JPH087621Y2 - Contact pin - Google Patents
Contact pinInfo
- Publication number
- JPH087621Y2 JPH087621Y2 JP4515993U JP4515993U JPH087621Y2 JP H087621 Y2 JPH087621 Y2 JP H087621Y2 JP 4515993 U JP4515993 U JP 4515993U JP 4515993 U JP4515993 U JP 4515993U JP H087621 Y2 JPH087621 Y2 JP H087621Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- contact pin
- diameter
- electrode
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
【0001】[0001]
【産業上の利用分野】本考案は、主として電子機器に使
用されるコンタクトピンに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pin mainly used in electronic equipment.
【0002】[0002]
【従来の技術】従来、電子機器の部品や配線の接続には
半田付けが常用されている。部品寸法が小さく、実装密
度が高い電子機器でもそうである。2. Description of the Related Art Heretofore, soldering has been commonly used to connect parts and wiring of electronic equipment. This is also true for electronic devices that have small component dimensions and high packing density.
【0003】例えば、電子機器の接続ケーブルの接続タ
ーミナルの部分では、ケーブルのラインから混入する雑
音を除去するために、誘電型や容量型のフィルタが各ラ
インごとに設けられる。この容量型フィルタとしては、
図3に示す貫通コンデンサ(01)が用いられて、実装密度
を高くしている。For example, in a connection terminal portion of a connection cable of an electronic device, a dielectric type or capacitance type filter is provided for each line in order to remove noise mixed in from the line of the cable . For this capacitive filter ,
The feedthrough capacitor (01) shown in FIG. 3 is used to increase the packaging density.
【0004】貫通コンデンサ(01)は、中央に貫通孔(02)
を有する外径約2mmの円筒形のコンデンサ素体(03)の外
面及び貫通孔(02)の内面に、それぞれ電極(04)(05)を形
成して成るもので、コンデンサ素体(03)は、例えばチタ
ン酸バリウムの粉末を加圧成型して焼成したものであ
り、電極(04)(05)は、コンデンサ素体(03)に例えば無電
解メッキなどで金属の薄膜を施して形成されている。The feedthrough capacitor (01) has a through hole (02) at the center.
The outer and inner surfaces of the through-hole (02) of a cylindrical capacitor body having an outer diameter of about 2 mm having a (03), each electrode (04) (05) in which by forming a capacitor element body (03 der), for example those obtained by firing a powder of barium titanate pressure molded to
Ri, electrode (04) (05) is that is formed by subjecting a thin film of metal on the capacitor element body (03) for example, electroless plating.
【0005】この貫通コンデンサ(01)の貫通孔(02)に、
接続ターミナルのコンタクトピン(06)を挿入し、半田付
け(07)により接続するのが普通である。また、貫通コン
デンサ(01)の外側の電極(04)は、共通グラウンド(08)の
両面に半田付け(09)される。In the through hole (02) of this feedthrough capacitor (01) ,
Insert the contact pins of the connection terminal (06), it is common to connect by soldering (07). The outer electrode of the feedthrough capacitor (01) (04) is soldered (09) on both sides of the common ground (08).
【0006】[0006]
【考案が解決しようとする課題】このように、貫通コン
デンサの貫通孔内面の電極とコンタクトピンとの半田付
けを行う際、溶融した半田が両者の間に流入するので、
この電極とセラミック焼結体であるコンデンサ素体との
熱膨張率の差による長期間の熱ヒステリシスにより、初
期不良の発生期間を経過した後に、薄い肉厚のコンデン
サ素体が亀裂したり、電極が剥離したりすることがあ
る。本考案は、このような不具合の生ずる半田付けの必
要のないコンタクトピンを提供することを目的とする。As described above, when the electrode on the inner surface of the through hole of the feedthrough capacitor and the contact pin are soldered, the molten solder flows between them,
Due to the long-term thermal hysteresis due to the difference in the coefficient of thermal expansion between this electrode and the ceramic sintered body, the thin-walled capacitor body may crack or the electrode body may crack after the initial failure period. May peel off
It An object of the present invention is to provide a contact pin which does not require soldering which causes such a problem.
【0007】[0007]
【課題を解決するための手段】本考案によると、上記課
題は、電子機器の接続に用いられるコンタクトピンにお
いて、弾発性があり、かつ電気的に導通性が良好な金属
の細線を、ピッチの細かい螺旋状に巻回して形成した、
両端部の内径が、コンタクトピンにおける導体本体の外
径よりわずかに小さく 、 かつ中間部の外径が接続しよう
とする貫通孔の直径よりもわずかに大きい螺旋体を、前
記導体本体の要所に、弾性的に嵌合係止した状態で、導
体本体を接続個所における貫通孔に挿入することによ
り、前記螺旋体の中間部を、貫通孔の内面に弾圧させた
ことにより解決される。 [Means for Solving the Problems] According to the present invention , the above-mentioned section
The problem is the contact pin used to connect the electronic device.
Metal with good elasticity and good electrical conductivity
The thin wire of is wound in a spiral shape with a fine pitch,
The inner diameter of both ends is outside the conductor body of the contact pin.
Slightly smaller than the diameter, and the outer diameter of the intermediate portion is trying to connect
A spiral body slightly larger than the diameter of the through hole
Conductor should be installed in an elastically fitted and locked position on the conductor body.
By inserting the body into the through hole at the connection point
The intermediate portion of the spiral body was pressed against the inner surface of the through hole.
Will be solved.
【0008】[0008]
【作用】本考案のコンタクトピンは、例えば貫通コンデ
ンサの貫通孔にそのまま差し込めば、金属細線の螺旋体
が、貫通孔の内壁にその弾発力をもってしっかりと係合
し、半田付けなしでも、十分な電気的接続を果たすこと
ができる。 [Action] contact pin of the present invention is, for example, if plugged directly into the through hole of the feedthrough capacitor, the spiral of thin metal wires, tightly engaged with the elastic force to the inner wall of the through hole, without soldering, sufficient to fulfill the electrical connection
Can be.
【0009】[0009]
【実施例】図1は、本考案のコンタクトピンを正面から
見た状態を示す。このコンタクトピンの導体本体(6)
は、好適には直径1mm〜1.5mmのもので、これを差し込
んで電気的に接続しようとする部分に、弾発性がありか
つ電気的な導通性が良好な金属の螺旋体(10)を取り付け
てある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the contact pin of the present invention viewed from the front. Conductor body of this contact pin (6)
Is preferably 1 mm to 1.5 mm in diameter , and is there elasticity in the part to be inserted and electrically connected ?
One electrical conductivity is attached good metal helix (10).
【0010】螺旋体(10)は、例えば燐青銅、またはこれ
に金等を鍍金したもので、好適には線径0.05mm〜0.15mm
のものとする。これを螺旋状に巻回するが、その両端部
(10a)(10a)は、導体本体(6)の直径よりわずかに小さい
径とし、その中間部(10b)の外径は、挿入しようとする
貫通孔の内径よりもわずかに大径とする。 The spiral body (10) is, for example, phosphor bronze , or one obtained by plating this with gold or the like, and preferably has a wire diameter of 0.05 mm to 0.15 mm.
It is assumed that This is spirally wound, but both ends
(10a) (10a) is slightly smaller than the diameter of the conductor body (6)
And the diameter, the outer diameter of the intermediate portion (10b) is slightly large diameter than the inner diameter of the through hole to be inserted.
【0011】図1に示すように、巻回のピッチは、線間
間隙を線径以下とした、比較的小さいものである。この
ように予め形成された螺旋体(10)を、導体本体(6)の端
部から所望の接続部分まで圧入する。この状態が、図1
に示されている。[0011] As shown in FIG. 1, the pitch of the winding is between lines
It is relatively small , with the gap less than or equal to the wire diameter. The spiral body (10) thus formed in advance is press-fitted from the end portion of the conductor body (6) to a desired connecting portion. This state is, as shown in FIG. 1
Is shown in.
【0012】螺旋体(10)の両端部(10a)(10a)は、導体本
体(6)の直径よりもその内径が小であるので、これらの
巻回部分は、弾発力をもって、しっかりと導体本体(6)
の外面に係合する。また、螺旋体(10)の中間部(10b)
は、挿入しようとする貫通孔の内径よりも大きいので、
当然に導体本体(6)の直径よりも大きく、したがって、
図1に示すように、導体本体(6)との間に間隙が形成さ
れている。[0012] both ends of the helix (10) (10a) (10a), since its inner diameter than the diameter of the conductor body (6) is small, these winding portions, with the spring force, firmly conductor Body (6)
Engage the outer surface of the. Also, the middle part (10b) of the spiral body (10)
Is larger than the inner diameter of the through hole to be inserted ,
Of course larger than the diameter of the conductor body (6), therefore,
As shown in FIG. 1, the gap is of form between the conductor body (6)
Has been.
【0013】このような構成のコンタクトピンを、図2
に示すように貫通コンデンサ(1)の貫通孔(2)に挿入す
る。貫通コンデンサ(1)は、例えばチタン酸バリウムの
ような強誘電体の粉末を円筒形に加圧成型し、高温度で
焼成したコンデンサ素体(3)の外面に電極(4)を、また
貫通孔(2)の内面に電極(5)を、例えば無電解メッキな
どの薄膜電極形成手段により形成して成るものである。
この貫通コンデンサ(1)は、共通グラウンド(8)に半田
付け(9)で固定されている。[0013] The contact pins of such a configuration, as shown in FIG. 2
Insert into the through hole (2) of the through capacitor (1) as shown in FIG . The feedthrough capacitor (1) is formed by pressing a powder of a ferroelectric substance such as barium titanate into a cylindrical shape under pressure, firing the electrode body (3) at a high temperature, and penetrating the electrode (4) again. The electrode (5) is formed on the inner surface of the hole (2) by a thin film electrode forming means such as electroless plating.
The feedthrough capacitor (1) is fixed to the common ground (8) by soldering (9).
【0014】この貫通コンデンサ(1)の貫通孔(2)に、
図1に示す本考案のコンタクトピンを圧入すると、貫通
孔(2)の内径は、導体本体(6)の直径プラス螺旋体(10)
の線径の2倍よりもわずかに大きいので、螺旋体(10)の
端部(10a)は、そのまま貫通孔(2)を通過する。In the through hole (2) of this feedthrough capacitor (1),
When the contact pin of the present invention shown in FIG. 1 is press-fitted, the inner diameter of the through hole (2) is the diameter of the conductor body (6) plus the spiral body (10).
Because of slightly larger than twice the wire diameter, the ends of the spiral body (10) (10a) is directly passed through the through-hole (2).
【0015】しかし、中間部(10b)の外径は、貫通孔
(2)の内径よりもやや大きいので、中間部(10b)の外面
は、貫通孔(2)の内壁の電極(5)に接触して、ピッチの
許容する限りにおいて斜めによじられながら貫通孔(2)
内を移動し、この内壁との接触状態を線の弾発力をもっ
て保持して、貫通孔(2)内に納まる。However , the outer diameter of the intermediate portion (10b) is a through hole.
Since it is slightly larger than the inner diameter of (2), the outer surface of the intermediate part (10b)
Contacts the electrode (5) on the inner wall of the through hole (2) and is twisted obliquely as long as the pitch allows, and the through hole (2)
Move the inner, the contact state between the inner wall and held with elastic force of the line fit to the through hole (2).
【0016】したがって、螺旋体(10)を構成する線は、
両端部(10a)(10a)において、コンタクトピンの導体本体
(6)に電気的にしっかりと接触し、かつ中間部(10b)に
おいて、貫通孔(2)の内壁の電極(5)にしっかりと電気
的に接触し、これにより、コンタクトピンと貫通コンデ
ンサの内側電極との接続は確実に果たされることとな
る。 Therefore, the line forming the spiral body (10) is
Conductor body of the contact pin at both ends (10a) (10a)
Electrically firm contact to (6), and <br/> Oite the intermediate portion (10b), firmly in electrical contact with the inner wall of the electrode through-hole (2) (5), thereby, The connection between the contact pin and the inner electrode of the feedthrough capacitor must be ensured.
It
【0017】このコンタクトピンは、例示の貫通コンデ
ンサに限らず、例えば配線基板のスルーホールへの取り
付けにも、そのまま適用することができる。[0017] The contact pins may be not limited to the exemplary feedthrough capacitor, also for attachment to through holes of example wiring board, as it is applied.
【0018】[0018]
【考案の効果】本考案コンタクトピンは、何等の半田付
けを要しないで、貫通コンデンサの貫通孔に、機械的に
も電気的にも、確実に固定接続することができる。した
がって、取り付け時の半田付けで不可避の、電極から直
接伝わる衝撃や、金属電極の熱膨張による薄い肉厚のコ
ンデンサ素体の亀裂や、熱ヒステリシスによる電極の剥
離を、完全に回避することができる。 [Effect of the invention The present invention contact pins are not essential to soldering any way, the through hole of the feedthrough capacitor, to be mechanically and electrically, can also be reliably fixed connection. Thus, unavoidable in soldering when mounting, or impact transmitted directly from the electrode, the thin wall thickness of the capacitor body due to thermal expansion of the metal electrode cracks or peeling of the electrode due to thermal hysteresis, it is possible to completely avoid .
【図面の簡単な説明】[Brief description of drawings]
【図1】本考案のコンタクトピンの一実施例の正面図で
ある。FIG. 1 is a front view of an embodiment of a contact pin of the present invention .
【図2】本考案のコンタクトピンを、貫通コンデンサの
貫通孔に取り付けた状態を示す要部の縦断面図である。FIG. 2 is a vertical cross-sectional view of a main part showing a state in which a contact pin of the present invention is attached to a through hole of a feedthrough capacitor.
【図3】従来のコンタクトピンを、貫通コンデンサの貫
通孔に取り付けた状態を示す要部の縦断面図である。FIG. 3 is a vertical cross-sectional view of a main part showing a state in which a conventional contact pin is attached to a through hole of a feedthrough capacitor.
(1)貫通コンデンサ (2)貫通孔 (3)コンデンサ素体 (4)電極 (5)電極 (6)導体本体 (8)共通グラウンド (9)半田付け (10)螺旋体 (10a)端部 (10b)中間部 (1) Through capacitor (2) Through hole (3) Capacitor body (4) Electrode (5) Electrode (6) Conductor body (8) Common ground (9) Soldering (10) Spiral body (10a) End (10b) ) Middle part
Claims (1)
ピンにおいて、弾発性があり、かつ電気的に導通性が良
好な金属の細線を、ピッチの細かい螺旋状に巻回して形
成した、両端部の内径が、コンタクトピンにおける導体
本体の外径よりわずかに小さく、かつ中間部の外径が接
続しようとする貫通孔の直径よりもわずかに大きい螺旋
体を、前記導体本体の要所に、弾性的に嵌合係止した状
態で、導体本体を接続個所における貫通孔に挿入するこ
とにより、前記螺旋体の中間部を、貫通孔の内面に弾圧
させてなることを特徴とするコンタクトピン。1. A contact pin for use in connection of electronic devices, there is a resilient and electrically conductive properties of good thin metal wire, wound in a fine spiral pitch form
The inner diameter of both ends of the
Slightly smaller than the outer diameter of the main body, and a diameter slightly have large helical than the through hole outer diameter of the intermediate portion is to contact <br/> connection attempt
The body is elastically fitted and locked to the main part of the conductor body.
Insert the conductor body into the through hole at the connection point.
By, the intermediate part of the spiral body is elastically pressed against the inner surface of the through hole.
A contact pin characterized by being made .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4515993U JPH087621Y2 (en) | 1993-08-19 | 1993-08-19 | Contact pin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4515993U JPH087621Y2 (en) | 1993-08-19 | 1993-08-19 | Contact pin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0714637U JPH0714637U (en) | 1995-03-10 |
JPH087621Y2 true JPH087621Y2 (en) | 1996-03-04 |
Family
ID=12711495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4515993U Expired - Lifetime JPH087621Y2 (en) | 1993-08-19 | 1993-08-19 | Contact pin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH087621Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2574653B (en) | 2018-06-14 | 2020-09-09 | Knowles (Uk) Ltd | Capacitor having an electrical termination |
-
1993
- 1993-08-19 JP JP4515993U patent/JPH087621Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0714637U (en) | 1995-03-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI411179B (en) | Rf terminator with improved electrical circuit | |
JP2910390B2 (en) | connector | |
US6822542B2 (en) | Self-adjusted subminiature coaxial connector | |
US2869090A (en) | Jack connector for printed wiring | |
EP1150395B1 (en) | Electrical connector | |
US4433360A (en) | Tubular ceramic capacitor | |
JPH087621Y2 (en) | Contact pin | |
JP3161281B2 (en) | Receptacle for coaxial connector | |
US5167539A (en) | Noise suppressing connector | |
KR100332101B1 (en) | Electronic component having lead | |
JP2806285B2 (en) | Feed-through capacitor | |
US5864283A (en) | Microwave frequency chip resistor assembly | |
JPH0542632Y2 (en) | ||
JP2575563Y2 (en) | Through-type electronic components | |
JP2757817B2 (en) | Dielectric resonator | |
JPH0532996Y2 (en) | ||
JP4545306B2 (en) | Film capacitor | |
JPH0314838Y2 (en) | ||
JPS6225877Y2 (en) | ||
JPS6230289Y2 (en) | ||
JPH037947Y2 (en) | ||
JPH0326625Y2 (en) | ||
JPH08106958A (en) | Connector | |
JP2827033B2 (en) | Manufacturing method of dielectric resonator | |
JPH04345777A (en) | Connector |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |