JPS63313672A - Plasma arc working method - Google Patents

Abstract

PURPOSE:To accurately perform plasma arc working with the high accuracy by noting a notation line by fluorescent material to generate fluorescence by a plasma arc beam and performing the working while observing the notation line via a filter to pass only a desired wavelength band of the fluorescences to generate at the time of working. CONSTITUTION:The notation line 2 is noted on a work 1 by the fluorescent material. Since the notation line 2 is stimulated by the plasma arc beam to generate fluorescence and the filter 4 passes only the desired wavelength band of fluorescences, the notation line 2 becomes brightest to a visual field of a worker. By this method, a state in the vicinity of the working position can be clearly grasped by a light and dark state of apart to be observed and the plasma arc working with high accuracy can be accurately performed.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a plasma arc processing method in which a workpiece is processed while moving a plasma arc processing tool along marked lines marked on the workpiece.

<Prior Art> Generally, when performing plasma arc machining work, for example plasma arc cutting work, prior to the cutting work, a wire is used to form a line to be cut. A marking operation is being carried out to mark the marking lines to be marked as so-called marking lines.

Traditionally, these marking lines were marked with limestone or sharp metal tools.

<Problems to be Solved by the Invention> However, during tC during plasma arc cutting, a so-called light-shielding surface is used to protect the eyes of the operator;
This light-shielding surface blocks the high-intensity arc light near the arc generation, so when observing through the four-light surface, the position far from the plasma arc is extremely dark. The fact is that the marking lines marked with sharp metal tools or the like are too dark to be seen when observed through a light-shielding surface, which has the disadvantage that high-precision plasma arc processing cannot be performed.

<Means for Solving the Problems> In order to solve the above-mentioned drawbacks, the present invention provides a plasma arc machining method in which a workpiece is machined while moving a plasma arc machining tool along a marked line marked on the workpiece. In,
The marked line is marked with a phosphor that emits fluorescent light by plasma arc light, and the marked line is observed through a filter that transmits only a desired wavelength band of the fluorescent light generated during plasma arc processing. Characterized by processing.

The marking line marked with the phosphor described above is stimulated by plasma arc light to emit fluorescent light, and only the desired wavelength band of this fluorescent light is transmitted, so that the operator's visual field does not see the plasma arc The marked line portion emitted by the light tC becomes the brightest. That is, if the plasma arc light is used as a reference, the marked line portion near the plasma arc light appears bright, and the plasma processing tool appears dark. As described above, the situation in the vicinity of the processing position can be clearly grasped from the bright and dark state of the beam part. Therefore, high-precision plasma arc processing can be performed accurately.

<Examples> The present invention will be described in detail below with reference to illustrated embodiments.

In FIG. 1 and FIG. 2, 1 is a workpiece.

For example, the object to be cut 2 is a marking line marked on the object to be cut 1, and is formed by spraying liquid fluorescent paint, for example.

Reference numeral 3 designates a plasma arc processing tool 1, such as a manually operated plasma arc cutting torch, and 4 a filter that transmits only light in a desired wavelength band.

The solid line shown in FIG. 2 1c shows the results of measuring the spectral intensity distribution of plasma arc light generated during plasma arc processing, with the horizontal axis representing the wavelength and the vertical axis representing the specific intensity.

The dotted line shown in FIG. 2 shows the result of measuring the spectral intensity distribution of fluorescence emitted when the marked line marked with fluorescent paint is irradiated with plasma arc light. In the illustrated case, the fluorescent paint, ie, the phosphor, is formed by mixing various fluorescent substances. The filter 4 transmits only the wavelength band in which the spectral intensity of the plasma arc light is relatively weak (and the spectral intensity of the fluorescent light is relatively strong). In the case where the plasma arc light is formed, fluorescent light of various wavelengths is emitted by the plasma arc light. For example, in the case shown in Figure 1, the filter 4 is selected so that light in a wavelength band of around 600 mμ is transmitted through the filter 4. That is, the spectral intensity of the plasma arc light is strong on the short wavelength side up to about 550 mμ, so in order to protect the eyes of one worker, the plasma arc light on the short wavelength side is blocked by the filter 4. Light in a wavelength band where the spectral intensity of the plasma arc light is relatively weak is transmitted through the filter 4 and observed, but visible light with wavelengths above 570 m is not observed because it is easy to distinguish with the eye, such as yellow, orange, and red. It can be done easily.

For example, when observing the vicinity of the cut using a filter 600 mμ ± 13 mμ (half-value width) manufactured by Japan Vacuum Optical Co., Ltd. @MIF-3, the plasma arc is orange, and the above marked line near the cut is plasma arc. It was possible to understand it as a clearer orange color than the arc part. For this reason, it was possible to accurately perform plasma processing while clearly grasping the situation near the processing position.

In the above, the phosphor for marking one marking line can be in a solid state such as fluorescent chalk or thermosetting powder, or in a pen-like liquid state. Of course, the fluorescent light emitted from the plasma arc light source differs depending on the substance contained in the phosphor.

The transmission wavelength band of the filter can be selected in an appropriate range of 570 mμ or more. In this case, when the transmission wavelength band is as close as possible to 700 mμ, is it possible to pass light in the wavelength band with a certain distortion? A so-called cut-on filter can be used.

Note that it is preferable to use a so-called light shielding device to darken the field of view as necessary.

Moreover, the above-mentioned marking line can be a plasma arc welding line. , Rough I (When a plasma arc machining worker is supported by a guide jig and the guide jig is moved during processing, the above marking line can be used to confirm the guide jig.

<Effects of the Invention> As is clear from the above explanation, only the desired wavelength band passes through the filter, and by observing the plasma arc light and the marked line portion emitted by the plasma arc light, the situation near the processing position can be determined. It is possible to understand 611 details. Therefore, high-purity plasma arc processing can be performed appropriately.

[Brief explanation of drawings]

Claims (1)

[Claims] (1) In a plasma arc machining method in which a plasma arc machining tool is moved along a marking line marked on a workpiece while processing, the marking line is marked with a phosphor that emits fluorescence by plasma arc light, and the marking line is marked with a A plasma arc processing method in which processing is performed while observing the marking line through a filter that transmits only a desired wavelength band of the fluorescent light generated during arc processing.