JPS6329509A - Formation of coating film - Google Patents

Abstract

PURPOSE:To make a coating film on a substrate flat, improve the degree of contact with the photo mask of contact aligner, and make fine processing possible, by providing a step difference with a specified region of the peripheral part of a substrate to make it low. CONSTITUTION:As a coatig film, photosensitive polyimide material photo PAL)/1000 for example, is subjected to a rotary coating under the condition of 4000 rpm and 30 seconds. When this film is subjected to a pre-bake under the condition of 85 deg.C and 20 minutes, a coating film of about 5mum thick is formed. Although an about 2mum high upheaving part 3 generates in the peripheral part, this can be absorbed because a step difference part 6 is made low by about 3mum. Consequently, the degree of contact between a substrate and a photo mask in a process of contact aligner can be improved, the pattern resolution is inereased, and fine processing is enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for forming a coating film of a resin film or an inorganic film used in semiconductor devices.

[Conventional technology]

As a method for forming a resin film, for example, Japanese Patent Publication No. 1983
As shown in No. 42240, there is a method of forming a resin film, which uses a substrate in which a predetermined area around the surface on which the film is to be formed has a negative slope, and spin-coats a resin solution onto the substrate and then performs a curing process.

[Problem that the invention seeks to solve]

In the above-mentioned conventional technology, when a resin solution is spin-coated onto a substrate, a resin bulge 3 that is generated around the periphery of the substrate 1 as shown in FIG. This is absorbed by the chamfered portion 4, and no consideration is given to countermeasures against an increase in the board price due to chamfering, a decrease in product yield in the peripheral area of the board, and a decrease in product quality due to the inclusion of defective products.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for forming a coating film that eliminates the build-up of the coating film around a substrate, which solves the problems of the prior art described above.

[Means for solving problems]

The above object is achieved by providing a step in a predetermined range around the substrate to lower the peripheral portion.

[Effect]

The step portion provided at the peripheral portion of the substrate functions to relatively reduce the buildup of the coating film caused by spin coating by the step size. As a result, the coating film on the substrate is flattened, the adhesion with the photomask during contact exposure is improved, resolution is improved, and fine processing becomes possible.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 3 to 6.

Example 1 As the substrate 1, as shown in FIG. 3, a base substrate is used from which pellets, which would cause chipping when pellets are removed from the periphery in a range of dimensions d and d, are removed.

Such a base substrate is manufactured using a photomask suitable for this purpose from Kuriha's photorin process.

Next, as a coating film on the surface of the substrate 1 as shown in FIG.
For example, photosensitive polyimide material photo PAL, '1o
oo (trade name 9 manufactured by Hitachi Chemical Co., Ltd.) at 400 rpm.

When spin coating is performed for 30 seconds and prebaked at 85° C. for 20 minutes, a coating film 5 with a thickness of 5 μm is formed, and a raised portion 3 with a height of approximately 2 μm is generated in the peripheral area.
Since the stepped portion 6 is lowered by about 3 μm, the bulge can be absorbed.

According to this example, the influence of the bulge that occurs around the substrate when spin-coating the coating film on the substrate is eliminated, and the adhesion between the substrate and the photomask during contact exposure is improved, pattern resolution is improved, and microfabrication is achieved. becomes possible.

Example λ As the substrate 1, as shown in FIG. 5, a base substrate from which pellets causing beret chipping around the periphery have been removed is used. Such a base substrate is manufactured from the initial photorin process using a photomask suitable for this purpose.

Next, as a coating film on the surface of the substrate 1 as shown in FIG.
For example, photosensitive polyimide material photo PALloooo
(Product name 1 manufactured by Hitachi Chemical Co., Ltd.) at 4000 rpm.

When spin coating is performed for 30 seconds and prebaked at 85° C. for 20 minutes, a coating film 5 with a thickness of 5 μm is formed, and a raised portion 3 with a height of approximately 2 μm is generated in the peripheral area.
Since the stepped portion 6 is lowered by about 6 μm, it is possible to absorb the bulge.

According to this example, the influence of the bulge that occurs around the substrate when a coating film is spin coated on the substrate is eliminated, the adhesion between the substrate and the photomask is improved during contact exposure, pattern resolution is improved, and fine Processing becomes possible. Furthermore, even if the pellets that are removed from the beginning around the substrate are formed, they will be chipped and will not become a product, so there is no need to worry about a drop in yield, and there is also the effect of reducing the possibility of defective pellets being mixed in.

In the examples, it is assumed that the photosensitive polyimide material is spin-coated, but the material is not limited to organic materials, and the coating method is not limited to spin-coating.

〔Effect of the invention〕

According to the present invention, microfabrication of semiconductors and the like can be performed without increasing the cost of substrates, and has the effect of improving product yield and eliminating the mixing of defective products.

[Brief explanation of the drawing]

FIG. 1 is a sectional view and a partially enlarged view of a conventional example, and FIG. 2 is a sectional view and a partially enlarged view of a known example. 3 is a plan view and a partially enlarged view of the embodiment row 1 of the present invention, and FIG. 4 is a sectional view of FIG. 3 and a partially enlarged view thereof. 5 is a plan view and a partially enlarged view of Embodiment 2 of the present invention, and FIG. 6 is a sectional view of FIG. 5 and a partially enlarged view thereof. 1... Substrate 6... Raised portion 5... Coating film 6... Stepped portion 7... Pellet □N. l＼ Agent Patent attorney Katsuyu Ogawa, 2.1 Figure 1 (α) (b) Child 2 Figure C (1) (b) 5; Gesouhagi 6:! L-sickness Figure 8 (see) (b) Figure 4 (see) (b) 5; 14 eyes 6. Cane tip No. 51￥] (α) (b) 1-1') pFl=, zo; 1 mi subtraction)'I:13, raised surface 94-)
, °) Bitter Figure 6 (α) (b) 1: ``To Book 5. ．． 2
: J! '(8 effects A smell 3, Masuegarikichi P 4
：Amendment of procedure for causing damage to face bottles (voluntary) Indication of the case Showa 61 Patent Application No. 171555 Title of the invention Relationship with the 11 cases of persons making amendments to the coating film formation method Patent application Person name Title
'5101 Stock Co. Ltd. Contents of Amendment 1: ``Figure 1'' on page 2, line 10 of the specification is corrected to ``Figure 5''. 2 "Figure 2" on page 2, line 11 of the specification was replaced with "Figure 6".
Corrected to ``Figure''. 5. “Figures 3 to 6” on page 3, line 11 of the specification are corrected to “Figures 1 to 4 J.” 4. "Figure 3" is corrected to "Figure 1." 1. Use "Photorin" on page 3, line 18 of the specification. "Photolithography" K corrects. & Change “Figure 4” on page 3, line 20 of the specification to “Second
Corrected to ``Figure''. 7. Page 4 of the specification, line 1 [') IP”OtO
PAL/Jwo. gFioio -PAL J K'ET Correct. & Change “Figure 5” on page 4, line 14 of the specification to “Figure 6”
Corrected to ``Figure''. 9 "Photorin" on page 4, line 16 of the specification is corrected to "Photoliso". 1 [L "Figure 6" on page 4, line 19 of the specification,
Corrected to "Figure 4". 11. On page 4 of the specification, line 20, ``Oto p trouble'' is corrected to L;, /'A oto-PAL J. 12. On page 6 of the specification, lines 4 to 11 are corrected as follows. 1 is a plan view and a partially enlarged view of Embodiment 1 of the present invention, FIG. 2 is a sectional view of FIG. 1 and a partially enlarged view thereof, and FIG.
The figures are a plan view and a partially enlarged view of Embodiment 2 of the present invention, FIG. 4 is a cross-sectional view of FIG. 3 and a partially enlarged view thereof, FIG. 5 is a cross-sectional view of the conventional example and an enlarged view thereof, and FIG. These are a sectional view and a partially enlarged view of a known example. "that's all

Claims (1)

[Claims] 1. When manufacturing semiconductors and other electronic components, etc., in a substrate having dividing grooves for dividing elements, steps are provided in a predetermined range around the substrate, and a coating solution is applied to the coating surface of the substrate. A method for forming a coating film, which comprises applying and then performing a curing treatment to form a coating. 2. The method of forming a coating film according to claim 1, characterized in that a step is provided only in a portion around the substrate where element chipping occurs. 3. Formation of a coating film according to claims 1 and 2, characterized in that a flat portion having the same depth as the dividing groove is formed in a predetermined range around the substrate without forming an element from the initial manufacturing process. Method.