JPS6331557U - - Google Patents

Info

Publication number
JPS6331557U
JPS6331557U JP1986124763U JP12476386U JPS6331557U JP S6331557 U JPS6331557 U JP S6331557U JP 1986124763 U JP1986124763 U JP 1986124763U JP 12476386 U JP12476386 U JP 12476386U JP S6331557 U JPS6331557 U JP S6331557U
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting device
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986124763U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986124763U priority Critical patent/JPS6331557U/ja
Publication of JPS6331557U publication Critical patent/JPS6331557U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986124763U 1986-08-14 1986-08-14 Pending JPS6331557U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986124763U JPS6331557U (fr) 1986-08-14 1986-08-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986124763U JPS6331557U (fr) 1986-08-14 1986-08-14

Publications (1)

Publication Number Publication Date
JPS6331557U true JPS6331557U (fr) 1988-03-01

Family

ID=31017079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986124763U Pending JPS6331557U (fr) 1986-08-14 1986-08-14

Country Status (1)

Country Link
JP (1) JPS6331557U (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (fr) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. Dispositif a element solide et son procede de production
JPWO2004082036A1 (ja) * 2003-03-10 2006-06-15 豊田合成株式会社 固体素子デバイスおよびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196780A (ja) * 1984-10-17 1986-05-15 Stanley Electric Co Ltd Ｌｅｄチツプのコ−テイング方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196780A (ja) * 1984-10-17 1986-05-15 Stanley Electric Co Ltd Ｌｅｄチツプのコ−テイング方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (fr) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. Dispositif a element solide et son procede de production
JPWO2004082036A1 (ja) * 2003-03-10 2006-06-15 豊田合成株式会社 固体素子デバイスおよびその製造方法

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