JPS6332446U - - Google Patents
Info
- Publication number
- JPS6332446U JPS6332446U JP12538086U JP12538086U JPS6332446U JP S6332446 U JPS6332446 U JP S6332446U JP 12538086 U JP12538086 U JP 12538086U JP 12538086 U JP12538086 U JP 12538086U JP S6332446 U JPS6332446 U JP S6332446U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- ion
- semiconductor wafer
- implanted
- ion implantation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005468 ion implantation Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000010884 ion-beam technique Methods 0.000 claims description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
Description
第１図は本考案に係る半導体製造用治具の一実
施例を示す正面図、第２図は第１図の一部の拡大
図、第３図は第２図のＡ―Ａ線に沿う断面図、第
４図及び第５図は第３図の部分でのイオン注入前
及びイオン注入後の断面図である。第６図は従来
の治具を使用した半導体製造装置（イオン注入装
置）の概略平面図、第７図は第６図の装置の一部
側面図、第８図は第６図の装置における治具の拡
大正面図である。
１……半導体ウエーハ、９……イオンビーム、
１６……治具（ウエーハホルダ）、１７……イオ
ン注入済み表示手段（形状記憶合金）。
Fig. 1 is a front view showing an embodiment of the semiconductor manufacturing jig according to the present invention, Fig. 2 is an enlarged view of a part of Fig. 1, and Fig. 3 is taken along line A-A in Fig. 2. 4 and 5 are cross-sectional views of the portion shown in FIG. 3 before and after ion implantation. FIG. 6 is a schematic plan view of a semiconductor manufacturing device (ion implantation device) using a conventional jig, FIG. 7 is a partial side view of the device shown in FIG. 6, and FIG. It is an enlarged front view of a tool. 1... Semiconductor wafer, 9... Ion beam,
16... jig (wafer holder), 17... ion implanted display means (shape memory alloy).
Claims (1)
保持する治具の所定部分に、半導体ウエーハのイ
オン注入前とイオン注入後における治具の温度変
化で表示状態が変わるイオン注入済み表示手段を
付設したことを特徴とする半導体製造用治具。 A feature is that an ion implanted display means is attached to a predetermined part of a jig that holds a semiconductor wafer to be implanted with an ion beam, and the display state changes depending on the temperature change of the jig before and after ion implantation of the semiconductor wafer. Jig for semiconductor manufacturing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12538086U JPH0449815Y2 (en) | 1986-08-15 | 1986-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12538086U JPH0449815Y2 (en) | 1986-08-15 | 1986-08-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6332446U true JPS6332446U (en) | 1988-03-02 |
| JPH0449815Y2 JPH0449815Y2 (en) | 1992-11-24 |
Family
ID=31018233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12538086U Expired JPH0449815Y2 (en) | 1986-08-15 | 1986-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0449815Y2 (en) |
-
1986
- 1986-08-15 JP JP12538086U patent/JPH0449815Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0449815Y2 (en) | 1992-11-24 |