sensor device including an optical sensor element for detecting light using a lead frame,
Attaching the adhesive tape surface to the first surface of the lead frame;
A step of sticking the light receiving surface of the optical sensor element to the area exposed from the lead frame, which is the adhesive surface of the adhesive tape;
Electrically connecting the lead frame and the optical sensor element;
Covering the optical sensor element with a sealing member;
Removing the adhesive tape from the sealing member and the lead frame;
Cutting the sealing member and the lead frame to form a package;
Attaching a lid that covers the first surface of the lead frame, and
The method of manufacturing an optical sensor device, wherein the lid is provided with a through opening that restricts a viewing angle of the light receiving surface. A method for manufacturing an optical sensor device using a lead frame, comprising: an optical sensor element that detects light; and a semiconductor element that processes a signal output from the optical sensor element.
Attaching the adhesive tape surface to the first surface of the lead frame;
A step of sticking a light receiving surface of the photosensor element to a region exposed from the lead frame, the surface having the adhesive property of the adhesive tape;
Attaching the semiconductor element on a second surface opposite to the first surface of the lead frame;
Electrically connecting the lead frame and the semiconductor element;
Covering the optical sensor element and the semiconductor element with a sealing member;
Removing the adhesive tape from the sealing member and the lead frame;
Cutting the sealing member and the lead frame to form a package;
Attaching a lid that covers the first surface of the lead frame, and
The method of manufacturing an optical sensor device, wherein the lid is provided with a through opening that restricts a viewing angle of the light receiving surface. An optical sensor element for detecting light;
A sealing member covering the photosensor element;
A lid that covers the sealing member,
The light receiving surface of the photosensor element is exposed from the sealing member in a state of being arranged in the same plane as the upper surface of the sealing member,
The optical sensor device according to claim 1, wherein the lid is provided with a through opening that limits a viewing angle of the light receiving surface.

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