JPS63311795A - Metal core laminated board - Google Patents
Metal core laminated boardInfo
- Publication number
- JPS63311795A JPS63311795A JP14844987A JP14844987A JPS63311795A JP S63311795 A JPS63311795 A JP S63311795A JP 14844987 A JP14844987 A JP 14844987A JP 14844987 A JP14844987 A JP 14844987A JP S63311795 A JPS63311795 A JP S63311795A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- hole
- resin
- metal plates
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 49
- 239000002184 metal Substances 0.000 title claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 239000004840 adhesive resin Substances 0.000 claims description 12
- 229920006223 adhesive resin Polymers 0.000 claims description 12
- 230000007547 defect Effects 0.000 abstract description 6
- 238000010292 electrical insulation Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 1
- 239000011888 foil Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000257465 Echinoidea Species 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
［技術分野１
本発明は、プリント配置線板として用いられ、（ベコア
稙／Ｌ！板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field 1] The present invention relates to a (Bekoa Tan/L! board) which is used as a printed wiring board.
［背景技術］
プリント配ｍ板において金属板をコアとす属コア稙屑板
は、金属板による放熱性や磁ンルド性、強度等の特徴を
利用して多用されるでいる。この−＆ｌ・ルコア禎層板
は、第３図に／］：うに通゛孔１を？股した金属板２の
両面に接着樹脂シート１０を介して銅箔などの金属箔１
２を接着させると共に接着樹脂シート１０に含まれる樹
脂の一部を金属板２の通孔１内に流入させてこの樹脂４
で通孔１内を充填させ、そして通孔１内にお通孔 い
て樹脂４の部分にスルーホールを１’Ｓ通形成する接着
ことによって作成され、さらｌこ金属１＋’ｉ１
２に′エラ板の チングによって回路形成すると共
にスルーホールにス の内周面にスルーホールメッキ
を施すことに五っ徴と プリント配線板として形成
されている。[Background Art] In printed wiring boards, metal core scrap boards, which have a metal plate as a core, are widely used by taking advantage of the heat dissipation properties, magnetic properties, strength, and other characteristics of the metal plate. This -&l. Lucoa laminate is shown in Figure 3/]: Sea urchin through hole 1? A metal foil 1 such as copper foil is applied to both sides of the crossed metal plate 2 via an adhesive resin sheet 10.
This resin 4 is bonded together with a part of the resin contained in the adhesive resin sheet 10 flowing into the through hole 1 of the metal plate 2.
The inside of the through hole 1 is filled with the through hole 1, and a through hole is formed through the resin 4 through the through hole 1.
2) A printed wiring board is formed by forming a circuit by etching the gill board and by plating the inner circumferential surface of the through hole.
この金属コア積層板にあって、金属板２に通孔１を形成
するにあたってエツチング方式でおこなうと、金属板２
は所定の厚みを有するために孔径る金 が厚さ方向で
大きく異なるという問題があり、そこで従来ではパンチ
ングによって通孔１の加工がおこなわれている。しかし
このように厚みのあるる會 金属板２にパンチング加
工するにあたってはト１シー φ以下程度の小さい孔
あけをすることができず、に至っ 通孔１の径が大きく
なって従って通孔１の位置ですよ 形成されるスルー
ホールの間隔が大さくなり、配＃ｌ密度の高いち密パタ
ーンて゛回路形成することが困難になるという問題があ
った。また厚みの厚い金属板２の通孔１に樹ＩＩけ４を
充４（不足なく充填することは困難であって、通孔１内
にボイｒが生じて′スルーホールの内周と−に載板２と
の開の電気絶縁不良が発生するおそれがあるという問題
もあった。In this metal core laminate, if the etching method is used to form the through hole 1 in the metal plate 2, the metal plate 2
Since the metal has a predetermined thickness, there is a problem in that the diameter of the hole differs greatly in the thickness direction, so conventionally the through hole 1 has been formed by punching. However, when punching a thick metal plate 2 like this, it is not possible to make holes as small as the diameter of the sheet 1, which results in the diameter of the through hole 1 becoming larger. There was a problem in that the distance between the formed through holes became large, making it difficult to form a circuit with a dense pattern with high wiring density. In addition, the through hole 1 of the thick metal plate 2 is filled with wood 4 (it is difficult to completely fill the through hole 1, and a boil is generated in the through hole 1, and the inner periphery of the through hole and the There was also the problem that there was a risk of electrical insulation failure between the plate and the mounting plate 2.
［発明の目的］
本発明は、上記の点に鑑みて為されたものであり、金属
板に小径の通孔を形成することが可能になり、しかもス
ルーホールの電気絶縁不良が発生するおそれのない金属
コア積層板を提供することをｌｉ的とするものである。[Object of the Invention] The present invention has been made in view of the above points, and makes it possible to form small-diameter through holes in a metal plate, while also eliminating the risk of electrical insulation failure in the through holes. It is an object of the present invention to provide a metal core laminate with no metal core.
Ｅ発明の開示１
しかして本発明に係る金属コア積層板は、通孔１を穿設
した複数枚の金属板２を各通孔１を合致させた状態で接
着樹脂層３を介して積層接着すると共に接着樹脂層３の
一部の樹脂４を各金属板２の通孔１に充填させ、通孔１
内においてＩ！脂４の部分にスルーホール５を貫通して
穿設して成るこ畜を一泣調倉射晴：７−Ｌ１（１か春暑
グ帽惰ｔ？ｙの令鳳とを特徴とするものであり、複数枚
の金属板２を積層接着して用いるようにすることで各金
属板２として厚みの薄いものを使用することができるよ
うにし、もって上記目的を達成したものであって以下本
発明を実施例により詳述する。Disclosure 1 of the Invention The metal core laminate according to the present invention is produced by laminating and bonding a plurality of metal plates 2 having through holes 1 through an adhesive resin layer 3 with the through holes 1 aligned. At the same time, some of the resin 4 of the adhesive resin layer 3 is filled into the through holes 1 of each metal plate 2, and the through holes 1 are
Inside I! A through-hole 5 is drilled through the fat part 4 to create a beast made by passing through the hole 5. By laminating and bonding a plurality of metal plates 2, it is possible to use a thin metal plate 2, thereby achieving the above purpose. The invention will be explained in detail by way of examples.
金属板２としてはアルミニウム板、鉄叛、インバー板な
ど金属であれば任意のものを用いることができ、複数枚
の金属板２にはそれぞれ同じ位置で同じ大きさの通孔１
が穿設しである。この金属板２は複数枚を合わせた厚み
が第３図の金属板２の厚みに相当すればよいので、一枚
づつの厚みは薄くてよい。従ってエツチング方式で孔あ
けして通孔１・を形成することが可能になり、小さな径
で通孔１を形成することが可能になる。もちろんパンチ
ングによって孔あけすることもできるものであり、この
場合でも金属板２が薄いために通孔１を小さな径で形成
することが可能になる。As the metal plate 2, any metal such as an aluminum plate, a steel plate, or an invar plate can be used, and each of the plurality of metal plates 2 has a through hole 1 of the same size at the same position.
is perforated. Since the combined thickness of a plurality of metal plates 2 only needs to correspond to the thickness of the metal plate 2 shown in FIG. 3, the thickness of each metal plate may be thin. Therefore, it becomes possible to form the through hole 1 by etching, and it becomes possible to form the through hole 1 with a small diameter. Of course, the holes can also be made by punching, and even in this case, since the metal plate 2 is thin, the through holes 1 can be formed with a small diameter.
モしてｔｐＪ２図（ａ）に示すように上記各金属板２を
通孔１を上下に合致させた状態で接着樹脂シート１０を
介して重ね゛ると共に外層の金属板２の外１＋−ｔ＋１
−４ｎ−ｒ：ＭｔＪｊｒＦＩｉｓ＋”’ｙ１１−＋＋＋
ｎ−Ｊ、、。tpJ2 As shown in FIG.
-4n-r: MtJjrFIis+”'y11-+++
n-J,.
箔１２を重ね、これを加熱加圧成形することによって、
＠２図（１〕）に示すように接着樹脂シート１０の融着
８４である接着樹脂層３で各金属板２及び金属箔１２を
積Ｒ’！接着することができる。またこのように加熱加
圧成形をする際に、接着樹脂シート１０に含有される樹
脂４が流れて各金属板２の通孔１内に充填される。各金
属板２は厚みを薄く形成することができるために、しか
も通孔１は小さな径で形成することができるために、各
通孔１内に樹脂４を充填不良なく充填させることがでべ
ろ。By overlapping the foils 12 and molding them under heat and pressure,
@2 As shown in Figure (1), each metal plate 2 and metal foil 12 are laminated R'! with the adhesive resin layer 3, which is the fusion bond 84 of the adhesive resin sheet 10. Can be glued. Further, when hot-pressing molding is performed in this way, the resin 4 contained in the adhesive resin sheet 10 flows and fills the through holes 1 of each metal plate 2. Since each metal plate 2 can be formed with a small thickness and the through holes 1 can be formed with a small diameter, it is possible to fill each through hole 1 with the resin 4 without any filling defects. .
ここで、接着樹脂シー）１０としては例えば、〃ラス布
などの擢材にフェノール樹脂やエポキシ樹脂、ポリイミ
ドなどの熱硬化性樹脂を含浸して乾燥させたプリプレグ
を用いることができる。Here, as the adhesive resin sheet 10, for example, prepreg, which is obtained by impregnating a fiber material such as lath cloth with a thermosetting resin such as phenol resin, epoxy resin, or polyimide and drying it, can be used.
このようＭ １１４成形して接着樹脂Ｗ１３や８４ＢＷ
４を硬化させたのちに、各金属板２の各通孔１に亘って
樹脂４の部分にＮＣドリル加工などでスルーホール５
ヲｆ孔する。スルーホール５は金属板２に接触しないよ
うに形成されるのであり、こののちシこ、スルーホール
）の門閥ｕＩ］ｌ二人ルー小−ル／ツキ１１を施すと共
に金属箔１２をエツチング加工して回路１４を形成する
ことによって、第１図に示すようなプリント配線板とし
て仕上げることができる。M114 molded like this and adhesive resin W13 or 84BW
4 is cured, through-holes 5 are formed in the resin 4 by NC drilling etc. over each through-hole 1 of each metal plate 2.
Open the hole. The through hole 5 is formed so as not to come into contact with the metal plate 2, and later, the through hole) is applied with two-man rule 11 and the metal foil 12 is etched. By forming the circuit 14, a printed wiring board as shown in FIG. 1 can be completed.
［発明の効果１
上述のように本発明にあっては、通孔を穿設した複数枚
の金属板を各通孔を合致させた状態で接着ム（脂層を介
して積層接着するようにしたので、各金属板は一枚づつ
の厚みが薄くてよく小さな径で通孔を形成することが可
能になって、配線密度の高いプリント配線板に加工する
ことができるものであり、しかもこのように各金属板は
厚みを薄く形成することができるために、各通孔内に樹
脂を充填不良なく充填させることができ、通孔内にボイ
ドが生じてスルーホールの内周と金属板との間に電気絶
縁不良が発生することを防止することができるものであ
る。[Effect of the invention 1 As described above, in the present invention, a plurality of metal plates having through holes are bonded together (by laminating and bonding through a fat layer) with the through holes aligned. As a result, each metal plate is thin and allows holes to be formed with small diameters, making it possible to process printed wiring boards with high wiring density. As each metal plate can be formed to be thin, each through hole can be filled with resin without any filling defects, and voids may occur in the through hole and the inner periphery of the through hole and the metal plate may overlap. This can prevent electrical insulation defects from occurring between the two.
ｔｔＳ１図は本発明の一実施例の一部の断面図、第２図
（ａ）（ｂ）は同上の製造の各工程部分を示す断面図、
第３図は従来例の断面図である。
１は通孔、２は金λ式板、３は接着樹脂層、４は樹脂、
５はスルーホールである。ttS1 is a sectional view of a part of an embodiment of the present invention, and FIGS. 2(a) and 2(b) are sectional views showing each step of the manufacturing process,
FIG. 3 is a sectional view of a conventional example. 1 is a through hole, 2 is a gold lambda plate, 3 is an adhesive resin layer, 4 is a resin,
5 is a through hole.
Claims (1)
せた状態で接着樹脂層を介して積層接着すると共に接着
樹脂層の一部の樹脂を各金属板の通孔に充填させ、通孔
内において樹脂の部分にスルーホールを貫通して穿設し
て成ることを特徴とする金属コア積層板。(1) Laminate and bond multiple metal plates with through holes through the adhesive resin layer with the through holes aligned, and apply some resin from the adhesive resin layer to the through holes of each metal plate. 1. A metal core laminate, characterized in that the metal core laminate is filled with resin, and a through hole is formed in a resin portion within the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14844987A JPS63311795A (en) | 1987-06-15 | 1987-06-15 | Metal core laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14844987A JPS63311795A (en) | 1987-06-15 | 1987-06-15 | Metal core laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63311795A true JPS63311795A (en) | 1988-12-20 |
Family
ID=15453033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14844987A Pending JPS63311795A (en) | 1987-06-15 | 1987-06-15 | Metal core laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63311795A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03110889A (en) * | 1989-09-26 | 1991-05-10 | Matsushita Electric Works Ltd | Manufacture of multilayer laminated sheet |
| JP2007335675A (en) * | 2006-06-15 | 2007-12-27 | Fuji Electric Systems Co Ltd | Power supply and method for manufacturing power supply |
-
1987
- 1987-06-15 JP JP14844987A patent/JPS63311795A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03110889A (en) * | 1989-09-26 | 1991-05-10 | Matsushita Electric Works Ltd | Manufacture of multilayer laminated sheet |
| JP2007335675A (en) * | 2006-06-15 | 2007-12-27 | Fuji Electric Systems Co Ltd | Power supply and method for manufacturing power supply |
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