JPS633160U - - Google Patents
Info
- Publication number
- JPS633160U JPS633160U JP9618286U JP9618286U JPS633160U JP S633160 U JPS633160 U JP S633160U JP 9618286 U JP9618286 U JP 9618286U JP 9618286 U JP9618286 U JP 9618286U JP S633160 U JPS633160 U JP S633160U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- heat
- insulating tape
- resistant insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9618286U JPS633160U (sv) | 1986-06-23 | 1986-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9618286U JPS633160U (sv) | 1986-06-23 | 1986-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS633160U true JPS633160U (sv) | 1988-01-11 |
Family
ID=30961641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9618286U Pending JPS633160U (sv) | 1986-06-23 | 1986-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS633160U (sv) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11345895A (ja) * | 1998-06-01 | 1999-12-14 | Matsushita Electron Corp | 半導体装置、リードフレーム、及びそれらの製造方法 |
-
1986
- 1986-06-23 JP JP9618286U patent/JPS633160U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11345895A (ja) * | 1998-06-01 | 1999-12-14 | Matsushita Electron Corp | 半導体装置、リードフレーム、及びそれらの製造方法 |