JPS63302598A - Heat sink structure of device rack - Google Patents
Heat sink structure of device rackInfo
- Publication number
- JPS63302598A JPS63302598A JP13939487A JP13939487A JPS63302598A JP S63302598 A JPS63302598 A JP S63302598A JP 13939487 A JP13939487 A JP 13939487A JP 13939487 A JP13939487 A JP 13939487A JP S63302598 A JPS63302598 A JP S63302598A
- Authority
- JP
- Japan
- Prior art keywords
- shelf
- fittings
- rack
- shaped
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 235000003801 Castanea crenata Nutrition 0.000 description 1
- 244000209117 Castanea crenata Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- -1 aluminum Chemical class 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
本発明は、装置架に複数のシェルフを実装し、該シェル
フに搭載した搭載部品から発生する熱を放熱する装置架
の放熱構造であって、装置架のチャンネル状の架フレー
ムに対応するチャンネル状の放熱板を取着して筒状を形
成し、シェルフに搭載した発熱源から発生する熱を熱伝
導の良好な金属からなるＬ字状金具とシェルフ取付金具
を介して、筒状を形成した放熱架に連接し、煙突効果を
利用して放熱効率を向上する。[Detailed Description of the Invention] [Summary] The present invention provides a heat dissipation structure for an equipment rack in which a plurality of shelves are mounted on an equipment rack and radiates heat generated from mounted components mounted on the shelves. A corresponding channel-shaped heat dissipation plate is attached to the channel-shaped rack frame to form a cylindrical shape, and the heat generated from the heat source mounted on the shelf is transferred to an L-shaped metal fitting made of metal with good thermal conductivity and the shelf is attached. It is connected to a cylindrical heat dissipation rack via metal fittings, and uses the chimney effect to improve heat dissipation efficiency.
本発明は、シェルフに搭載した搭載部品から発生する熱
を効率よく放熱する装置架の放熱構造に関する。The present invention relates to a heat dissipation structure for an equipment rack that efficiently dissipates heat generated from components mounted on a shelf.
近年、電子機器全般に小型、軽量化の要望が強く、この
要望を満足せしめるために高密度実装を余儀なくされ、
回路を構成する電子部品も小型化したものが用いられる
ので、消費電力が大きくなり発熱量が多くなるので、こ
れら電子部品から発生する熱を効率よく放熱する装置架
の開発が強く要望されている。In recent years, there has been a strong demand for smaller and lighter electronic devices in general, and in order to satisfy these demands, high-density packaging has been forced.
Since the electronic components that make up the circuits are also miniaturized, they consume more power and generate more heat, so there is a strong demand for the development of equipment racks that can efficiently dissipate the heat generated by these electronic components. .
（従来の技術〕
第２図は、従来の装置架の放熱構造を説明する図で、同
図（ａ）は要部断面を示す平面図、（ｂ）は要部正面図
である。(Prior Art) FIG. 2 is a diagram illustrating the heat dissipation structure of a conventional equipment rack, in which (a) is a plan view showing a cross section of the main part, and (b) is a front view of the main part.
図において、装置架の両側に対応する一対（図面では一
方のみを示す）のチャンネル状の架フレームｌが直立し
た形で設けられており、該チャンネル状の架フレームｌ
に導波管支持金具６を取着し、該導波管支持金具６に導
波管５が支持されている。In the figure, a pair of channel-shaped rack frames l (only one is shown in the drawing) corresponding to both sides of the equipment rack are provided in an upright manner.
A waveguide support fitting 6 is attached to the waveguide support fitting 6, and the waveguide 5 is supported by the waveguide support fitting 6.
そうして、発熱する搭載部品２１を搭載したシェルフ２
は架フレーム１に付設したシェルフ取付金具１）に導波
管５のフランジ５１とともに取着され、該シェルフ２に
は熱伝導の良好な金属たとえばアルミニウムからなる同
軸−導波管変換アダプタ３を取着し、該同軸−導波管変
換アダプタ３を電磁波の漏洩を防止する熱伝導の良好な
金属、たとえば燐青銅からなる接触ばね４を介して導波
管５に螺着する。Then, the shelf 2 on which the mounted components 21 that generate heat are mounted
is attached together with the flange 51 of the waveguide 5 to a shelf mounting bracket 1) attached to the rack frame 1, and a coaxial-to-waveguide conversion adapter 3 made of a metal with good thermal conductivity, such as aluminum, is attached to the shelf 2. The coaxial-to-waveguide conversion adapter 3 is screwed onto the waveguide 5 via a contact spring 4 made of a metal with good thermal conductivity, such as phosphor bronze, to prevent leakage of electromagnetic waves.
そうして、前記チャンネル状の架フレーム１に裏面カバ
ー７を螺着し、実装部品２１から発生する熱を第２図（
ａ）の矢印で示すように、同軸−導波管変換アダプタ３
．接触ばね４を介して４波管５から放熱するとともに、
シェルフ取付金具１）を介して架フレーム１からも放熱
される。Then, the back cover 7 is screwed onto the channel-shaped rack frame 1, and the heat generated from the mounted components 21 is removed as shown in FIG.
As shown by the arrow in a), the coaxial-waveguide conversion adapter 3
．． Heat is radiated from the four-wave tube 5 via the contact spring 4, and
Heat is also radiated from the rack frame 1 via the shelf mounting fittings 1).
上記従来の装置架の放熱構造にあっては、シェルフに搭
載した搭載部品から発生する熱を、同軸−導波管変換ア
ダプタと接触ばねを介して導波管及び、シェルフ取付金
具を介して架フレームから放熱しているが、導波管の放
熱径路に接触ばねが介在しているので熱の伝導抵抗が増
大し、架フレームはチャンネル状のため放熱効率が悪い
という問題点があった。In the heat dissipation structure of the conventional equipment rack described above, heat generated from the components mounted on the shelf is transferred to the waveguide via the coaxial-waveguide conversion adapter and the contact spring, and then to the shelf via the shelf mounting bracket. Heat is radiated from the frame, but since the contact spring is interposed in the heat radiating path of the waveguide, the heat conduction resistance increases, and because the frame is channel-shaped, the heat radiating efficiency is poor.
本発明は、上記の問題点を解決して煙突効果を利用して
放熱効率の向上を図った装置架の放熱構造を提供するも
のである。The present invention solves the above problems and provides a heat dissipation structure for an equipment rack that utilizes the chimney effect to improve heat dissipation efficiency.
すなわち、複数のシェルフを装置架に実装し、前記シェ
ルフに搭載した搭載部品から発生する熱を放熱する装置
架の放熱構造を、前記装置架のチャンネル状の架フレー
ムに対応するチャンネル状の放熱板を取着して筒状を形
成し、前記チャンネル状の放熱板に、熱伝導の良好な金
属からなるＬ字状のシェルフ取付金具を付設するととも
に、前記シェルフに熱伝導の良好な金属からなるＬ字状
金具を取着し、このＬ字状取付金具を前記シェルフ取付
金具に螺着するようにしたことによって解決される。That is, a plurality of shelves are mounted on an equipment rack, and the heat radiation structure of the equipment rack that radiates heat generated from the mounted components mounted on the shelf is formed by a channel-shaped heat sink corresponding to the channel-shaped rack frame of the equipment rack. an L-shaped shelf mounting bracket made of a metal with good heat conduction is attached to the channel-shaped heat sink, and the shelf is made of a metal with good heat conduction. This problem is solved by attaching an L-shaped fitting and screwing this L-shaped fitting to the shelf fitting.
このようにした装置架の放熱構造は、搭載部品から発生
する熱を熱伝導の良好な金属からなるＬ字状金具とシェ
ルフ取付金具を介して、筒状に形成した放熱架に伝導せ
しめ熱の対流作用により生ずる煙突効果を利用するので
放熱効率が大幅に向上する。This heat dissipation structure of the equipment rack conducts the heat generated from the mounted components to the cylindrical heat dissipation rack through the L-shaped metal fittings and shelf mounting brackets made of metal with good thermal conductivity. Heat dissipation efficiency is greatly improved by utilizing the chimney effect caused by convection.
第１図は、本発明の一実施例を説明する図で、同図（ａ
）は要部断面を示す平面図、（ｂ）は要部正面図で、第
２図と同等の部分については同一符号を付している。FIG. 1 is a diagram illustrating an embodiment of the present invention.
) is a plan view showing a cross section of the main part, and (b) is a front view of the main part, in which the same parts as in FIG. 2 are given the same reference numerals.
図において、装置架の両側に対応する一対（図面では一
方のみ示す）のチャンネル状の架フレームｌが直立した
形で設けられており、該チャンネル状の架フレーム１に
対応する熱伝導の良好な金属たとえばアルミニウムを、
チャンネル状に折り曲げた放熱板８を第１図（ａ）に示
す如く取着して筒状を形成し、該放熱板８に熱伝導の良
好な金属たとえばアルミニウムをＬ字状に折り曲げ、１
個又は複数の支持棒９１を植設したシェルフ取付金具９
を付設する。In the figure, a pair of channel-shaped rack frames l (only one is shown in the drawing) corresponding to both sides of the equipment rack are provided in an upright manner. Metals such as aluminum,
A heat dissipation plate 8 bent into a channel shape is attached to form a cylinder as shown in FIG.
Shelf mounting bracket 9 with one or more support rods 91 installed
Attached.
そうして、熱を発生する搭載部品２１を搭載、したシェ
ルフ２に、熱伝導の良好な金属たとえばアルミニウムで
形成し、前記シェルフ取付金具９に植設した支持棒９１
に対応するばか孔１０１を穿設したＬ字状金具１０を取
着し、該り字状金具１０のばか孔１０１に、前記シェル
フ取付金具９の支持棒９１に嵌入したのち、Ｌ字状金具
１０をシェルフ取付金具９に螺着し、前記筒状を形成し
た放熱架に裏面カバー７を螺着して、前記搭載部品から
発生する熱は第１図Ｔａ）の矢印で示すように、熱伝導
抵抗の小さいＬ字状金具１０とシェルフ取付金具９を介
して放熱板８に伝導する。Then, a support rod 91 made of a metal with good heat conduction, such as aluminum, and embedded in the shelf mounting bracket 9 is attached to the shelf 2 on which the heat-generating mounting parts 21 are mounted.
Attach the L-shaped metal fitting 10 with a hole 101 corresponding to the L-shaped metal fitting 10, and fit the support rod 91 of the shelf mounting metal fitting 9 into the hollow hole 101 of the L-shaped metal fitting 10. 10 is screwed onto the shelf mounting bracket 9, and the back cover 7 is screwed onto the cylindrical heat dissipation frame, so that the heat generated from the mounted components is dissipated as shown by the arrow in Fig. 1 Ta). The heat is conducted to the heat dissipation plate 8 via the L-shaped metal fitting 10 and the shelf mounting metal fitting 9, which have low conduction resistance.
このように放熱板８に伝導した熱は第１図（ｂ）の矢印
で示す如く筒状を形成した装置架から熱の対流作用によ
る煙突効果を利用して効率よく放熱し、さらに、シェル
フ取付金具９に伝導した熱は該シェルフ取付金具９に取
付けられている他の発熱しないシェルフ２のＬ字状金具
１０を介して、そのシェルフ２からも放熱する。The heat conducted to the heat dissipation plate 8 in this way is efficiently radiated from the cylindrical equipment rack as shown by the arrow in FIG. The heat conducted to the metal fitting 9 is also radiated from the shelf 2 via the L-shaped metal fitting 10 of another non-heat generating shelf 2 attached to the shelf mounting fitting 9.
なお、本実施例では熱伝導の良好な金属をアルミニウム
を用いた説明をしたが、アルミニウムに限らず熱伝導の
良好な銅その他の金属であっても良い。In this embodiment, aluminum is used as the metal with good heat conduction, but the metal is not limited to aluminum, but may be copper or other metal with good heat conduction.
以上の説明から明らかなように、本発明によれば放熱面
積が増加し煙突効果を利用できるので、放熱効率の向上
に極めて有効である。As is clear from the above description, according to the present invention, the heat radiation area increases and the chimney effect can be utilized, so that the present invention is extremely effective in improving heat radiation efficiency.
第１図は、本発明の一実施例を説明する図で、同図＋ａ
）は要部断面を示す平面図、（ｂ）は要部正面図、第２
図は、従来の装置架の放熱構造を説明する図で、同図Ｔ
ａ）は要部断面を示す平面図、（ｂ）は要部正面図であ
る。
図において、ｌはチャンネル状の架フレーム、２はシェ
ルフ、３は同軸−導波管変換アダプタ、４は接触ばね、
５は導波管、６は導波管支持金具、７は裏面カバー、８
は放熱板、９はシェルフ取付金具、１０はＬ字状金具、
１）はシェルフ取付金具、２１は搭載部品、５１はフラ
ンジ、９１は支持棒、１０１挙部碑面蛙を獅潤
ＩＱ＋
（Ｄｌ
７発明−１−９ｆ翅利
第１）！１
１Ｆ ＩＩｒ？ｆＩＪｔ７−Ｔ平１シ図Ｑ１
第２図FIG. 1 is a diagram illustrating one embodiment of the present invention.
) is a plan view showing a cross section of the main part, (b) is a front view of the main part,
The figure is a diagram explaining the heat dissipation structure of a conventional equipment rack.
(a) is a plan view showing a cross section of the main part, and (b) is a front view of the main part. In the figure, l is a channel-shaped frame frame, 2 is a shelf, 3 is a coaxial-waveguide conversion adapter, 4 is a contact spring,
5 is a waveguide, 6 is a waveguide support fitting, 7 is a back cover, 8
is a heat sink, 9 is a shelf mounting bracket, 10 is an L-shaped bracket,
1) is the shelf mounting bracket, 21 is the mounting part, 51 is the flange, 91 is the support rod, 101 is the tombstone frog, Shijun IQ+ (Dl 7 invention-1-9f Kuri 1st)! 1 1F IIr? fIJt7-T Heiichi Figure Q1 Figure 2
Claims (1)
（２）に搭載した搭載部品（２１）から発生する熱を放
熱する装置架の放熱構造であって、 前記装置架のチャンネル状の架フレーム（１）に対応す
るチャンネル状の放熱板（８）を取着して筒状を形成し
、 前記チャンネル状の放熱板（８）に、熱伝導の良好な金
属からなるＬ字状のシェルフ取付金具（９）を付設する
とともに、前記シェルフ（２）に熱伝導の良好な金属か
らなるＬ字状金具（１０）を取着し、該Ｌ字状取付金具
（１０）を前記シェルフ取付金具（９）に螺着するよう
にしたことを特徴とする装置架の放熱構造。[Scope of Claims] A heat dissipation structure for an equipment rack in which a plurality of shelves (2) are mounted on an equipment rack and radiates heat generated from mounted components (21) mounted on the shelf (2), the equipment rack comprising: A channel-shaped heat sink (8) corresponding to the channel-shaped rack frame (1) of the rack is attached to form a cylinder, and the channel-shaped heat sink (8) is made of metal with good thermal conductivity. An L-shaped shelf mounting bracket (9) is attached to the shelf (2), and an L-shaped bracket (10) made of a metal with good thermal conductivity is attached to the shelf (2). ) is screwed onto the shelf mounting bracket (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13939487A JPS63302598A (en) | 1987-06-02 | 1987-06-02 | Heat sink structure of device rack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13939487A JPS63302598A (en) | 1987-06-02 | 1987-06-02 | Heat sink structure of device rack |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63302598A true JPS63302598A (en) | 1988-12-09 |
| JPH0581199B2 JPH0581199B2 (en) | 1993-11-11 |
Family
ID=15244268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13939487A Granted JPS63302598A (en) | 1987-06-02 | 1987-06-02 | Heat sink structure of device rack |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63302598A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6833991B2 (en) * | 2001-11-14 | 2004-12-21 | Catena Networks, Inc. | Passive cooling apparatus for an outdoor cabinet |
| JP2009274032A (en) * | 2008-05-16 | 2009-11-26 | Casio Comput Co Ltd | Reactor, and electronic equipment |
-
1987
- 1987-06-02 JP JP13939487A patent/JPS63302598A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6833991B2 (en) * | 2001-11-14 | 2004-12-21 | Catena Networks, Inc. | Passive cooling apparatus for an outdoor cabinet |
| JP2009274032A (en) * | 2008-05-16 | 2009-11-26 | Casio Comput Co Ltd | Reactor, and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0581199B2 (en) | 1993-11-11 |
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