JPS6331568U - - Google Patents
Info
- Publication number
- JPS6331568U JPS6331568U JP1986125038U JP12503886U JPS6331568U JP S6331568 U JPS6331568 U JP S6331568U JP 1986125038 U JP1986125038 U JP 1986125038U JP 12503886 U JP12503886 U JP 12503886U JP S6331568 U JPS6331568 U JP S6331568U
- Authority
- JP
- Japan
- Prior art keywords
- electric circuit
- soldered
- electronic parts
- baking
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Details Of Television Systems (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
図面はこの考案の実施例を示すものであつて、
第１図はビデオ用リモコンの外観図、第２図は第
１図Ａ―Ａ線に沿う長手方向縦断面図、第３図は
底ケース内面に電気回路を構成した実施例の斜視
図、第４図はその回路に電子パーツをハンダ付け
した状態の部分拡大図である。
１……電子機器、２……底ケース、２ａ……内
面、３……電気回路、４……電子パーツ、５……
普通ハンダ、６……フイルムカバー。
The drawings show an embodiment of this invention,
Fig. 1 is an external view of the video remote control, Fig. 2 is a longitudinal cross-sectional view taken along the line A-A in Fig. 1, Fig. 3 is a perspective view of an embodiment in which an electric circuit is configured on the inner surface of the bottom case, Figure 4 is a partially enlarged view of the circuit with electronic parts soldered to it. 1...Electronic equipment, 2...Bottom case, 2a...Inner surface, 3...Electric circuit, 4...Electronic parts, 5...
Normal solder, 6...film cover.
Claims (1)
性インキが所要厚み印刷され、かつ所要の温度で
焼付け乾燥されて電気回路を設けられると共に、
この電気回路に電子パーツがハンダ付けされて取
付けられる、ことを特徴とする電子機器の電気回
路装置。 Conductive ink is printed to the required thickness on the inner surface of the case made of heat-resistant synthetic resin material, and an electrical circuit is installed by baking and drying at the required temperature.
An electric circuit device for electronic equipment, characterized in that electronic parts are soldered and attached to the electric circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986125038U JPS6331568U (en) | 1986-08-15 | 1986-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986125038U JPS6331568U (en) | 1986-08-15 | 1986-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6331568U true JPS6331568U (en) | 1988-03-01 |
Family
ID=31017589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986125038U Pending JPS6331568U (en) | 1986-08-15 | 1986-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6331568U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60234393A (en) * | 1984-05-07 | 1985-11-21 | ダイソー株式会社 | Circuit board and method of producing same |
-
1986
- 1986-08-15 JP JP1986125038U patent/JPS6331568U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60234393A (en) * | 1984-05-07 | 1985-11-21 | ダイソー株式会社 | Circuit board and method of producing same |