JP2581081B2 - Plasma arc processing method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a plasma arc processing method in which an operator performs processing while moving a plasma arc processing tool along a notation line indicated on a workpiece.

<Prior Art> In general, when performing a plasma arc processing operation, for example, a plasma arc cutting operation, prior to the cutting operation, a marking operation for marking a so-called marking line corresponding to a line to be cut is performed. Is being done.

Conventionally, this marking line is represented by limestone, sharp metal fittings, or the like.

<Problems to be Solved by the Invention> However, at the time of plasma arc cutting, a so-called light-shielding surface is used to protect an operator's eyes.
Since the light-shielding surface shields high-luminance arc light near the arc, the position far from the plasma arc becomes extremely dark when observed through the light-shielding surface.
For this reason, marking lines written with limestone or sharp metal fittings are dark and invisible when observed through a light-shielding surface, which has the disadvantage that high-precision plasma arc processing cannot be performed. Was.

<Means for Solving the Problems> In order to solve the above-mentioned drawbacks, a configuration of the present invention provides a plasma arc processing method in which an operator moves a plasma arc processing tool along a notation line written on a workpiece. In the processing method, the spectral wavelength is 570mμ to
The notation line is indicated by a phosphor containing at least a substance that emits fluorescence of 700 mμ, and of the plasma arc light generated during plasma arc processing and the fluorescence, a desired wavelength within a spectral wavelength of 570 mμ to 700 mμ. It is characterized in that processing is performed while visually observing the notation line through a filter that transmits only the band.

<Function> The notation line described by the above-mentioned phosphor is stimulated by long-wavelength ultraviolet light represented by 365 mμ of the plasma arc light to emit fluorescent light, and the spectral wavelength of the fluorescent light and the plasma arc light Transmit only a desired wavelength band within 570 mμ to 700 mμ.

That is, when focusing on the plasma arc light, since the plasma arc light transmitted through the filter and having a spectral wavelength of 570 μm to 700 mμ is a visible light having a comparatively weak spectral intensity, the operator can operate the plasma arc light with the eyes protected. The processed part can be observed.

Further, the spectral wavelength transmitted through the filter is 570 mμ to 70
The spectral intensities of the fluorescent light and the plasma arc light within 0 mμ are different from each other except for a specific wavelength, and the fluorescent light and the plasma arc light transmitted through the filter are in a desired wavelength band. By observing this light, the fluorescent light and the plasma arc light having different spectral intensities can be clearly distinguished from each other.

As described above, the situation near the processing position can be clearly grasped based on the light / dark state of the observed portion, and therefore, high-accuracy plasma arc processing can be performed accurately.

Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

1 and 2, reference numeral 1 denotes a workpiece, for example, a workpiece, and reference numeral 2 denotes a notation line on the workpiece 1, for example, a substance that emits fluorescent light having a spectral wavelength of 570 to 700 m when excited. Is formed by spraying a liquid fluorescent paint containing at least 3 is a plasma arc processing tool,
For example, the plasma arc cutting torch 4 for manual operation is a filter that transmits only light in a desired wavelength band.

The solid line shown in FIG. 2 shows the result of measuring the spectral intensity distribution of the plasma arc light generated during the plasma arc processing. The horizontal axis represents the wavelength and the vertical axis represents the specific intensity.

The dotted line shown in FIG. 2 shows the result of measurement of the spectral intensity distribution of the fluorescent light emitted when the line drawn with the fluorescent paint is irradiated with the plasma arc light. In the case shown, the spectral wavelength is 57
The phosphor containing at least a substance that emits fluorescence of 0 to 700 mμ is formed by mixing various fluorescent substances.

The filter 4 blocks only the wavelength band where the spectral intensity of the plasma arc light is strong, while transmitting only the plasma arc light whose spectral intensity is relatively weak and the wavelength band where the spectral intensity of the fluorescent light is relatively strong.

As described above, the spectral wavelength is 570mμ to 700mμ by excitation.
A phosphor containing at least a substance that emits fluorescence of
When formed by confusion of various fluorescent substances, fluorescent light of various wavelengths is emitted by long-wave ultraviolet rays represented by 365 mμ of the plasma arc light. For example, in the case of the drawing, the filter 4 is selected so that light in a wavelength band of about 600 μm passes through the filter 4. That is, although the spectral intensity of the plasma arc light is strong on the short wavelength side up to about 550 mμ, the plasma arc light on the short wavelength side is blocked by the filter 4 to protect the eyes of the operator.

The light in the wavelength band where the spectral intensity of the plasma arc light is relatively weak is transmitted through the filter 4 and observed.
Visible light of 570 mμ or more can be easily observed by the eye because it is easily distinguished by eyes like yellow, orange and red.

Now, for example, when observing the vicinity of the cut portion using a 600 mμ ± 13 mμ (half-width) MIF-S type filter manufactured by Japan Vacuum Optical Co., Ltd., the plasma arc portion is orange, and the above-mentioned notation line near the cut portion is plasma. It could be recognized as a clearer orange color than the arc part.

For this reason, it was possible to accurately perform the plasma processing while clearly grasping the situation near the processing position.

In the above, the phosphor containing at least a substance that emits fluorescent light having a spectral wavelength of 570 mμ to 700 mμ upon excitation for expressing the notation line may be a solid such as a fluorescent chalk or a thermosetting powder. Or a pen-like liquid. Of course, the fluorescence emitted by the plasma arc light varies depending on the substance contained in the phosphor, so that the transmission wavelength band of the filter can be selected in an appropriate region of 570 mμ or more. In this case, when the transmission wavelength band is as close to 700 mμ as possible, a filter that transmits light of a desired wavelength band or more, a so-called cut-on filter can be used. In addition, it is preferable to use a so-called light-shielding device that appropriately darkens the visual field as needed.

Further, the notation line can be a plasma arc welding line. Further, when the plasma arc processing tool is supported by a guide jig and the guide jig is moved to perform processing, the above-described notation line can be used for confirming the guide jig.

As described above, when focusing on the plasma arc light, the plasma arc light transmitted through the filter and having a spectral wavelength of 570 mμ to 700 mμ is a visible light having a relatively weak spectral intensity, so that the worker is protected from eyes. The plasma arc processed part can be observed.

Further, the spectral wavelength transmitted through the filter is 570 mμ to 70
The spectral intensities of the fluorescent light and the plasma arc light within 0 mμ are different from each other except for a specific wavelength, and the fluorescent light and the plasma arc light transmitted through the filter are in a desired wavelength band. By observing this light, the fluorescent light and the plasma arc light having different spectral intensities can be clearly distinguished from each other.

As described above, the situation near the processing position can be clearly grasped based on the light / dark state of the observed portion, and therefore, high-accuracy plasma arc processing can be performed accurately.

<Effect of the Invention> As is apparent from the above description, the spectral wavelength is 570 mμ or more.
Only light in the desired wavelength band within 700 mμ is transmitted through the filter, and the transmitted plasma arc light having a relatively weak spectral intensity and the notation line portion emitted by the plasma arc light are visually observed, The operator can clearly distinguish the fluorescent light and the plasma arc light having different spectral intensities while protecting the eyes, and can clearly grasp the situation near the processing position.

Therefore, high-precision plasma arc processing can be performed accurately.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an embodiment of the present invention, and FIG. 2 shows the results of measuring the respective spectral intensities of plasma arc light generated by the configuration shown in FIG. 1 and fluorescence generated by the plasma arc light. FIG. 2 ... notation lines written by phosphors 3 ... plasma arc processing tools 4 ... filters

Claims (1)

(57) [Claims] 1. A plasma arc machining method in which an operator moves a plasma arc machining tool along a notation line indicated on a workpiece to emit fluorescent light having a spectral wavelength of 570 to 700 mμ by plasma arc light. The marking line is indicated by a phosphor containing at least a substance to be filtered, and a filter that transmits only a desired wavelength band having a spectral wavelength of 570 mμ to 700 mμ among the plasma arc light generated during the plasma arc processing and the fluorescence. A plasma arc processing method for processing while visually observing the notation line through the method.