JPS63317912A - Production of thin film magnetic head - Google Patents

Abstract

PURPOSE:To obviate formation of a plating film to unnecessary parts by previously coating a step relieving layer on a front face except the front end part of a 2nd electrode prior to formation of a conductor film for plating. CONSTITUTION:The step relieving layer 31 is previously formed on the front face except the front end part of the 2nd magnetic pole 16 prior to the formation of connecting terminal pads 21 of lead-out conductor wires led out of a conductor coil 15. The conductor film 18 for plating is deposited thereon and is succession a resist pattern 19 for mask plating is formed on the film 18. With this pattern 18 as a mask, the connecting terminal pads 21 are formed by electroplating on the film 18 exposed in apertures 20. The resist film in the shoulder part and projecting part of the 2nd magnetic pole 16 is, therefore, reduced in thickness and the abnormal formation of the plating film is the unnecessary parts is prevented.

Description

Detailed Description of the Invention [Summary] The present invention provides a method for manufacturing a thin film magnetic head used in a magnetic disk device, in which after forming a second magnetic pole, a thermosetting material is applied to the upper surface of the second magnetic pole except for the tip. By forming an insulating step-relaxing layer made of resin, the step shape on the surface including the second magnetic pole forming the conductor film for plating for forming the connection terminal pad and the resist pattern is smoothed, and the mask plating method is performed. This prevents abnormal formation of the plating film in areas other than the area where the connecting terminal pad is to be formed due to the stepped shape when forming the connecting terminal pad.

[Industrial application field]

The present invention relates to a method for manufacturing a thin-film magnetic head used in a magnetic disk drive, and in particular, when forming connection terminal pads by mask plating in areas where connection terminal pads are to be formed,
The present invention relates to a method for forming a connection terminal pad that prevents abnormal formation of a plating layer in areas other than the area where the pad is intended to be formed.

In magnetic disk drives, thin-film magnetic heads with high precision and high reliability are required as recording density increases.

In manufacturing thin-film magnetic heads, when forming connection terminal pads for lead-out conductors in conductor coils, etc. by mask plating, there is a noticeable step difference due to the laminated structure of magnetic poles, conductor coils, etc. on surfaces other than the areas where the pads are planned to be formed. Therefore, there is a need for a method for forming connection terminal pads that easily prevents the occurrence of such abnormal plating.

[Conventional technology]

A conventional method for manufacturing a thin film magnetic head is shown in Figure 2 (a).
), a substrate 11 that becomes a slider is shown.
A first magnetic pole 12 and a gear layer 1 are formed on the top by a well-known method.
3. A conductor coil 15 and a second magnetic pole 16 sandwiched between the interlayer insulating layers 14, and a lead-out conductor wire 17 (not shown) led out from the conductor coil 15 (described later) are sequentially formed in a predetermined pattern.

After that, the substrate 1 including the lead conductor wire 17 (not shown) is
A conductor film 18 for plating made of copper (Co) is deposited on the entire surface of the plating film 1 .

Next, as shown in FIG. 2 (bl), a resist pattern 19 having an opening 20 defining a region where a connection terminal band for the lead-out conductor wire 17 is to be formed is subsequently formed on the plating conductor film 18.

Next, as shown in FIG. 2(C), the resist pattern 1 is
Using 9 as a mask, a connection terminal pad 21 made of a copper plating layer is formed on the plating conductor film 18 exposed in the opening 20 by electrolytic plating.

Next, as shown in the plan view of FIG. 3 and the cross-sectional view of FIG. 4 taken along the cutting line A-A'' shown in FIG. Then, a protective film 22 is deposited by sputtering or the like on the entire surface of the substrate 11 on which the second magnetic pole 16, interlayer insulating layer 14, lead conductor wire 17, and connection terminal pad 21 are formed.

Thereafter, the surface of the protective film 22 is polished to expose the pad surface of each connection terminal pad 21 to enable bonding connection with an external lead wire.

[Problem that the invention seeks to solve]

By the way, in the method for manufacturing a thin film magnetic head as described above, a conductor film for plating is formed by a mask plating method in order to form the connection terminal pad 21 of the lead-out conductor wire 17 led out from the conductor coil 15, etc. A part of the surface has a step difference of about 20 μm due to the laminated structure of the thick magnetic poles 12, 16, the conductor coil 15 sandwiched between the interlayer insulating layers 14, and the like.

Therefore, if a resist pattern 19 for mask plating is formed on such a stepped surface, for example, the second magnetic pole 1
6, the thickness of the resist film on the shoulders and protrusions becomes extremely thin, and the conductive film 18 for plating is exposed at that part. When No. 21 was formed, there was a drawback that a plating film was abnormally formed on the shoulder portions and protrusion portions as shown by al+a2.

In view of the above-mentioned conventional drawbacks, the present invention has been developed to reduce the step shape in the plane on which the plating conductor film for forming the connection terminal pad is deposited by the mask plating method, and to reduce the plating deposited on the surface. When a resist pattern for mask plating is formed on a conductive film, this prevents the thickness of the resist film from decreasing on the stepped portion, and prevents the plating film from being deposited on unnecessary areas when forming connection terminal pads by mask plating. It is an object of the present invention to provide a method for manufacturing a thin film magnetic head that eliminates abnormal formation.

[Means for solving problems]

In order to achieve the above object, the present invention includes a first magnetic pole on a substrate,
Prior to sequentially laminating the gap layer, the conductor coil sandwiched between the eyebrow insulating layers, and the second magnetic pole, and forming a plating conductor film on the area where the connection terminal pad is to be formed, including the second magnetic pole,
The stepped surface excluding the tip of the second magnetic pole is coated in advance with an insulating step-relaxing layer made of, for example, thermosetting resin, and then a conductive film for plating and a resist pattern for mask plating are formed. Then, a connection terminal pad for a lead-out conductor wire led out from a conductor coil or the like is formed by a mask plating method.

[Effect]

In the method for manufacturing a thin film magnetic head of the present invention, prior to forming a conductor film for plating on the area where the connection terminal pad is to be formed, including the top of the second magnetic pole, on the step-shaped surface excluding the tip of the second magnetic pole, The step part is smoothed by coating with an insulating step-relaxing layer made of thermosetting resin, etc., so when forming a conductive film for plating and a resist pattern for mask plating, it will not be possible to create a step shape like the conventional step shape. This prevents the resist film from becoming partially thin or exposing the plating conductor film from the resist film.

As a result, when forming connection terminal pads by mask plating, it is possible to eliminate abnormal formation of a plating film in areas other than the area where the connection terminal pads are to be formed.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIGS. 1(a) to 1(d) are sectional views of essential parts showing an embodiment of a method for manufacturing a thin film magnetic head according to the present invention in order of steps.

First, as shown in FIG.
The first magnetic pole 12 is then
, a gear layer 13, a conductor coil 15 and a second magnetic pole 16 sandwiched between the interlayer insulating layer 14, and the conductor coil 15.
After sequentially forming thin drawer wires (not shown) derived from the above in a predetermined pattern, the tip of the second magnetic pole 16 is removed.
An insulating step-reducing layer 31 made of, for example, a thermosetting resin is selectively applied and formed on the step-shaped surface formed by the second magnetic pole 16, the interlayer insulating layer 14, etc., to smooth out the step portion.

Next, in the same manner as in the conventional process, as shown in FIG. 1 (C) on the plated conductor film 18.
As shown in FIG. 1, a resist pattern 19 having an opening 20 defining a region where a connection terminal pad for a lead conductor wire (not shown) is to be formed is formed.

Hidden feature 1: The thickness of the resist film at the stepped portion does not become thinner and the plating conductor film 18 does not become exposed from the resist film as in the conventional method.

Therefore, as shown in FIG. 1(d), using the resist pattern 19 as a mask, copper (Cu) electrolytic coating is performed on the plating conductor film 18 exposed in the opening 20, thereby making the connection. Since the Cu plating film is abnormally formed in a portion other than the area where the terminal pad is to be formed, it becomes possible to easily form the connection terminal pad 21 made of the Cu plating layer.

Thereafter, the resist pattern 19 and unnecessary plating conductor film 18 are selectively removed, and a protective film is deposited on the entire surface of the substrate 11 by sputtering or the like, and then the surface of the protective film is subjected to a surface polishing process. Each connection terminal pad 21
The pad surface of the terminal is exposed to enable a bonding connection with an external lead wire.

〔Effect of the invention〕

As is clear from the above description, according to the method for manufacturing a thin film magnetic head according to the present invention, the noticeable step shape on the surface on which the plating conductor film and resist pattern for forming the connection terminal band are formed can be smoothly eliminated. When a connecting terminal pad is formed by electrolytic plating, abnormal formation of a plating film on a portion other than the area where a connecting terminal band is to be formed is prevented.

Therefore, it has an excellent advantage of improving the manufacturing yield, and when applied to the manufacturing of this type of thin film magnetic head, a remarkable effect can be achieved.

[Brief explanation of drawings]

1(a) to 1(d) are cross-sectional views of main parts showing an embodiment of the method for manufacturing a thin film magnetic head according to the present invention in the order of steps; FIG. FIG. 3 is a plan view of the main parts for explaining the manufacturing method of a conventional thin film magnetic head; FIG. 1 is a cross-sectional view of the main part taken along the line. In FIGS. 1(a) to (d), 11 is a substrate, 12 is a first magnetic pole, 13 is a gap layer, and 14
1 is an interlayer insulating layer, 15 is a conductor coil, 16 is a second magnetic pole, 1
Reference numeral 8 denotes a conductive film for men, 19 a resist pattern, 20 an opening, 21 a connection terminal pad, and 31 a step relief layer. td+ Proof of misfire T inverted rho ■ Aikenketsu Plane C-1 Figure 3 Section 7F-A-HA' Cross section Figure 4

Claims (1)

[Claims] After sequentially laminating a first magnetic pole (12), a gap layer (13), a conductor coil (15) sandwiched between an interlayer insulating layer (14), and a second magnetic pole (16) on a substrate, A plating conductor film (
18) and forming connection terminal pads (21) by mask plating on the area where the connection terminal pads are to be formed, prior to forming the conductive film for plating (18), A method for manufacturing a thin film magnetic head, characterized in that the upper surface of the second magnetic pole (16) except for the tip thereof is coated with a step relaxation layer (31) in advance.