JPS63288975A - 地導体をもつセラミック回路基板およびその製造法 - Google Patents

地導体をもつセラミック回路基板およびその製造法

Info

Publication number
JPS63288975A
JPS63288975A JP12285287A JP12285287A JPS63288975A JP S63288975 A JPS63288975 A JP S63288975A JP 12285287 A JP12285287 A JP 12285287A JP 12285287 A JP12285287 A JP 12285287A JP S63288975 A JPS63288975 A JP S63288975A
Authority
JP
Japan
Prior art keywords
copper
substrates
circuit board
ceramics
ground conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12285287A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0445476B2 (enrdf_load_stackoverflow
Inventor
Naoyuki Kanehara
尚之 金原
Masahiro Furo
正博 風呂
Tetsuo Kohata
降幡　哲夫
Michihiro Kosaka
小坂　満弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP12285287A priority Critical patent/JPS63288975A/ja
Publication of JPS63288975A publication Critical patent/JPS63288975A/ja
Publication of JPH0445476B2 publication Critical patent/JPH0445476B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Ceramic Products (AREA)
  • Structure Of Printed Boards (AREA)
JP12285287A 1987-05-20 1987-05-20 地導体をもつセラミック回路基板およびその製造法 Granted JPS63288975A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12285287A JPS63288975A (ja) 1987-05-20 1987-05-20 地導体をもつセラミック回路基板およびその製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12285287A JPS63288975A (ja) 1987-05-20 1987-05-20 地導体をもつセラミック回路基板およびその製造法

Publications (2)

Publication Number Publication Date
JPS63288975A true JPS63288975A (ja) 1988-11-25
JPH0445476B2 JPH0445476B2 (enrdf_load_stackoverflow) 1992-07-24

Family

ID=14846235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12285287A Granted JPS63288975A (ja) 1987-05-20 1987-05-20 地導体をもつセラミック回路基板およびその製造法

Country Status (1)

Country Link
JP (1) JPS63288975A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014045169A (ja) * 2012-07-31 2014-03-13 Kyocera Corp 電子部品搭載用基板およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014045169A (ja) * 2012-07-31 2014-03-13 Kyocera Corp 電子部品搭載用基板およびその製造方法

Also Published As

Publication number Publication date
JPH0445476B2 (enrdf_load_stackoverflow) 1992-07-24

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