JPS63306696A - Whirlwind air current cooling system - Google Patents
Whirlwind air current cooling systemInfo
- Publication number
- JPS63306696A JPS63306696A JP14373887A JP14373887A JPS63306696A JP S63306696 A JPS63306696 A JP S63306696A JP 14373887 A JP14373887 A JP 14373887A JP 14373887 A JP14373887 A JP 14373887A JP S63306696 A JPS63306696 A JP S63306696A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- printed circuit
- circuit board
- air
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 61
- 239000000428 dust Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 2
- 238000002347 injection Methods 0.000 abstract 2
- 239000007924 injection Substances 0.000 abstract 2
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔概要〕
冷却風の噴出口を軸線方向へに配設して一端を密閉した
パイプ状の支柱を、噴出口より噴射した冷却風がプリン
ト基板の主面側で渦流となるように、高密度集積素子（
以下ＬＳ Ｌ！：省略する）を実装したプリント基板の
各町に固着して、その外側にファンを天井板に取着した
箱状のカバーを冠着して冷却空洞を形成する。そして各
支柱の噴出口より冷却風の空洞内へ噴射と、ファンによ
り熱気を排出することで空洞内に龍巻気流を発生させて
、その龍巻気流によりＬＳｉを強制空冷する方式。[Detailed Description of the Invention] [Summary] Cooling air jetted from the jet nozzle creates a vortex on the main surface side of the printed circuit board through a pipe-shaped support with cooling air jets arranged in the axial direction and sealed at one end. High-density integrated devices (
Below is LS L! (omitted)) is attached to each section of the printed circuit board, and a box-shaped cover with a fan attached to the ceiling board is attached to the outside to form a cooling cavity. Cooling air is then injected into the cavity from the spout of each support, and hot air is discharged by a fan to generate a tornado airflow within the cavity, and the LSi is forcedly cooled by the tornado airflow.
本発明は各種電子機器に広く使用されるプリント板の冷
却方式に関するものである。The present invention relates to a cooling method for printed circuit boards widely used in various electronic devices.
特に、大型電算機等に装若されるプリント板は大型化と
電子部品の高密度実装されてきたが、一方ではプリント
板に実装される半導体チップは集積度が高くなって発熱
量が増大しており、その半導体チップの冷却性能に対す
る要求も大変厳しいものとなっている。In particular, printed circuit boards mounted on large computers, etc. have become larger and electronic components have been mounted at a higher density. At the same time, semiconductor chips mounted on printed boards have become more integrated and generate more heat. Therefore, the requirements for the cooling performance of semiconductor chips have become extremely strict.
そのため、ＬＳｉ等を実装したプリント板に一方向の冷
却風を給送して強制空冷をおこなっているが、その冷却
風の影となる部分に塵埃が付着して冷却効率を低下させ
るため、常に表面が清潔となって冷却効率の高い正巻気
流空冷方式が要求されている。For this reason, forced air cooling is performed by supplying cooling air in one direction to the printed circuit board on which LSi, etc. are mounted. There is a demand for a positive airflow air cooling system with a clean surface and high cooling efficiency.
従来広く使用されているプリント板の空冷方式は、第２
図に示すように複数枚の放熱フィンを一定の間隔で重層
した熱伝導性の高いアルミニウム合金材よりなる冷却フ
ィン２−１を、素子の上面に露出した図示しない伝熱板
に接着剤等により接合したＬＳｉ２等をプリント基板１
の主面に実装して、そのプリント基板ｌに透明な合成樹
脂５例えばポリカーボネート樹脂板を側面視口字形に成
形したエヤーカバー３を冠着して風洞を形成する。The conventionally widely used air cooling method for printed circuit boards is the second
As shown in the figure, a cooling fin 2-1 made of a highly thermally conductive aluminum alloy material in which multiple heat dissipation fins are layered at regular intervals is attached to a heat transfer plate (not shown) exposed on the top surface of the element using an adhesive or the like. The bonded LSi2 etc. are attached to the printed circuit board 1.
An air cover 3 made of a transparent synthetic resin 5, such as a polycarbonate resin plate, formed into an opening shape when viewed from the side is mounted on the printed circuit board 1 to form a wind tunnel.
そして、エヤーカバー３とプリント基板ｌとで形成され
た風洞の片側開口部よりに）印方向の冷却風を給送して
、ＬＳｉ２より伝専された冷却フィン２−１の熱を吸収
することによりプリント基板１に実装した各ＬＳｉ２を
冷却している。Then, by supplying cooling air in the direction indicated by ) through an opening on one side of the wind tunnel formed by the air cover 3 and the printed circuit board l, the heat of the cooling fins 2-1 transmitted from the LSi 2 is absorbed. Each LSi 2 mounted on the printed circuit board 1 is cooled.
〔発明が解決しようとする問題点３
以上説明した従来の空冷方式で問題となるのは、プリン
ト基板とエヤーカバーとで形成された風洞の片側開口部
より、冷却風を一定方向に給送して冷却フィンの熱を吸
収することにより各ＬＳｉを冷却しているため、長時間
の稼動で冷却風の影となる部分に冷却風に混入した塵埃
が付着し、その塵埃により熱伝導性の悪い被膜を形成し
て冷却効率を低下させる点である。[Problem to be Solved by the Invention 3] The problem with the conventional air cooling system described above is that the cooling air is supplied in a fixed direction from the opening on one side of the wind tunnel formed by the printed circuit board and the air cover. Since each LSi is cooled by absorbing heat from the cooling fins, dust mixed in with the cooling air adheres to areas that are in the shadow of the cooling air during long-term operation, resulting in a coating with poor thermal conductivity. This is the point where it forms and reduces the cooling efficiency.
本発明は以上のような状況からプリント基板に実装した
ＬＳｉの表面が常に清潔となって、冷却効率が高い正巻
気流空冷方式の提供を目的とじたものである。In view of the above-mentioned circumstances, the present invention aims to provide a positive winding airflow cooling system in which the surface of an LSi mounted on a printed circuit board is always kept clean and the cooling efficiency is high.
上記問題点は第１図に示すように、冷却フィン２−１を
有するＬＳｉ２を実装したプリント基板１の各町に、複
数個の噴出口１３−１を軸線方向へ一列に配設して一方
の開口部を密閉したパイプよりなる支柱１３を、噴出口
１３−１より噴射した冷却風がプリント基板１の主面側
で渦流となるように締着して、その外側にファン１４−
１を取着した箱状のカバー１４を冠着してプリント基板
１の主面側に空洞を形成し、各支柱１３の噴出口１３−
１より空洞内に冷却風を噴出するとともにファン１４−
１による熱気の排出で、空洞内に正巻気流を発生させて
ＬＳｉ２を強制空冷する本発明の正巻気流空冷方式によ
り解決される。The above problem is solved by arranging a plurality of jet ports 13-1 in a line in the axial direction in each section of the printed circuit board 1 on which the LSi2 having the cooling fins 2-1 is mounted, as shown in FIG. A support 13 made of a pipe with a sealed opening is fastened so that the cooling air jetted from the jet nozzle 13-1 forms a vortex on the main surface side of the printed circuit board 1, and a fan 14-
A box-shaped cover 14 with 1 attached thereto is attached to form a cavity on the main surface side of the printed circuit board 1.
Cooling air is ejected into the cavity from fan 14-
This problem is solved by the positive airflow air cooling method of the present invention, which generates a positive airflow in the cavity by discharging the hot air according to No. 1 and forcibly cools the LSi2.
即ち本発明においては、噴出口１３−１より噴射した冷
却風がプリント基板ｌの主面で渦流となるように、パイ
プ状の支柱１３をＬＳｉ２を実装したプリント基板１の
各町に固着して、その外側に天井板にファン１４−１を
取着したカバー１４を冠着することでプリント基板ｌの
主面側に冷却用の空洞が形成できる。That is, in the present invention, the pipe-shaped support 13 is fixed to each section of the printed circuit board 1 on which the LSi 2 is mounted so that the cooling air jetted from the jet nozzle 13-1 forms a vortex on the main surface of the printed circuit board 1. A cooling cavity can be formed on the main surface side of the printed circuit board 1 by attaching a cover 14 having a fan 14-1 attached to the ceiling plate on the outside thereof.
そして、各支柱１３の開口部より圧送された冷却風を軸
方向に配列したそれぞれの噴出口１３−１より空洞内に
噴出するとともに、カバー１４の天井に配設したファン
１４−１により熱気を熱気を→印方向に排出することで
カバー１４内に実線矢印方向の正巻気流が発生する。The cooling air forced through the opening of each support 13 is ejected into the cavity from the respective ejection ports 13-1 arranged in the axial direction, and the hot air is blown out by the fan 14-1 disposed on the ceiling of the cover 14. By discharging the hot air in the direction marked →, a positive airflow in the direction of the solid arrow is generated within the cover 14.
その正巻気流によりプリント基板１に実装したＬＳｉ２
の強；ｂ１１空冷可能となり且つ、正巻の上昇気流によ
り冷却フィン２−１等に塵埃の付着がなくなって常に清
潔となり高い冷却効率を維持することが可能となる。The LSi2 mounted on the printed circuit board 1 by the positive winding airflow
Strong: b11 Air cooling is possible, and the upward airflow of the normal winding eliminates the adhesion of dust to the cooling fins 2-1, etc., making it possible to always keep them clean and maintain high cooling efficiency.
以下図面に示した実施例に基づいて本発明の詳細な説明
する。The present invention will be described in detail below based on embodiments shown in the drawings.
第１図は本実施例による解巻気流空冷方式の斜視図を示
し、図中において、第２図と同一部材には同一記号が付
しであるが、その他の１３はプリント基板の支持とその
プリント基板に実装したＬＳｉの冷却風を給送して噴出
する支柱、１４は冷却風の龍巻気流を発生させる空洞を
プリント基板とで形成するカバーである。Figure 1 shows a perspective view of the unwinding airflow air cooling system according to this embodiment. In the figure, the same members as in Figure 2 are given the same symbols, and the other 13 are for supporting the printed circuit board and The column 14 supplies and blows out cooling air for the LSi mounted on the printed circuit board, and 14 is a cover that forms a cavity with the printed circuit board in which a tornado of cooling air is generated.
支柱１３は、例えば−殻構造用炭素鋼管９機械構造用ス
テンレスｆ＠鋼管を所定の長さに切断して一方の開口部
を密閉して、その中間部にプリント基板１を締着する図
示しない金具を配設し、その撞着金具と密閉した端面の
間に冷却風を噴出させる複数個の噴出口１３−１を、締
着金具に近接させて軸線方向へ一列に穿設して、必要に
より防錆および装飾用のメブキを施している。The support 13 is made of, for example, a carbon steel pipe for shell structure 9 a stainless steel pipe for machine structure cut into a predetermined length, one opening is sealed, and a printed circuit board 1 is fastened to the middle part (not shown). A plurality of jet ports 13-1 for blowing out cooling air between the fastening fitting and the sealed end surface are bored in a line in the axial direction close to the fastening fitting, and if necessary, It is coated with rust prevention and decoration.
カバー１４は、−面がプリント基板１の外周が嵌入でき
る大きさの開口部を設けた直角六面体の箱を、透明な合
成樹脂１例えばポリカーボネート樹脂板より成形して、
開口部の反対面、即ち天井板の中央に図示しない排気用
の孔を設けてその孔にファン１４−１を取着したもので
ある。The cover 14 is made by molding a right-angled hexahedral box with an opening large enough to fit the outer periphery of the printed circuit board 1 on the negative side from a transparent synthetic resin 1, such as a polycarbonate resin plate.
An exhaust hole (not shown) is provided on the opposite side of the opening, that is, in the center of the ceiling plate, and a fan 14-1 is attached to the hole.
上記部材を使用した解巻気流空冷方式は、冷却フィン２
−１を有するＬＳｉ２等を実装したプリント基板１の各
町に、冷却風の噴出０１３−１をその主面側にして支柱
１３の締着金具を当接し、冷却風の龍巻気流を１例えば
上面現反時計方向に発生させる場合は、噴射する冷却風
が当接したプリント基板１の反時計方向側の各辺と平行
となるように、噴出口１３−１の方向を各支柱１３の回
転により調節してプリント基板１を締着する。The unrolled airflow air cooling method using the above members uses cooling fins 2
The fastening fittings of the pillars 13 are brought into contact with each section of the printed circuit board 1 on which the LSi2 and the like having the LSi2, etc. When the air is generated counterclockwise on the top surface, the direction of the air outlet 13-1 is rotated by rotating each support 13 so that the cooling air to be ejected is parallel to each counterclockwise side of the printed circuit board 1 that comes into contact with it. Tighten the printed circuit board 1 by adjusting the screw.
その各支柱１３の下部、即ち支柱１３の開口部側に図示
しないが冷却風の給送管を結合して、天井中央にファン
１４−１を取着した透明な箱状のカバー１４を各支柱１
３の外側に冠着することによりプリント基板１の主面側
に冷却用の空洞を形成する。A cooling air supply pipe (not shown) is connected to the lower part of each support 13, that is, to the opening side of the support 13, and a transparent box-shaped cover 14 with a fan 14-1 attached to the center of the ceiling is attached to each support. 1
3, a cooling cavity is formed on the main surface side of the printed circuit board 1.
そして、各支柱１３のそれぞれ噴出口１３−１より冷却
風を空洞内に噴出するとともに、カバー１４の天井に配
設したファン１４−１により空洞内の熱気を→印方向に
排出することにより、空洞内に実線矢印方向の龍巻気流
を発生させる。Cooling air is ejected into the cavity from the respective spout 13-1 of each support 13, and the hot air inside the cavity is discharged in the direction marked by → by the fan 14-1 disposed on the ceiling of the cover 14. Generates a tornado airflow in the direction of the solid arrow inside the cavity.
その結果、龍巻気流により冷却フィン２−１を冷却して
プリント基板１に実装したＬＳｉ２の強制空冷と、冷却
風に混入した塵埃が冷却フィン２−１等に付着しなくな
って常に清潔となり高い冷却効率を維持することができ
る。As a result, the cooling fins 2-1 are cooled by the tornado airflow, resulting in forced air cooling of the LSi2 mounted on the printed circuit board 1, and the dust mixed in the cooling air does not adhere to the cooling fins 2-1, etc., resulting in a clean and high-quality product. Cooling efficiency can be maintained.
なお、第１図の支柱１３は円形パイプを使用したもので
示したが、角形パイプを使用しても同一の効果かえられ
る。Although the pillar 13 in FIG. 1 is shown using a circular pipe, the same effect can be obtained even if a square pipe is used.
以上説明したように本発明によれば極めて簡単な方式で
、実装されたＬＳｉおよびその冷却フィンの表面が常に
清潔となって高い冷却効率を維持する等の利点があり、
著しい信頼性向上の効果が期待でき工業的には極めて有
用なものである。As explained above, according to the present invention, there are advantages such as keeping the surface of the mounted LSi and its cooling fins clean at all times and maintaining high cooling efficiency using an extremely simple method.
It is expected to significantly improve reliability and is extremely useful industrially.
第１図は本発明の実施例による解巻気流空冷方式を示す
斜視図、
第２図は従来の空冷方式を示す断面図である。
図において、
１はプリント基板、
２はＬＳｉ。
２−１ は冷却フィン、
１３は支柱、
１３−１は噴出口、
１４はカバー、
１４−１はファン、
を示す。
第１図
３エヤーカバー
答ら表め瘉シｔオ戊１木す劇り宜ＩＡ
第２図FIG. 1 is a perspective view showing an unwinding airflow air cooling system according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional air cooling system. In the figure, 1 is a printed circuit board, and 2 is an LSi. 2-1 is a cooling fin, 13 is a support, 13-1 is a spout, 14 is a cover, and 14-1 is a fan. Fig. 1 3 Air cover answer display
Claims (1)
あって、冷却風の噴出口（１３−１）を少なくとも１個
を設けて一方の開口部を密閉したパイプよりなる支柱（
１３）と、天井板にファン（１４−１）を取着した箱状
のカバー（１４）を備え、 上記高密度集積素子（２）を実装した該プリント基板（
１）の各角に、上記噴出口（１３−１）より噴射した冷
却風が該プリント基板（１）の主面側で渦流となるよう
に上記支柱（１３）を固着し、各支柱（１３）の外側に
上記カバー（１４）を冠着して該プリント基板（１）の
主面側に冷却用の空洞を形成して、該噴出口（１３−１
）から冷却風の噴射と該ファン（１４−１）による熱気
を排出により、前記空洞内に龍巻気流を発生させて該高
密度集積素子（２）を空冷してなることを特徴とする龍
巻気流空冷方式。[Claims] An air cooling system for high-density integrated elements mounted on a printed circuit board, comprising a support made of a pipe with at least one cooling air outlet (13-1) and one opening sealed. (
13), a box-shaped cover (14) with a fan (14-1) attached to the ceiling plate, and the printed circuit board (14) on which the high-density integrated element (2) is mounted.
1), the support pillars (13) are fixed to each corner of the support pillars (13) so that the cooling air jetted from the jet ports (13-1) becomes a vortex on the main surface side of the printed circuit board (1). ), the cover (14) is attached to the outside of the printed circuit board (1), a cooling cavity is formed on the main surface side of the printed circuit board (1), and the spout (13-1
), and the fan (14-1) discharges hot air to generate a tornado airflow in the cavity to air-cool the high-density integrated element (2). Circulating airflow air cooling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14373887A JPS63306696A (en) | 1987-06-08 | 1987-06-08 | Whirlwind air current cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14373887A JPS63306696A (en) | 1987-06-08 | 1987-06-08 | Whirlwind air current cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63306696A true JPS63306696A (en) | 1988-12-14 |
Family
ID=15345864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14373887A Pending JPS63306696A (en) | 1987-06-08 | 1987-06-08 | Whirlwind air current cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63306696A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5361188A (en) * | 1990-10-24 | 1994-11-01 | Hitachi Ltd. | Cooling apparatus of electronic equipment |
| US5504650A (en) * | 1992-05-28 | 1996-04-02 | Fujitsu Limited | Heat sink for cooling a heat producing element and application |
-
1987
- 1987-06-08 JP JP14373887A patent/JPS63306696A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5361188A (en) * | 1990-10-24 | 1994-11-01 | Hitachi Ltd. | Cooling apparatus of electronic equipment |
| US5504650A (en) * | 1992-05-28 | 1996-04-02 | Fujitsu Limited | Heat sink for cooling a heat producing element and application |
| US5940267A (en) * | 1992-05-28 | 1999-08-17 | Fujitsu Limited | Heat sink for cooling a heat producing element and application |
| US6067227A (en) * | 1992-05-28 | 2000-05-23 | Fujitsu Limited | Heat sink for cooling a heat producing element and application |
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