JPH03181142A - Stencil for resin-sealing semiconductor integrated device and method for resin-sealing - Google Patents
Stencil for resin-sealing semiconductor integrated device and method for resin-sealingInfo
- Publication number
- JPH03181142A JPH03181142A JP32222189A JP32222189A JPH03181142A JP H03181142 A JPH03181142 A JP H03181142A JP 32222189 A JP32222189 A JP 32222189A JP 32222189 A JP32222189 A JP 32222189A JP H03181142 A JPH03181142 A JP H03181142A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- stencil
- sealing
- hole
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 46
- 239000004065 semiconductor Substances 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 17
- 239000011347 resin Substances 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 239000007788 liquid Substances 0.000 claims description 13
- 238000009429 electrical wiring Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 25
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 238000001125 extrusion Methods 0.000 description 7
- 239000012528 membrane Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電気配線基板の表面実装に於ける半導体集積
素子の樹脂封止用孔版および樹脂封止方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a stencil for resin sealing of semiconductor integrated elements in surface mounting of electrical wiring boards and a resin sealing method.
従来の技術
近時、電気配線基板例えばプリント配線基板の表面実装
に於ては、その高密度化にともない、半導体集積素子（
以下単に「素子」という）を裸状態でプリント基板（以
下単に「基板」という）に搭載した後、素子と基板をボ
ンディングする傾向にある。この場合、基板上に裸状態
で搭載された素子を、品質維持などを目的として、電気
絶縁性樹脂で封止することが必要となる。BACKGROUND OF THE INVENTION Recently, with the increasing density of electrical wiring boards such as printed wiring boards, semiconductor integrated elements (
There is a trend in which a bare printed circuit board (hereinafter simply referred to as a "substrate") is mounted on a printed circuit board (hereinafter simply referred to as a "substrate"), and then the element and the substrate are bonded. In this case, it is necessary to seal the bare element mounted on the substrate with an electrically insulating resin for the purpose of maintaining quality.
従来、素子の樹脂封止法としては、空気圧作動方式のデ
イスペンサーを用いて、基板上に搭載の素子上に液状封
止樹脂を滴下させて封止する、所謂ポツティング法が提
案されている。しかしながら、ボッティング法には以下
の様な問題点があり、好ましくない。Conventionally, as a method for resin-sealing an element, a so-called potting method has been proposed in which a pneumatically actuated dispenser is used to drop a liquid sealing resin onto an element mounted on a substrate for sealing. However, the botting method has the following problems and is not preferable.
（イ）素子を封止する樹脂が半球状の外観形状となり、
厚みが中央を最大として外周に至る程、漸次薄くなるの
で、均一な樹脂封止性が得られない。(a) The resin that seals the element has a hemispherical appearance,
Since the thickness is maximum at the center and gradually becomes thinner toward the outer periphery, uniform resin sealability cannot be obtained.
（ワ）通常四角形である素子を樹脂封止すると、樹脂層
が半球状となって、余分な部分まで封止されるので、搭
載部分の高密度化の点から好ましくない。(iv) When an element that is normally square is sealed with resin, the resin layer becomes hemispherical and the excess portion is sealed, which is undesirable from the standpoint of increasing the density of the mounting portion.
（ハ）ＬＳＩなど大型の素子は、樹脂を数回に別けて滴
下して封止されるが、封止後の外観が二様となりに＜＜
、厚みも不均一となり、樹脂封止性が不安定である。(c) Large devices such as LSIs are sealed by dropping resin in several parts, but the appearance after sealing is different.
, the thickness is also non-uniform, and the resin sealability is unstable.
（ニ）−回の滴下によって一個の素子を封止する方式で
あるので、生産性がよくない。(d) Since one element is sealed by dropping drops twice, the productivity is not good.
（ホ）−回の滴下から次の滴下に移る際、樹脂に糸引き
現象がみられることがあり、糸引きによって基板を汚す
虞れがある。(e) When moving from one dropping to the next, stringing may be observed in the resin, and there is a risk of staining the substrate due to stringing.
発明が解決しようとする問題点
本発明者は、基板上の素子の搭載パターンと同一パター
ンで通孔が形成された孔版を用い、第１図に示す様に、
孔版（３）の通孔（ａ）と基板（１）上の素子（５）の
位置合せを行ない、通孔（ａ）と素子（５）の間に、素
子封止に必要な空隙（７）を形成し、この空隙（７）内
に通孔（ａ）を通じて、液状封止樹脂をスキージの作動
により押込み充填することにより、従来技術の問題点を
解消し得ることを見出し、先に特許出願した（特開昭６
４−８２６３９号）。Problems to be Solved by the Invention The present inventor used a stencil in which through holes were formed in the same pattern as the mounting pattern of the elements on the substrate, and as shown in FIG.
The through hole (a) of the stencil (3) and the element (5) on the substrate (1) are aligned, and a gap (7) necessary for element sealing is created between the through hole (a) and the element (5). ), and by pressing and filling the liquid sealing resin into the gap (7) through the through hole (a) with the operation of a squeegee, we discovered that the problems of the prior art could be solved, and we previously published a patent. I filed an application (Japanese Unexamined Patent Publication No. 6
No. 4-82639).
上記方法によれば、確かに、素子を良好に封止できるが
、以下の様な問題点があり、−層の改良が必要であるこ
とが判明した。According to the above method, it is true that the device can be sealed well, but it has been found that there are the following problems and that the layer needs to be improved.
（へ）孔版を作成する際、通孔を形成することにより、
孔版材料の持つ残留応力の均衡がくずれ、応力集中が起
こり、孔版に反り、うねりなどが生じる。そのため、均
一な樹脂封止性が得られない可能性がある。(f) When creating a stencil, by forming through holes,
The balance of residual stress in the stencil material is disrupted, stress concentration occurs, and the stencil becomes warped or wavy. Therefore, uniform resin sealability may not be obtained.
（ト）基板と孔版の接触面積が大きいため、毛細現象に
より、基板と孔版の隙間から封止樹脂が滲み出る。(G) Since the contact area between the substrate and the stencil is large, the sealing resin oozes out from the gap between the substrate and the stencil due to capillarity.
（チ）基板に素子を搭載して封止した後、改めて他の部
品（抵抗、コンデンサ、コイルなど）を搭載しなければ
ならず、工程が繁雑である。(H) After mounting and sealing the elements on the board, other parts (resistors, capacitors, coils, etc.) must be mounted again, making the process complicated.
問題点を解決するための手段
本発明者は、上記問題点に鑑みて鋭意研究を重ねた結果
、特定の構造を有する孔版を用いる場合には、孔版に反
り、うねりなどが生じないので、より確実により均一な
樹脂封止性が得られ、基板と孔版との隙間から封止樹脂
が滲み出すことがなく、基板上に素子およびその他の部
品をすべて搭載した後でも、素子の封止を行ない得るこ
とを見出し、本発明を完成した。Means for Solving the Problems The inventor of the present invention has conducted extensive research in view of the above problems, and has found that when a stencil having a specific structure is used, the stencil does not warp or undulate. This ensures more uniform resin sealing, prevents the sealing resin from seeping out from the gap between the board and the stencil, and allows the device to be sealed even after all the devices and other components have been mounted on the board. The present invention has been completed.
すなわち本発明は、下記半導体集積素子の封止用孔版お
よび封止方法を提供するものである。That is, the present invention provides a stencil for sealing a semiconductor integrated device and a method for sealing as described below.
■ 電気配線基板上の半導体集積素子の搭載パターンと
同一パターンで通孔部が形成され、且つ、その下面の、
通孔部と通孔部との間および／または通孔部と縁部との
間にザグリ部が設けられていることを特徴とする半導体
集積素子の樹脂封止用孔版。■ A through hole is formed in the same pattern as the mounting pattern of the semiconductor integrated device on the electrical wiring board, and
A stencil for resin sealing a semiconductor integrated device, characterized in that a counterbore is provided between the through holes and/or between the through hole and the edge.
■ 電気配線基板上に半導体集積素子を裸状態で搭載し
、上記素子の搭載パターンと同一パターンで通孔が形成
された孔版の通孔と上記素子の位置合せを行ない、通孔
と素子間に、封正に必要な空隙を形成し、この空隙内に
上記通孔を通じて、スキージの作動により液状封止樹脂
を押込み充填して半導体集積素子を樹脂で封止するに際
し、孔版として上記■の孔版を用いることを特徴とする
半導体集積素子の樹脂封止方法。■ Mount the semiconductor integrated element in a bare state on the electrical wiring board, align the above element with the through hole of the stencil plate in which the through hole is formed in the same pattern as the mounting pattern of the above element, and create a space between the through hole and the element. , a void necessary for sealing is formed, and a liquid sealing resin is pressed into the void through the through hole by the action of a squeegee to seal the semiconductor integrated element with the resin. A resin sealing method for a semiconductor integrated device, characterized by using the following.
実施例 本発明孔版につき、添付図面にもとづき説明する。Example The stencil plate of the present invention will be explained based on the attached drawings.
第２乃至４図は、本発明孔版の一実施例を示す図面であ
り、第２図は平面図、第３図は第２図の破線ｐにおける
断面図、第４図は底面図を示す。2 to 4 are drawings showing an embodiment of the stencil of the present invention, in which FIG. 2 is a plan view, FIG. 3 is a sectional view taken along the broken line p in FIG. 2, and FIG. 4 is a bottom view.
本発明孔版（３）の材質は特に制限されないが、例えば
、銅、ニッケル、ステンレススチールなどの金属が好ま
しい。孔版の厚みは、素子の厚みよりも大きければ特に
制限されず、素子の厚みに応じて適宜選択すれば良い。The material of the stencil (3) of the present invention is not particularly limited, but metals such as copper, nickel, and stainless steel are preferred. The thickness of the stencil is not particularly limited as long as it is larger than the thickness of the element, and may be appropriately selected depending on the thickness of the element.
通常は、０．０１〜５．０ｍｍ程度とすれば良い。Normally, the thickness may be about 0.01 to 5.0 mm.
本発明孔版（３）は、通孔（ａ）を有している。The stencil plate (3) of the present invention has a through hole (a).
該通孔（ａ）は、基板上の素子の搭載パターンと同一の
パターン、すなわち、基板上に搭載された素子の平面形
状と相似形で且つこれよりも大きく形成されており、第
７図に示される様に、素子（５）と同心となるように位
置合わせしたとき、素子（５）の全周面に均−巾の空隙
（７）を形成する。このような構成により、樹脂封止面
積を最小限とすることが可能となる。The through hole (a) is formed in the same pattern as the mounting pattern of the elements on the substrate, that is, in a planar shape similar to and larger than the planar shape of the elements mounted on the substrate, as shown in FIG. As shown, when aligned concentrically with the element (5), a gap (7) of uniform width is formed on the entire circumferential surface of the element (5). With such a configuration, it is possible to minimize the resin sealing area.
通孔（ａ）の有効高さは、上記素子（５）の厚みよりも
大きければ特に制限されず、得ようとする封止樹脂層（
図示せず）の厚みなどに応じて適宜選択決定すればよい
。The effective height of the through hole (a) is not particularly limited as long as it is larger than the thickness of the element (5), and the effective height of the through hole (a) is not particularly limited as long as it is larger than the thickness of the element (5).
The material may be selected and determined as appropriate depending on the thickness of the material (not shown).
通孔（ａ）の直径又は−辺の長さは特に制限されないが
、通常１００＋＋＋ｍ程度未満、好ましくは３０ｍｍ程
度未満とする。１００ｍｍを超えると、後に詳述する様
に、不都合な点が生じる虞れがあるので、通孔（ａ）の
上端部に、孔版（３）の上面に連続して多孔膜を形成し
ても良い。例えば、第５図に示される様に、通孔（ａ）
の上端部に小通孔（ａｌ）を有する多孔膜（ａｌ）を形
成しても良い。多孔膜（ａｌ）の開口面積（すなわち小
通孔（ａｌ）の全面積）は特に制限されないが、通常、
通孔（ａ）全面積の３０〜７０％程度とすれば良い。開
口面積があまり小さいと、スキージによる液状封止樹脂
の押出し充填を妨げる虞れがある。小通孔（ａｌ）の孔
径は、通常０．２〜２．０ｍｍ程度とすれば良い。The diameter or the length of the negative side of the through hole (a) is not particularly limited, but is usually less than about 100+++ m, preferably less than about 30 mm. If it exceeds 100 mm, there is a risk of inconveniences as will be explained in detail later, so it is not possible to form a porous membrane at the upper end of the through hole (a) continuously on the upper surface of the stencil (3). good. For example, as shown in FIG.
A porous membrane (al) having small through holes (al) may be formed at the upper end of the membrane. The opening area of the porous membrane (al) (i.e., the total area of the small through holes (al)) is not particularly limited, but usually,
The through hole (a) may be approximately 30 to 70% of the total area. If the opening area is too small, there is a risk that extrusion and filling of the liquid sealing resin with a squeegee will be hindered. The diameter of the small through hole (al) may normally be about 0.2 to 2.0 mm.
通孔の形成は、例えばエツチング処理などの通常の孔版
印刷法に従って行なうことができる。The through holes can be formed, for example, by a common stencil printing method such as etching.
一方、本発明孔版（３）の下面には、通孔（ａ）と縁部
（ｂ）との間にザグリ部（Ｃ）が設けられている。さら
に図示しないが、孔版に２個以上の通孔が形成されてい
る場合には、通孔と通孔の間にも、ザグリ部を設けても
良い。ザグリ部を設けることにより、本発明の種々の効
果が得られる。On the other hand, a counterbore (C) is provided on the lower surface of the stencil (3) of the present invention between the through hole (a) and the edge (b). Furthermore, although not shown, if two or more through holes are formed in the stencil, counterbore portions may also be provided between the through holes. By providing the counterbore, various effects of the present invention can be obtained.
ザグリ部の大きさ、深さなどは、基板上の素子以外の部
品およびその搭載パターンに応じて適宜選択すれば良い
。ザグリ部の形成は、通孔の形成と同様にして行なうこ
とができる。The size, depth, etc. of the counterbore portion may be appropriately selected depending on components other than elements on the substrate and their mounting pattern. The counterbore portion can be formed in the same manner as the through hole.
本発明の方法は、上記特定構造の孔版を使用する以外は
、特開昭６４−８２６３９号に記載の方法と同様に行な
うことができる。The method of the present invention can be carried out in the same manner as the method described in JP-A-64-82639, except that a stencil having the above-mentioned specific structure is used.
例えば、第６図に示す工程順に従って行なえば良い。第
６図（イ）に示される第１工程に於て、孔版（３）がス
クリーン印刷機（図示せず）の所定位置に、一方基板（
１）が上記印刷機のスライドテーブル（９）上に、それ
ぞれ固定され、更に孔版（３）上に所定量の液状封止樹
脂（１１）が供給される。次に上記印刷機を作動させて
、孔版（３）の通孔（ａ）（第７図参照）と、基板（１
）上に搭載の素子（５）との位置合わせが行なった後、
孔版（３）が基板（１）面に押付けられ、通孔（ａ）内
にこれに対応する上記素子（５）が同心状に収納される
。For example, the steps may be performed in accordance with the process order shown in FIG. In the first process shown in FIG.
1) are respectively fixed on the slide table (9) of the printing machine, and a predetermined amount of liquid sealing resin (11) is further supplied onto the stencil (3). Next, operate the printing machine to open the holes (a) of the stencil (3) (see Figure 7) and the substrate (1).
) After alignment with the element (5) mounted on
A stencil (3) is pressed against the surface of the substrate (1), and the corresponding element (5) is housed concentrically within the through hole (a).
この収納後の状態が第７図に拡大して示され、通孔（ａ
）とこれに収納された素子（５）との間には、素子（５
）の樹脂封止に必要な空隙（７）が形成されている。な
お孔版（３）の下面には、第５図に示される様に、通孔
（ａ）およびザグリ部（ｃ）を除いて、各種乳剤（例え
ばＰＶＡ系）の感光膜（ｄ）を形成してもよい。感光膜
は、素子（５）の樹脂封止操作時に基板面に当接し、ク
ツション層及びシール層として機能する。また膜厚を選
択することにより、孔版（３）の肉厚を調整できる。読
図において、（１３）は、基板（１）に搭載された素子
（５）以外の部品である。The state after storage is shown enlarged in FIG.
) and the element (5) housed therein.
) A gap (7) necessary for resin sealing is formed. As shown in FIG. 5, a photoresist film (d) of various emulsions (for example, PVA type) is formed on the lower surface of the stencil (3), except for the through holes (a) and the counterbore (c). You can. The photosensitive film comes into contact with the substrate surface during the resin sealing operation of the element (5), and functions as a cushion layer and a sealing layer. Further, by selecting the film thickness, the thickness of the stencil (3) can be adjusted. In the drawing, (13) is a component other than the element (5) mounted on the substrate (1).
上記第６図（イ）の工程で、樹脂封止に必要な空隙（７
）が形成された後は、第６図（ロ）に示される様に、液
状封止樹脂（１１）がドクターナイフ（１５）の作動を
して薄層状に広げられる。次に第６図（ハ）に示される
様に、スキージ（１７）を作動させて、樹脂（１１）が
通孔（ａ）を通じて空隙（７）内に押出し充填される。In the process shown in Figure 6 (a) above, the voids (7
) is formed, the liquid sealing resin (11) is spread into a thin layer by the operation of the doctor knife (15), as shown in FIG. 6(b). Next, as shown in FIG. 6(c), the squeegee (17) is operated to extrude and fill the resin (11) into the gap (7) through the through hole (a).
而して、この押出し充填後、孔版（３）を当初の位置ま
で退去させることにより、第６図（ニ）に示される様に
、素子（５）が樹脂層（１１”）で封止される。孔版（
３）の基板（１）面への押付けと、スキージ（１７）に
よる樹脂（１１）の押出し充填を同時に行なってもよい
。封止後は、常法に従い樹脂を硬化させればよい。After this extrusion and filling, the element (5) is sealed with the resin layer (11'') by retracting the stencil (3) to its original position, as shown in FIG. 6(d). Duplicate (
The pressing of 3) onto the surface of the substrate (1) and the extrusion filling of the resin (11) using the squeegee (17) may be performed simultaneously. After sealing, the resin may be cured according to a conventional method.
なお、通孔（ａ）の直径又は−辺の長さが１００ｍｍを
超えるような大きなものである場合、孔版（３）の基板
（１）面への押付けと、スキージ（１７）による樹脂（
１１）の押出し充填を同時に行なうと、ドクターナイフ
（１５）による液状封止樹脂（１１）の返しを行なう際
に液だれか生じたり、或いはスキージ（１７）による樹
脂（１１）の押出し充填時にスキージ（１７）下端のゴ
ム質の部分が通孔（ａ）に食い込み、樹脂層（１１’
）の上面を湾入させる可能性がある。これを防止するた
めに、上述した様に、通孔（ａ）の上端部に多孔膜（ａ
ｌ）を形成してもよい（第５図）。In addition, if the diameter of the through hole (a) or the length of the negative side exceeds 100 mm, pressing the stencil (3) onto the substrate (1) surface and using the squeegee (17) to remove the resin (
If the extrusion filling in step 11) is performed at the same time, a drip may occur when the liquid sealing resin (11) is returned with the doctor knife (15), or a squeegee may occur when extruding and filling the resin (11) with the squeegee (17). (17) The rubber part at the lower end bites into the through hole (a), and the resin layer (11'
) may cause the top surface to be indented. In order to prevent this, as mentioned above, a porous membrane (a) is placed at the upper end of the through hole (a).
1) may be formed (FIG. 5).
封止に用いられる液状樹脂（１１）としては、シリコン
樹脂、エポキシ樹脂、ウレタン樹脂、ポリブタジェン樹
脂、フェノール樹脂、アクリル樹脂、ポリイミド樹脂な
どの公知の樹脂或いは樹脂組成物を用いることができる
。その中でも、例えば、液状エポキシ樹脂、芳香族ジア
ミンと第４級フォスフオニウム塩との反応生成物である
硬化剤、難燃剤、無機質充填物などを含有する一液性エ
ボキシ樹脂組成物などが好ましい。As the liquid resin (11) used for sealing, known resins or resin compositions such as silicone resin, epoxy resin, urethane resin, polybutadiene resin, phenol resin, acrylic resin, and polyimide resin can be used. Among these, preferred are, for example, liquid epoxy resins, one-component epoxy resin compositions containing a curing agent that is a reaction product of an aromatic diamine and a quaternary phosphonium salt, a flame retardant, an inorganic filler, etc. .
また、液状樹脂の粘度は、特に制限されないが、充填性
、封止樹脂層が硬化する迄の形状維持性などを考慮する
と、常温で２００〜２０００ポイズ程度とするのがよい
。Further, the viscosity of the liquid resin is not particularly limited, but it is preferably about 200 to 2000 poise at room temperature in consideration of filling properties, shape retention until the sealing resin layer is cured, and the like.
液状樹脂の粘度が高い場合には、第８図に示す様な構造
を有するスキージ（１７）を用いて、押出し充填を行な
ってもよい。該スキージ（１７）は、ホルダー（１９）
の下端に、２等辺三角状の押出し部材（２１）と、該部
材（２１）の進行方向前面側の傾斜面（２３）と、直線
で結べるように連接され、インキ返しに相当する傾斜板
（２５）を備えている。When the viscosity of the liquid resin is high, extrusion filling may be performed using a squeegee (17) having a structure as shown in FIG. The squeegee (17) is attached to a holder (19)
An isosceles triangular extrusion member (21) and an inclined surface (23) on the front side in the direction of movement of the member (21) are connected to the lower end of the member (21) so that they can be connected in a straight line. 25).
傾斜板（２５）の傾斜角度θは、通常３０〜７０″程度
とすればよい。押出し部材（２１）および傾斜板（２１
）は、いずれもゴム製（例えばウレタンゴム、ＳＢＲ，
ネオプレンゴム、ブチルゴムなど）のものが好ましく、
８０〜９０’程度の硬度（ＪＩＳ６３０１規格）を持ち
、通常のスキージの硬度（６５°〜７５°）よりも材質
的に多少硬いものが用いられる。このようなスキージ（
１７）を用いることにより、粘度の高い液状封止樹脂（
１１）の押出し充填を支障なく行なうことができる。The inclination angle θ of the inclined plate (25) may normally be about 30 to 70''.
) are all made of rubber (e.g. urethane rubber, SBR,
Neoprene rubber, butyl rubber, etc.) are preferred.
A material having a hardness of about 80 to 90' (JIS6301 standard), which is slightly harder than a normal squeegee (65 to 75 degrees), is used. A squeegee like this (
17), high viscosity liquid sealing resin (
11) The extrusion filling can be carried out without any problem.
発明の効果 本発明によれば、下記の様な優れた効果が達成される。Effect of the invention According to the present invention, the following excellent effects are achieved.
■）本発明孔版はザグリ部を有しているので、その製造
時に、反り、うねりなどが生じない。そのため、封止樹
脂の厚みがより均一となり、安定でより確実な樹脂封止
効果が得られる。(2) Since the stencil of the present invention has a counterbore, no warping or waviness occurs during its manufacture. Therefore, the thickness of the sealing resin becomes more uniform, and a stable and more reliable resin sealing effect can be obtained.
■）本発明孔版にザグリ部が形成されているため、基板
と孔版との隙間から封止樹脂が滲み出すことがない。(2) Since the counterbore portion is formed in the stencil of the present invention, the sealing resin does not ooze out from the gap between the substrate and the stencil.
■）本発明孔版にザグリ部が形成されているため、基板
上に素子およびその他の部品をすべて搭載した後でも、
素子の樹脂封止を行ない得る。且つ、素子を最小面積で
樹脂封止し得るので、基板の高密度化に対処できる。■) Because the stencil of the present invention has a counterbore, even after all the elements and other parts are mounted on the board,
The element can be sealed with resin. In addition, since the element can be sealed with resin in a minimum area, it is possible to cope with increasing the density of the substrate.
■）封止樹脂層の厚みのコントロールが容易である。■) It is easy to control the thickness of the sealing resin layer.
■）プリトン基板上に搭載されたすべての半導体集積素
子を、−度に樹脂封止できるので、生産性に優れる。(2) All the semiconductor integrated elements mounted on the Pryton substrate can be sealed with resin at once, resulting in excellent productivity.
Ｖｌ） ＬＳ Ｉ、 ＶＬＳ Ｉなど大型のものであっ
ても、−回の操作で樹脂封止できるので、樹脂の糸引き
現象が発生せず、基板の汚染を防止できる。Vl) Even large devices such as LSI and VLSI can be sealed with resin in just one operation, so resin stringing does not occur and contamination of the substrate can be prevented.
第１図は特開昭６４−８２６３９号に記載の方性の概略
説明図、第２図乃至第５図は本発明孔版の一例を示す図
面、第６図（イ）〜（ニ）は本発明方法の一実施状況を
工程順に示す概略図、第７図は孔版の通孔と基板上の半
導体集積素子の位置合わせ状況を示す拡大断面図、第８
図は本発明法に適用される好ましいスキージの一例を示
す縦断側面図である。
図において、（ａ）は通孔部、（ａ＋）は多孔膜、（ａ
２）は小通孔、（ｂ）は縁部、（Ｃ）はザグリ部、（ｄ
）は感光膜、（１）はプリント基板、（３）は孔版、（
５）は半導体集積素子、（７）は樹脂封止に必要な空隙
、（９）はスクリーン印刷機のスライドテーブル、（１
１）は液状封止樹脂、（１１’ ）は樹脂層、（１３）
は半導体集積素子以外の部品、（１５）はドクターナイ
フ、（１７）はスキージ、（１９）はホルダー （２１
）は押出し部材と、（２３）は傾斜面、（２５）は傾斜
板である。
（以 上）
一−／ｒ＋
第
図
Ｉ！３ 閃
慎
図
箪
図
第
６
図
５
第
図
第
図Fig. 1 is a schematic explanatory diagram of the orientation described in JP-A No. 64-82639, Figs. 2 to 5 are drawings showing an example of the stencil plate of the present invention, and Figs. FIG. 7 is an enlarged cross-sectional view showing the positioning of the holes in the stencil and the semiconductor integrated device on the substrate; FIG.
The figure is a longitudinal side view showing an example of a preferable squeegee applied to the method of the present invention. In the figure, (a) is the through hole part, (a+) is the porous membrane, (a
2) is the small through hole, (b) is the edge, (C) is the counterbore, (d
) is a photosensitive film, (1) is a printed circuit board, (3) is a stencil, (
5) is a semiconductor integrated element, (7) is a gap necessary for resin sealing, (9) is a slide table of a screen printing machine, (1)
1) is liquid sealing resin, (11') is resin layer, (13)
Components other than semiconductor integrated elements, (15) a doctor knife, (17) a squeegee, (19) a holder (21)
) is an extruded member, (23) is an inclined surface, and (25) is an inclined plate. (and above) 1-/r+ Figure I! 3 Senshinzu Tanzu Figure 6 Figure 5 Figure Figure
Claims (2)
と同一パターンで通孔部が形成され、且つ、その下面の
、通孔部と通孔部との間および／または通孔部と縁部と
の間にザグリ部が設けられていることを特徴とする半導
体集積素子の樹脂封止用孔版。(1) Through-holes are formed in the same pattern as the mounting pattern of the semiconductor integrated device on the electrical wiring board, and between the through-holes and/or between the through-holes and the edge on the lower surface thereof. A stencil for resin sealing of a semiconductor integrated device, characterized in that a counterbore is provided between the stencil and the stencil.
し、上記素子の搭載パターンと同一パターンの通孔が形
成された孔版の通孔と上記素子の位置合せを行ない、通
孔と素子間に、封止に必要な空隙を形成し、この空隙内
に上記通孔を通じて、スキージの作動により液状封止樹
脂を押込み充填して半導体集積素子を樹脂で封止するに
際し、孔版として請求項１の孔版を用いることを特徴と
する半導体集積素子の樹脂封止方法。(2) Mount the semiconductor integrated element in a bare state on the electrical wiring board, align the element with the through hole of the stencil plate in which the through hole of the same pattern as the mounting pattern of the element is formed, and align the through hole and the element. A gap necessary for sealing is formed in between, and a liquid sealing resin is forced into the gap through the through hole by the operation of a squeegee to seal the semiconductor integrated element with the resin. 1. A resin sealing method for a semiconductor integrated device, characterized in that the stencil according to No. 1 is used.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1322221A JP2807838B2 (en) | 1989-12-11 | 1989-12-11 | Stencil for resin sealing of semiconductor integrated element and resin sealing method |
| US07/624,440 US5232651A (en) | 1989-12-11 | 1990-12-10 | Method of sealing electric parts mounted on electric wiring board with resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1322221A JP2807838B2 (en) | 1989-12-11 | 1989-12-11 | Stencil for resin sealing of semiconductor integrated element and resin sealing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03181142A true JPH03181142A (en) | 1991-08-07 |
| JP2807838B2 JP2807838B2 (en) | 1998-10-08 |
Family
ID=18141297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1322221A Expired - Lifetime JP2807838B2 (en) | 1989-12-11 | 1989-12-11 | Stencil for resin sealing of semiconductor integrated element and resin sealing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2807838B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5419413A (en) * | 1993-07-06 | 1995-05-30 | Hiroshi Sasaki | Lubrication system for a tool holder |
| WO1997033304A3 (en) * | 1996-02-23 | 1997-10-16 | Mpm Corp | Applying encapsulating material to substrates |
| JP2000068302A (en) * | 1998-08-25 | 2000-03-03 | Rohm Co Ltd | Packaging method in hybrid integrated circuit |
| US6224674B1 (en) | 1998-05-29 | 2001-05-01 | Matsushita Electric Works, Ltd. | Seal coating mask for semiconductor element and method of use thereof |
| JP2010103352A (en) * | 2008-10-24 | 2010-05-06 | Process Lab Micron:Kk | Pasted printing plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01270325A (en) * | 1988-04-22 | 1989-10-27 | Seiko Epson Corp | Mask for potting seal |
-
1989
- 1989-12-11 JP JP1322221A patent/JP2807838B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01270325A (en) * | 1988-04-22 | 1989-10-27 | Seiko Epson Corp | Mask for potting seal |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5419413A (en) * | 1993-07-06 | 1995-05-30 | Hiroshi Sasaki | Lubrication system for a tool holder |
| WO1997033304A3 (en) * | 1996-02-23 | 1997-10-16 | Mpm Corp | Applying encapsulating material to substrates |
| US6067709A (en) * | 1996-02-23 | 2000-05-30 | Mpm Corporation | Applying encapsulating material to substrates |
| US6224674B1 (en) | 1998-05-29 | 2001-05-01 | Matsushita Electric Works, Ltd. | Seal coating mask for semiconductor element and method of use thereof |
| JP2000068302A (en) * | 1998-08-25 | 2000-03-03 | Rohm Co Ltd | Packaging method in hybrid integrated circuit |
| JP2010103352A (en) * | 2008-10-24 | 2010-05-06 | Process Lab Micron:Kk | Pasted printing plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2807838B2 (en) | 1998-10-08 |
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