JPS63292634A - プラスチックモ−ルド開封装置 - Google Patents

プラスチックモ−ルド開封装置

Info

Publication number
JPS63292634A
JPS63292634A JP12717287A JP12717287A JPS63292634A JP S63292634 A JPS63292634 A JP S63292634A JP 12717287 A JP12717287 A JP 12717287A JP 12717287 A JP12717287 A JP 12717287A JP S63292634 A JPS63292634 A JP S63292634A
Authority
JP
Japan
Prior art keywords
chemical
pump
pipe
chemical solution
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12717287A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563014B2 (enExample
Inventor
Naoki Yoshida
直樹 吉田
Hideo Goto
後藤　日出男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON SCIENT KK
Kusumoto Chemicals Ltd
Original Assignee
NIPPON SCIENT KK
Kusumoto Chemicals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON SCIENT KK, Kusumoto Chemicals Ltd filed Critical NIPPON SCIENT KK
Priority to JP12717287A priority Critical patent/JPS63292634A/ja
Priority to US07/198,230 priority patent/US4822441A/en
Publication of JPS63292634A publication Critical patent/JPS63292634A/ja
Publication of JPH0563014B2 publication Critical patent/JPH0563014B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP12717287A 1987-05-26 1987-05-26 プラスチックモ−ルド開封装置 Granted JPS63292634A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP12717287A JPS63292634A (ja) 1987-05-26 1987-05-26 プラスチックモ−ルド開封装置
US07/198,230 US4822441A (en) 1987-05-26 1988-05-25 Plastic mold decapsuling apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12717287A JPS63292634A (ja) 1987-05-26 1987-05-26 プラスチックモ−ルド開封装置

Publications (2)

Publication Number Publication Date
JPS63292634A true JPS63292634A (ja) 1988-11-29
JPH0563014B2 JPH0563014B2 (enExample) 1993-09-09

Family

ID=14953446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12717287A Granted JPS63292634A (ja) 1987-05-26 1987-05-26 プラスチックモ−ルド開封装置

Country Status (1)

Country Link
JP (1) JPS63292634A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109313A (ja) * 2013-12-03 2015-06-11 日本サイエンティフィック株式会社 プラスチックモールドされた半導体集積回路パッケージの開封装置及びプラスチックモールドされた半導体集積回路パッケージの開封方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6494564B2 (ja) * 2016-05-18 2019-04-03 三菱電機株式会社 パッケージ樹脂開封装置および開封用治具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237070A (ja) * 1985-04-12 1986-10-22 Matsushita Electric Works Ltd 半導体等の故障解析に用いる試料調整装置
JPS6262531A (ja) * 1985-09-12 1987-03-19 Mitsubishi Electric Corp モ−ルド樹脂エツチング装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237070A (ja) * 1985-04-12 1986-10-22 Matsushita Electric Works Ltd 半導体等の故障解析に用いる試料調整装置
JPS6262531A (ja) * 1985-09-12 1987-03-19 Mitsubishi Electric Corp モ−ルド樹脂エツチング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109313A (ja) * 2013-12-03 2015-06-11 日本サイエンティフィック株式会社 プラスチックモールドされた半導体集積回路パッケージの開封装置及びプラスチックモールドされた半導体集積回路パッケージの開封方法

Also Published As

Publication number Publication date
JPH0563014B2 (enExample) 1993-09-09

Similar Documents

Publication Publication Date Title
JP3725051B2 (ja) 基板処理装置
JP2846891B2 (ja) 処理装置
KR20010053300A (ko) 반도체 및 기타 장치 침지처리 방법 및 장치
JP3557601B2 (ja) 洗浄・乾燥処理装置及びその方法
US20070023550A1 (en) Hospital waste treatment with improved disinfectant liquid production
JPS63292634A (ja) プラスチックモ−ルド開封装置
US7216656B2 (en) Semiconductor substrate cleansing apparatus
JPS63292635A (ja) プラスチックモ−ルド開封装置
JPS63296230A (ja) プラスチックモ−ルド開封装置
JPS63292637A (ja) プラスチックモ−ルド開封処理方法
JPS63296229A (ja) プラスチックモ−ルド開封装置
JP4347426B2 (ja) 洗浄処理装置
JPS63292636A (ja) プラスチックモ−ルド開封装置
CN113713597B (zh) 一种工业控制自动化废气净化装置
JP2004099693A (ja) 廃プラスティック脱塩素処理装置
KR102905863B1 (ko) 기판 처리 장치 및 기판 처리 방법
CN110917841B (zh) 一种用于电镀工艺过程中的废气处理系统及其工作方法
JP6138398B1 (ja) 流体供給装置および内視鏡リプロセッサ
CN117486298B (zh) 离子膜烧碱产出淡盐水再利用回收处理装置和方法
CN219923890U (zh) 一种应用于无缝胶丸设备的在线清洗装置
US20230212044A1 (en) Unit and method for decomposing ozone, and substrate treating apparatus including the unit
JPH05293326A (ja) 酸化エチレン系滅菌ガスの廃棄処理方法及びその装置
JPH05240870A (ja) 分析装置の洗浄機構
SU1104722A1 (ru) Аппарат дл обработки материала жидкостью
KR950011141B1 (ko) 피펫 자동세척장치 및 그 방법

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees