JPS63292303A - Automatic setting method for measuring area - Google Patents

Abstract

PURPOSE:To facilitate operation, by defining the position of a data extraction line in case a one-dimensionally pattern of extracted data due to this data extraction line approximates a preliminarily set reference pattern in a prescribed range as the outline of a picture data read range for correction. CONSTITUTION:A measurement start point is defined as the origin and a measuring line my parallel with the (x) axis and a measuring line mx parallel with the (y) axis are supposed on the visual field of picture data due to a visual sensor 3. Picture data based on measuring lines mx and my is taken in, and measuring lines mx and my are moved in directions perpendicular to their extension directions while comparing taken-in data with the reference pattern. When both of them approximate each other in a prescribed range, the position of these data extraction lines at this time is defined as the outline of a measuring area to be set. Thus, it is detected that data extraction lines reach a prescribed position of the peripheral part of an object, and the measuring area is automatically obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for setting a measurement area in an electronic component mounting machine that mounts electronic components while correcting their position using a visual sensor. The present invention relates to an automatic measurement area setting method suitable for mounting flat package integrated circuit devices.

[Conventional technology]

In electronic circuit devices, many electronic components such as ICs (integrated circuits) are manufactured using g! Although it is often configured by mounting it on a board,
At this time, it is common to use an automatic mounting machine to mount the parts.

On the other hand, the packaging density of such electronic circuit devices is increasing as the electronic components used therein become smaller, and for this reason, visual sensors are used to determine the gripping position of electronic components and their positions. Component placement machines that correct the mounting position have come into use.

By the way, in component placement machines that use such visual sensors, in order to facilitate the detection of data scattered within the field of view of the vision sensor, a measurement area is set within the field of view of the vision sensor, and this measurement area is By selectively extracting only the data within, the effects of noise and other factors are removed to ensure reliable detection.

In conventional devices, the measurement area has to be set manually. In other words, workers actually measure the positions of electronic components.

From this result, a predetermined measurement area is assumed and inputted into the control device by key operation or the like.

Incidentally, related devices of this type include 1, for example, JP-A-55-118696 and JP-A-58-196.
Publication No. 099 can be mentioned.

[Problem that the invention seeks to solve]

The conventional technique described above has a problem in that the measurement area must be set manually each time, and the operation is complicated.

Also, for teaching the operation of electronic component mounting machines.

Digital data from the time of circuit board manufacturing is often used, but with conventional technology, there were problems in that the data became huge and the circuit board had to be measured each time. .

The purpose of the present invention is to automatically obtain measurement area settings without requiring any manual work, to enable easy and highly accurate data reading, and to fully obtain the advantages of using a visual sensor. An object of the present invention is to provide a method for automatically setting a measurement area in an electronic component mounting machine.

[Means for solving problems]

The above purpose is to
Set at least two data extraction lines whose extension directions are different from each other, and define each of these two data extraction lines as
While moving in a direction almost perpendicular to its extension direction,
Extract the data of the pixels that this data extraction line crosses, compare the one-dimensional pattern based on this extracted data with a preset reference pattern, and when the two show approximation within a predetermined range, this data This is achieved by setting the position of the outline of the measurement area to be set.

[For production]

In general, objects have specific changes in shape around their periphery.1 For example, electronic components such as ICs have terminals around their periphery, and the shape clearly changes significantly in this area. .

Therefore, as described above, a one-dimensional pattern obtained at a unique part such as this terminal area is set as a reference pattern, and this is compared with the data obtained by extracting data using the data extraction line. As the data extraction line progresses, it can be detected that the data extraction line has reached a predetermined position on the periphery of the object.

Measurement area can be determined automatically.

〔Example〕

Below 1: About the measurement area automatic setting method according to the present invention 1
This will be explained in detail with reference to the illustrated embodiment.

° Fig. 1 is a system configuration diagram of an electronic component mounting machine to which an embodiment of the present invention is applied.
, a visual sensor 3 for recognizing electronic component gripping position, and a board 1
Supply unit for electronic components (hereinafter simply referred to as components) to be mounted on the 4. A header section 5 that faces the surface on which the substrate 1 is held in the X-Y plane 2 and is supported movably along a plane parallel to this surface, and a CPU 6 . The control device 18 includes a memory 7 and the like.

Next, FIG. 2 shows details of the header section 5, in which a mounting hand 9 and a gripper 1 are supported so as to be able to move parallelly in two directions and rotate in the θ direction with respect to the header section 5. It is composed of a position defining member 10 and a visual sensor 11 for board recognition.

The header section 5 is controlled by a control device [8, and the mounting hand 9 grips and takes out a predetermined component from the component supply section 4, carries it to a predetermined position above the board 1, and then transfers it to its position. Attach it to the designated location. At this time 1
The parts supply section 4 is also a control system! 2!8 so that the parts required at that time are supplied to the mounting hand 9.

By the way, at this time, first, the visual sensor 3 detects the state after the component is gripped by the mounting hand 9! ! Then, the wiring pattern of the board 1 is recognized by the visual sensor 11, and thereby the gripping position and mounting position of the component are corrected, and control to ensure accurate mounting is performed. That is, in this case, 2, first, the header section 5 is.

After the loading hand 9 takes in a predetermined component from the component supply unit 4, it is moved to a position where the center of the gripped component will coincide with approximately the center of the field of view captured by the visual sensor 3, and then It receives an imaging operation by the visual sensor 3. The mounting hand 9 then moves to a predetermined position above the board 1, where the visual sensor 1 recognizes the component gripping position based on the image data at this time.
Accurate component mounting is achieved by imaging the wiring pattern using 1, recognizing the wiring pattern based on the image data obtained, and correcting the final component mounting position based on these recognized IM results. So do it.

At this time, in the recognition process using the image data of the visual sensors 3 and 11, it is necessary to set the measurement area as described above, but this measurement area is automatically obtained in this embodiment. This point will be explained in detail below.

First, the operating principle of an embodiment of the present invention will be explained with reference to FIG. The target is a type IC, and in this figure, the IC package P is viewed by the visual sensor 3 (see figure 1), and first, an arbitrary point 0 on this IC package P is taken as the measurement starting point. Note that this figure assumes that there is no noise.

From now on, use this measurement starting point 0 as the origin.

Additionally, measure Jim parallel to the X axis! Assume a measurement line mx parallel to the my and y axes.

On the other hand, if a line is assumed to cross the terminal portion of the IC package P along the arrangement direction and image data is captured by scanning along this line, this image data will become one-dimensional pattern data.

Therefore, in advance, each terminal row t1, tx, t3, t
4, the above one-dimensional pattern data is prepared in advance, and each is used as a reference pattern for the corresponding terminal row.

Next, while capturing image data from each measurement line mx, my and comparing it with the reference pattern described above, move each of these measurements Jam x, my y in a direction perpendicular to their ivy length direction. View.

First, while comparing the image data of the measurement line mx with the reference pattern of the terminal row tz, the measurement line mx is moved in the x1 direction.

When this measurement line mx enters the area o1 that crosses the terminal row tl, the pattern of the image data shows a predetermined approximation to the reference pattern.

The X-axis coordinate position of the measurement line mx at this time is memorized.

Subsequently, the image data obtained by this measurement @ m x is moved in the x2 direction while being compared with the reference pattern of the terminal row t3, an approximation is taken, and the coordinate position of the area e3 is stored.

Next, do the same thing for the measurement line my.

Area 1 each! ! Store the coordinate positions of 2 and 04.

Therefore, if we look at the area surrounded by these areas 61 to e4, this area is exactly 1.

It can be seen that the area surrounding the main body of the IC package P is the smallest area, and therefore, according to the present invention, the above-mentioned calculation of the measurement area can be automatically obtained.

Therefore, returning to FIG. 1, the operation of this embodiment will be explained.

First, FIG. 4 shows the measurement area when the visual sensor 3 corrects the gripping position of the IC package P by the mounting hand 9. In this figure, 12 is the main body of the IC package P, L3 is the lead foot ( terminal), 14-17
is a recognition area, and 18 is the center of the visual field of the visual sensor 3. As is clear from the above, the range surrounded by these recognition areas 14 to 17 is the measurement area at this time.

FIG. 5 is a flowchart of the measurement area setting process by the visual sensor 3 in this embodiment, and shows the control device i in FIG.
! This process is executed by the CPU 6 in the 8, and will be explained below using this flowchart. In addition, below,
The step is written as S.

The measurement line mx is set at the center 18 of the visual field of the visual sensor 3.

The image data based on the measurement line mx is compared with a reference pattern based on lead feet in the y-axis direction that is set and stored in advance.

Move the measurement line mx in the +X direction (rightward).

Determine whether the image data matches the reference pattern.

The X coordinate position of the measurement line mx when they match is stored as X2.

Compare the image data and the reference pattern again.

Move the measurement line mx.

Determine the mismatch between the image data and the reference pattern.

The position of the measurement line mx when the discrepancy occurs is stored as xl.

Return the measurement line mx to the center 18 of the visual field.

529-S36 Next, move the measurement line mx in the -X direction (left direction),
Similarly, find the places @X4 and xll and store them.

Next, repeat the same procedure for the 811 constant line my, and
Direction coordinate position 1! Find yz, y1% y4o y days.

Memorize these.

Then, from these results, the recognition area 14°15.
16 and 17 can be set, and the measurement area can be set as an area surrounded by these.

Next, the visual sensor 11 is used. A measurement area setting process when correcting the position of the wiring pattern on the board l will be described.

No. 68! I indicates a recognition area in the wiring pattern, 37 is the wiring pattern, and 38 to 41 are the recognition areas.

Since the wiring pattern on the board has a relatively large amount of noise, the visual sensor 3 has already determined the coordinate position @X2°y2. x4,
74 as the measurement starting point, and similarly to the setting of the recognition area when correcting the gripping position of the main body 12, the respective recognition areas 38 to 41 are set using the measurement lines mx and my.

FIG. 7 is a flowchart showing the processing at this time. First, in S42, the measurement ll5m x is set to the coordinate position , S43 and 84
Repeat the process in step 4 and get it! xa is determined and stored in S46.

Next, in 849, the processes of S47 and 548 are repeated until it is determined that there is a mismatch between the image data and the reference pattern.
Find the place 11x* and store it as 350.

Next, in S51, the measurement line mx is moved to the position
and memorize it.

Furthermore, the same process is performed on the measurement line my, and the position @y
a, 7-1. Find y·, yr in sequence and store them. Thereafter, the recognition areas 38 to 41 are set, and a measurement area can be obtained as a region surrounded by these areas.

Next, the component mounting process according to the above embodiment, which is performed using the recognition area thus obtained, will be explained with reference to the flowchart shown in FIG.

First, the header section 5 is moved onto the supply section 4.

The mounting hand 9 is lowered and the parts are picked up (S
60), at this time, the gripping position is roughly defined by the gripping position [Nl undefined member 10].

Next, the mounting hand 9 is raised, and then the header section 5 is moved and positioned so that the visual field center 18 of the visual sensor 3 and the center of the mounting hand 9 coincide (S61).

Next, it is determined whether the lead recognition area corresponding to the component to be mounted now has been stored (S62), and if the result is NO, the lead recognition area is set and stored as described above. Neru (S 63).

Using the measurement area based on the recognition area thus obtained, the visual sensor 3 calculates the centripetal displacement according to the change point detection method and corrects the data based on the result (S64).

Next, the header part 5 is placed on the mounting pattern recognition position on the board 1.
is moved (5135), and the process proceeds to correction processing by the visual sensor 11. First, it is determined whether or not the recognition area of the wiring pattern corresponding to the component to be mounted now is already stored (366). If it is not stored, the substrate l! & setting of knowledge area,
Storage is executed here (S67).

Then, using this recognition area, the visual sensor 11 performs a position correction process (368), and after the position of the header section 5 is corrected, the component mounting process is executed (S69).
).

Finally, in S70, it is determined whether all the preset steps have been completed, and when the result is YES, the mounting process for this board is completed.

In the above embodiments, the case where a flat package IC is used as the component to be mounted on the board is explained.
It goes without saying that the present invention is not limited to this and can be implemented.

〔Effect of the invention〕

According to the present invention, one manual process for setting the measurement area is no longer necessary, and the preprocessing time at the start of one work can be shortened and the teaching data can be made much more compact.

In addition, since the setting of the 2 constant area is automatically obtained, processing errors are reduced, and once the measurement area is set, it is memorized, so the v2 constant area setting is automatically obtained.
There is no need to set the parameters, and high-speed processing can be achieved.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing an example of an electronic component mounting machine to which an embodiment of the measurement area automatic setting method according to the present invention is applied. i is a detailed explanatory diagram of the header section, and FIG. 3 is an explanatory diagram for understanding the principle of the present invention. FIG. 4 is an explanatory diagram showing the measurement area setting operation when correcting the gripping position in an embodiment of the present invention, FIG. 5 is a flowchart for explaining the measurement area setting operation when correcting the gripping position, and FIG. ! FIG. 7 is a flowchart for explaining the measurement area setting operation for the wiring pattern, and FIG. 8 is a flowchart for explaining the component mounting operation. 1...Printed circuit board, 2...X-Y plane, 3...
...Visual sensor, 4...Parts supply section, 5...
Header section, 6...CPU, 7...Memory, 9...
. . . r6 coin hand, 10 . . . gripping position regulating member, 11 . . . visual sensor. Fig. 1 1 7 lint base 2 ・ x-y plane 3 ・ Objective Hinsa 4 ... H envoy to Shupin Kyo 5 ... header shu Fig. 2 Fig. 4 Fig. 3 Fig. 6 Fig. 5 Figure 7 Figure 8WA

Claims (2)

[Claims] 1. In an electronic component mounting machine that uses image data read by a visual sensor to correct at least one of the gripping position of the electronic component to be mounted by the mounting hand and the mounting position of the electronic component with respect to the component mounting pattern, Arithmetic processing means for setting at least two data extraction lines extending in mutually different directions within the visual field screen of the image data;
Data extraction means is provided for sequentially extracting data of pixel portions crossed by the data extraction lines while moving each of the data extraction lines from one side to the other in a direction substantially perpendicular to the direction of extension of the data extraction lines. The position of the data extraction line when the one-dimensional pattern of the extracted data by the extraction line shows approximation within a predetermined range to a preset reference pattern is used as the contour line of the image data reading range for the correction. A measurement area automatic setting method characterized in that it is configured to operate. 2. In claim 1, the electronic component comprises:
A measurement area automatic setting method for a flat package integrated circuit device, characterized in that the reference pattern is a one-dimensional pattern shown by image data obtained when scanning across a terminal portion of the integrated circuit device.