JPS63289894A - Thick-film drawing device - Google Patents
Thick-film drawing deviceInfo
- Publication number
- JPS63289894A JPS63289894A JP62124225A JP12422587A JPS63289894A JP S63289894 A JPS63289894 A JP S63289894A JP 62124225 A JP62124225 A JP 62124225A JP 12422587 A JP12422587 A JP 12422587A JP S63289894 A JPS63289894 A JP S63289894A
- Authority
- JP
- Japan
- Prior art keywords
- discharge
- film paste
- thick film
- thick
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 10
- 238000007599 discharging Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
- Coating Apparatus (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ラジオ受信機、テレビ受像機、ビデオテープ
レコーダ、通信機器等の厚膜回路の形成に用いる厚膜描
画装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a thick film drawing apparatus used for forming thick film circuits for radio receivers, television receivers, video tape recorders, communication equipment, and the like.
従来の技術
厚膜回路は、スクリーン版を用いて基板面に厚膜ペース
トを所望の形状に印刷し、乾燥・焼成工程を経て形成す
るスクリーン印刷法で行なうのが一般的である。Conventional Techniques Thick film circuits are generally produced by a screen printing method in which a thick film paste is printed in a desired shape on a substrate surface using a screen plate, and then formed through a drying and baking process.
さらに近年多品種少量生産用として、ノズル先端部の吐
出孔からペーストを吐出し、ノズルを基板に対して相対
的に移動させながら導体や抵抗体を形成する描画法が提
案されている。描画法はコンピュータ制御により短時間
のうちにパターンの切り替えが行なえるほか、プログラ
ムデータを作成するだけで回路試作が行なえるので、開
発期間の大幅な短縮が図れ、スクリーン印刷法に代わる
有力な厚膜回路形成法と考えられる。Furthermore, in recent years, for high-mix, low-volume production, a drawing method has been proposed in which paste is discharged from a discharge hole at the tip of a nozzle and conductors and resistors are formed while moving the nozzle relative to the substrate. The drawing method allows patterns to be switched in a short time using computer control, and circuit prototypes can be made just by creating program data, which significantly shortens the development period and makes it an effective alternative to screen printing. It is considered to be a membrane circuit formation method.
第４図、第６図に基づき上記描画法を採用した厚膜描画
装置の概要について説明する。５はＸＹテーブルであり
、このＸＹテーブル５の上面には厚膜回路を形成すべく
基板ｅが載せられている。An outline of a thick film lithography apparatus employing the above lithography method will be explained based on FIGS. 4 and 6. 5 is an XY table, and a substrate e is placed on the upper surface of this XY table 5 to form a thick film circuit.
ＸＹテーブル６はコントローラ１２にて制御しておシ、
移動と同時にエアー電磁弁１３が開放し厚膜ペーストを
ノズル先端部から吐出することで導体、抵抗体を形成す
る。その他プランジャによシ吐出圧力を力山え厚膜ペー
ストを吐出、する方法も考えられている。The XY table 6 is controlled by the controller 12.
Simultaneously with the movement, the air solenoid valve 13 opens and thick film paste is discharged from the nozzle tip to form a conductor and a resistor. Other methods have been considered in which the thick film paste is discharged by increasing the discharge pressure using a plunger.
発明が解決しようとする問題点
上記従来の描画装置で厚膜回路を形成する場合、特にＸ
Ｙテーブルの移動速度が１０個／気以上の領域において
、ＸＹテーブルの移動開始と同時に吐出パルプの開放信
号を発した場合、吐出パルプの開放遅れ時間やノズルタ
ンク内にエアー充填が行なわれるけでの時間を必要とし
、ＸＹテーブルの移動開始点より遅れた位置に厚膜ペー
ストが吐出されることになる。従って基板面の所望の位
置から厚膜ペーストを吐出する場合、あらかじめ吐出遅
れ分を考慮し、基板面の所望の位置よりも手前からＸＹ
テーブルを移動しなければならない。Problems to be Solved by the Invention When forming thick film circuits using the above-mentioned conventional drawing apparatus, especially
If the discharging pulp release signal is issued at the same time as the XY table starts moving in the region where the Y table movement speed is 10 pieces/cm or more, the discharge pulp opening delay time and air filling in the nozzle tank may be affected. , and the thick film paste is discharged at a position delayed from the starting point of the movement of the XY table. Therefore, when dispensing thick film paste from a desired position on the substrate surface, take into account the dispensing delay in advance, and
I have to move the table.
しかし、上記の方法ではＸＹテーブルの移動速度によシ
吐出遅れ寸法が変化するため、その速度に合わせた補正
をそれぞれプログラム内に設定する必要がある。However, in the above method, since the ejection delay dimension changes depending on the moving speed of the XY table, it is necessary to set corrections in accordance with the speed in each program.
また吐出圧力は各描画を行なうごとに上昇、下降を繰シ
返し、特に上昇過程では、ノズル内が所定圧力に達する
領域において、圧力変動が生じ、厚膜ペーストの吐出量
にバラツキが生じる。吐出量のバラツキは厚膜導体及び
抵抗体の形状を安定にし、特に抵抗体では抵抗値精度を
悪化する原因となる。Further, the discharge pressure repeatedly rises and falls each time drawing is performed, and especially during the rising process, pressure fluctuations occur in a region where the inside of the nozzle reaches a predetermined pressure, causing variations in the amount of thick film paste discharged. Variations in the discharge amount make the shapes of thick-film conductors and resistors stable, and in particular cause deterioration of resistance value accuracy in resistors.
問題点を解決するための手段
上記問題を解決するために本発明は、厚膜描画装置のノ
ズルタンク内の厚膜ペーストに吐出プランジャあるいは
エアーにより常時圧力を加えた状態にしておき、ノズル
内に厚膜ペーストの流出経路を開閉する吐出弁を配設し
、任意に前記吐出弁を開閉し同時にＸＹテーブル上の基
板を移動しなから厚膜ペーストを吐出するものである。Means for Solving the Problems In order to solve the above problems, the present invention maintains a constant pressure on the thick film paste in the nozzle tank of the thick film drawing apparatus by a discharge plunger or air, and A discharge valve is provided to open and close an outflow path of the thick film paste, and the discharge valve is arbitrarily opened and closed, and at the same time, the thick film paste is discharged without moving the substrate on the XY table.
吐出弁の開閉は基板面と吐出弁の接触圧、電磁気による
反発力などにより行なう。The opening and closing of the discharge valve is performed by the contact pressure between the substrate surface and the discharge valve, the repulsive force caused by electromagnetism, and the like.
作 用
本発明において、ノズルタンク内には常時吐出圧力が加
えられた状態にあり、吐出圧力は厚膜ペーストを介して
、ノズル先端部に配設した吐出弁に加えられることにな
る。吐出弁には厚膜ペーストの吐出孔が設けられており
、通常、この吐出孔は閉じられた状態にあり、厚膜ペー
ストは吐出されない。ＸＹテーブルはコントローラによ
って制御されており、移動開始と同時に、同じく前記コ
ントローラからの吐出信号か、あるいはその他の機械的
動作により吐出弁を開放する。ＸＹテーブルが基板面を
移動中、吐出弁はそのまま開放状態にあり、厚膜ペース
トはその間吐出し続ける。厚膜ペーストは、ノズル先端
部と基板面との距離が約４０μｍと近いため、基板面上
に塗布されて厚膜回路を形成する。ノズルタンク内には
抵抗用もしくは導体用の厚膜ペーストが充填されておシ
、ＸＹテーブルの移動プログラムとの組み合わせにより
導体回路もしくは抵抗体の形成を行なう。Function In the present invention, discharge pressure is constantly applied inside the nozzle tank, and the discharge pressure is applied to the discharge valve disposed at the tip of the nozzle via the thick film paste. The discharge valve is provided with a thick film paste discharge hole, and normally this discharge hole is in a closed state and the thick film paste is not discharged. The XY table is controlled by a controller, and at the same time as the movement starts, the discharge valve is opened by a discharge signal from the controller or other mechanical operation. While the XY table is moving over the substrate surface, the discharge valve remains open and the thick film paste continues to be discharged. Since the distance between the nozzle tip and the substrate surface is close, about 40 μm, the thick film paste is applied onto the substrate surface to form a thick film circuit. The nozzle tank is filled with a thick film paste for resistors or conductors, and a conductor circuit or a resistor is formed in combination with an XY table movement program.
実施例 以下、本発明を実施例にもとづき説明する。Example Hereinafter, the present invention will be explained based on examples.
第１図において２１けノズルタンク、２２は厚膜ペース
ト、２３は吐出弁、２４は吐出孔である。In FIG. 1, there are 21 nozzle tanks, 22 is a thick film paste, 23 is a discharge valve, and 24 is a discharge hole.
まず吐出弁２３はノズルタンク２１に、基板面に対し垂
直に摺動する様に取り付けられている。吐出孔２４は吐
、出奔２３に配設してあり、０．１ｗ〜０．２＋＋ｍの
円形孔がスリット孔となっている。接触子２８は吐出弁
２３の下部に取付けてあり、ヘッド２７が下降すると基
板２６と接触し可動弁を持ち上げる。First, the discharge valve 23 is attached to the nozzle tank 21 so as to slide perpendicularly to the substrate surface. The discharge hole 24 is arranged in the discharge and discharge part 23, and a circular hole of 0.1w to 0.2++m is a slit hole. A contactor 28 is attached to the lower part of the discharge valve 23, and when the head 27 descends, it comes into contact with the base plate 26 and lifts the movable valve.
接触子２８は基板２６の移動時に摩耗が生じるためダイ
ヤモンドチップを使用することが望ましい。厚膜ペース
ト２２はノズルタンク２１内に充填してあり、外部から
吐出圧が常時加えられている。厚膜ペースト２２にかか
る圧力はそのまま吐出弁２３を下に押し下げ、ノズルタ
ンク２１によって吐出孔２４は閉じられ厚膜ペースト２
２は吐出しない。ヘッド２７が下降し、接触子２８が基
板２６と接触し、吐出圧よりも強い接触圧が生じたとき
に吐出弁２３が押し上げられ吐出孔、２４が開放し同時
に厚膜ペースト２２が吐出する。ＸＹテーブル２６はヘ
ッド下降完了と同時に移動を開始し、基板面上に厚膜回
路を形成する。It is preferable to use a diamond tip for the contactor 28 since it is subject to wear when the substrate 26 is moved. The thick film paste 22 is filled in the nozzle tank 21, and discharge pressure is constantly applied from the outside. The pressure applied to the thick film paste 22 pushes down the discharge valve 23, and the discharge hole 24 is closed by the nozzle tank 21, and the thick film paste 2
2 does not discharge. When the head 27 descends and the contactor 28 comes into contact with the substrate 26, and a contact pressure stronger than the discharge pressure is generated, the discharge valve 23 is pushed up, the discharge hole 24 is opened, and the thick film paste 22 is discharged at the same time. The XY table 26 starts moving at the same time as the head descends, forming a thick film circuit on the substrate surface.
吐出弁２３には０リング２９が取υ付けてあり、ノズル
タンク２１とのすき間から厚膜ペーストが漏れないよう
にしている。またヘッド２７は上下にスライドし、基板
面のそりに追従する１４成となっている。An O-ring 29 is attached to the discharge valve 23 to prevent the thick film paste from leaking from the gap with the nozzle tank 21. Further, the head 27 has a 14-position structure that slides up and down and follows the warpage of the substrate surface.
第２図は吐出弁２３の内部に上下方向にスライドする様
、ピン状の吐出弁２３ａが取り付けてあり、通常の状態
では吐出弁２３ａはスプリング３０によシ下方に押し下
げられる。吐出弁２３ａＫは吐出孔があり、ヘッドプレ
ート２７が下降し、吐出弁２３ａが基板２６により上方
に押し上げられ、吐出孔が開放し厚膜ベースＨ−吐出す
る機溝である。In FIG. 2, a pin-shaped discharge valve 23a is attached inside the discharge valve 23 so as to slide in the vertical direction, and under normal conditions, the discharge valve 23a is pushed downward by a spring 30. The discharge valve 23aK has a discharge hole, and when the head plate 27 is lowered, the discharge valve 23a is pushed upward by the substrate 26, and the discharge hole is opened to form a machine groove for discharging the thick film base H.
第３図は吐出弁２３を電磁ソレノイド３１により摺動さ
せ、コントローラから電磁ソレノイド３１ｉＣ魔流が流
れ、吐出弁２３を押し込み、吐出孔が開放することで厚
膜ペースト２２が吐出する。In FIG. 3, the discharge valve 23 is slid by the electromagnetic solenoid 31, a magic flow from the electromagnetic solenoid 31iC flows from the controller, the discharge valve 23 is pushed in, the discharge hole is opened, and the thick film paste 22 is discharged.
吐出弁２３は電磁ソレノイド２８に電流が流れていない
場合、スプリングの反発力により押しもどされ、吐出孔
２４は閉じた状態にある。When no current flows through the electromagnetic solenoid 28, the discharge valve 23 is pushed back by the repulsive force of the spring, and the discharge hole 24 is in a closed state.
上記第１図から第３図の実施例において吐出孔２４は０
゜１閣〜０゜２Ｍの円形孔を用い、スリット形状孔も可
能である。厚膜ペーストの粘度値が約２０００ Ｐ Ｓ
であった場合吐出圧力は３ Ｋ？ ／ｃｒｄ〜５ Ｋｇ
／ ｔｙＡで吐出可能である。In the embodiments shown in FIGS. 1 to 3 above, the discharge hole 24 is 0.
A circular hole of 1° to 0°2M is used, and a slit-shaped hole is also possible. The viscosity value of thick film paste is approximately 2000 P S
If so, is the discharge pressure 3 K? /crd~5 Kg
/tyA can be discharged.
発明の詳細
な説明した様に１本発明は、厚膜ペーストの流動経路を
開閉する吐出弁をノズル先端部に配設し、吐出圧力？常
時ノズルタンク内の厚膜ペーストに加えておくことによ
り、ＸＹテーブルの移動開始と同時に厚膜ペーストが吐
出され、描画開始位置が所望の位置からズレることなぐ
厚膜回路を形成できる。また吐出圧力が常時一定である
之め圧力変動が起こらず、吐出隆が安定し、描画寸法精
度が向上し、特に抵抗体においては、抵抗値精度の向上
につながる。DETAILED DESCRIPTION OF THE INVENTION As described in detail, one aspect of the present invention is that a discharge valve for opening and closing the flow path of the thick film paste is disposed at the tip of the nozzle, and the discharge pressure is increased. By constantly adding it to the thick film paste in the nozzle tank, the thick film paste is discharged at the same time as the XY table starts moving, and a thick film circuit can be formed without shifting the drawing start position from the desired position. Furthermore, since the discharge pressure is always constant, pressure fluctuations do not occur, the discharge protrusion is stabilized, and the drawing dimension accuracy is improved, which leads to an improvement in the resistance value accuracy, especially in the case of resistors.
第１図、第２図及び第３図は厚膜ペーストの吐出弁をノ
ズル内に配設した本発明の厚膜描画装置のヘッド部の各
実施例を示す断面図、第４図は厚膜描画装置の全体構成
を示す斜視図、第６図は従来のエアー電磁弁を用いた厚
膜描画装置のヘッド部の構成を示す断面図である。
２１・・・・・・ノズルタンク、２２・・・・・・厚膜
べ一、Ｘ）、２３・・・・・吐出弁、２４・・・吐出孔
、２５・・・・・ｘｙ子テーブル２６・・・・・・基板
、２７・・・・・ヘッドプレート、２８ ・・・・接触
子、２９ ・・・ＯＩＪング、３ｏ・・・・・・スプリ
ング、３１・・・・電磁ソレノイドＣ−代理人の氏名
弁理士 中 尾 敏 男 ほか１名２１− ノズルタ
ンク
２ｚ−′厚膜ペースト
Ｚ３−−− Ｉｒｉ士弁
Ｚ４−−− ａ’ｘ−士乙
２５−一一入Ｙ−テーブル
Ｚ６−Ｌ服1, 2, and 3 are cross-sectional views showing embodiments of the head section of the thick film drawing apparatus of the present invention in which a thick film paste discharge valve is disposed in the nozzle, and FIG. 4 is a thick film paste discharging valve. FIG. 6 is a perspective view showing the overall structure of the drawing apparatus, and FIG. 6 is a sectional view showing the structure of the head section of a thick film drawing apparatus using a conventional air solenoid valve. 21...Nozzle tank, 22...Thick film plate, X), 23...Discharge valve, 24...Discharge hole, 25...XY child table 26... Board, 27... Head plate, 28... Contact, 29... OIJ ring, 3o... Spring, 31... Electromagnetic solenoid C -Name of agent
Patent attorney Satoshi Nakao and 1 other person 21- Nozzle tank 2z-'Thick film paste Z3--- Iri Shiben Z4--- a'x-Shi Otsu 25-11 Y-Table Z6-L clothes
Claims (1)
加えた状態で吐出し、同時に基板に対し、ノズルを相対
的に移動させながら前記基板上に導体又は抵抗体の厚膜
を形成するよう構成すると共に、前記厚膜ペーストの流
出経路を開閉する吐出弁ノズル内に配設し、かつ前記ノ
ズル内の厚膜ペーストに常時一定圧力を加えることを特
徴とする厚膜描画装置。(1) Dispense thick film paste under pressure from the discharge hole at the tip of the nozzle, and simultaneously move the nozzle relative to the substrate to form a thick film of a conductor or resistor on the substrate. A thick film drawing apparatus characterized in that the discharge valve is arranged in a nozzle to open and close an outflow path of the thick film paste, and a constant pressure is always applied to the thick film paste in the nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62124225A JPS63289894A (en) | 1987-05-21 | 1987-05-21 | Thick-film drawing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62124225A JPS63289894A (en) | 1987-05-21 | 1987-05-21 | Thick-film drawing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63289894A true JPS63289894A (en) | 1988-11-28 |
Family
ID=14880090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62124225A Pending JPS63289894A (en) | 1987-05-21 | 1987-05-21 | Thick-film drawing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63289894A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012529773A (en) * | 2009-06-09 | 2012-11-22 | ヴィデオジェット テクノロジーズ インコーポレイテッド | Flow printing method |
-
1987
- 1987-05-21 JP JP62124225A patent/JPS63289894A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012529773A (en) * | 2009-06-09 | 2012-11-22 | ヴィデオジェット テクノロジーズ インコーポレイテッド | Flow printing method |
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