JPS63304611A - Through-type capacitor - Google Patents

Through-type capacitor

Info

Publication number
JPS63304611A
JPS63304611A JP62139735A JP13973587A JPS63304611A JP S63304611 A JPS63304611 A JP S63304611A JP 62139735 A JP62139735 A JP 62139735A JP 13973587 A JP13973587 A JP 13973587A JP S63304611 A JPS63304611 A JP S63304611A
Authority
JP
Japan
Prior art keywords
dielectric
central conductor
type capacitor
hole
surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62139735A
Inventor
Mamoru Kurokuzuhara
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62139735A priority Critical patent/JPS63304611A/en
Priority claimed from US07/199,710 external-priority patent/US4853824A/en
Publication of JPS63304611A publication Critical patent/JPS63304611A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To obtain a through type capacitor wherein the dielectric is prevented from being damaged around the hole through which the central conductor of the dielectric is inserted, by forming a conductive electrode surface on the inner peripheral wall surface of the hole passing through the dielectric, and electrically connecting the conductive electrode surface to the surface of the central conductor passing through the hole by solder.
CONSTITUTION: A central conductor 2 becoming one electrode is inserted through and soldered to the inner periphery of a dielectric 1, and a ground electrode plate 3 which is the other electrode is soldered to the outer periphery. Thereafter, sheath cases 4, 5 consisting of insulators are fitted into the ground electrode plate 3, and to improve the withstand voltage, a filler resin 6 is injected and set up, thereby forming a through type capacitor. The gap ground the central conductor 2 having a thickness of T is filled with a solder 7 to 50% in volume rate. With this, a highly reliable through type capacitor can be obtained wherein the damage of the ceramic dielectric due to a thermal shock is different to occur.
COPYRIGHT: (C)1988,JPO&Japio
JP62139735A 1987-06-05 1987-06-05 Through-type capacitor Pending JPS63304611A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62139735A JPS63304611A (en) 1987-06-05 1987-06-05 Through-type capacitor

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62139735A JPS63304611A (en) 1987-06-05 1987-06-05 Through-type capacitor
US07/199,710 US4853824A (en) 1987-06-05 1988-05-27 Through-type capacitor
KR8806632A KR910005754B1 (en) 1987-06-05 1988-06-02 Through-type capacitor

Publications (1)

Publication Number Publication Date
JPS63304611A true JPS63304611A (en) 1988-12-12

Family

ID=15252156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62139735A Pending JPS63304611A (en) 1987-06-05 1987-06-05 Through-type capacitor

Country Status (1)

Country Link
JP (1) JPS63304611A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984129A (en) * 1989-03-20 1991-01-08 Hitachi, Ltd. Through-type capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984129A (en) * 1989-03-20 1991-01-08 Hitachi, Ltd. Through-type capacitor

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