JPS63288745A - Laminated plate - Google Patents
Laminated plateInfo
- Publication number
- JPS63288745A JPS63288745A JP12439987A JP12439987A JPS63288745A JP S63288745 A JPS63288745 A JP S63288745A JP 12439987 A JP12439987 A JP 12439987A JP 12439987 A JP12439987 A JP 12439987A JP S63288745 A JPS63288745 A JP S63288745A
- Authority
- JP
- Japan
- Prior art keywords
- oxide
- dielectric constant
- ceramic fiber
- laminated plate
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 239000000835 fiber Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 11
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 10
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 10
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 8
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 7
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 6
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000000465 moulding Methods 0.000 claims abstract description 3
- 229910052810 boron oxide Inorganic materials 0.000 claims abstract 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000292 calcium oxide Substances 0.000 abstract description 4
- 230000000994 depressogenic effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- NTGONJLAOZZDJO-UHFFFAOYSA-M disodium;hydroxide Chemical compound [OH-].[Na+].[Na+] NTGONJLAOZZDJO-UHFFFAOYSA-M 0.000 description 1
- -1 fluororesins Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000002074 melt spinning Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、絶縁基板として使用されるセラミック繊維不
織布基材積層板に関し、目的は誘導率の低減である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a ceramic fiber nonwoven substrate laminate used as an insulating substrate, the purpose of which is to reduce the dielectric constant.
従来の技術
一般に、積層板は、シート状の基材に樹脂を含浸乾燥し
て得たプリプレグを積層成形して製造される。前記基材
としてセラミック繊維不織布を用いる積層板は、セラミ
ック繊維の特徴である寸法収縮率が小さいことと、不織
布であるため安価で、打抜加工性が良好であることから
絶縁基板として電子業界で多用されている。2. Description of the Related Art In general, a laminate is manufactured by laminating and molding prepreg obtained by impregnating a sheet-like base material with a resin and drying it. Laminated plates using ceramic fiber nonwoven fabric as the base material are popular in the electronics industry as insulating substrates because they have a small dimensional shrinkage rate, which is a characteristic of ceramic fibers, and because they are nonwoven fabrics, they are inexpensive and have good punching workability. It is widely used.
前記のセラミック繊維は、酸化ケイ素（ＳｉＯ□）、酸
化アルミニウム（Ａｉｍ Ｏａ ）、酸化カルシウム（
Ｏａ Ｏ）％酸化マグネシウム（ＭｇＯ）、酸化ホウ素
（Ｂ２Ｏ３）酸化ナトリウム（Ｎａ會Ｏ）、酸化カリウ
ム（Ｋ、０）などの成分より構成されていることが知ら
れている。The ceramic fibers mentioned above include silicon oxide (SiO□), aluminum oxide (Aim Oa), calcium oxide (
It is known that it is composed of components such as magnesium oxide (MgO), boron oxide (B2O3), sodium oxide (NaO), and potassium oxide (K, 0).
発明か解決しようとする問題点
しかしながら、積層板を構成している材料の約半分を占
めるセラミック繊維の誘電率か高いため、これをプリン
ト配線の絶縁基板として用いたとき、高密度配線化に伴
なうパルスの伝播速度を遅くするとか、誤動作をするな
どの欠点かあり、その改善が求められていた。Problem to be Solved by the Invention However, due to the high dielectric constant of ceramic fibers, which make up about half of the materials that make up the laminate, when used as an insulating substrate for printed wiring, it becomes difficult to use as the wiring density increases. There were drawbacks such as slowing down the propagation speed of pulses and malfunctions, and improvements were needed.
本発明は、低誘電率のセラミック繊維不織布基材積層板
を提供することを目的とする。An object of the present invention is to provide a ceramic fiber nonwoven fabric substrate laminate having a low dielectric constant.
間匙点を解決するための手段
本発明は、積層板の基材として用いるセラミック繊維不
織布のセラミック繊維が、酸化ケイ素（８ｉ ０＝ ）
を主成分とすると共に酸化ホウｉ（Ｂ２Ｏ３）を含み、
かつ酸化アルミニウム（Ａｉｍ Ｏ，）、酸化カルシウ
ム（ＯａＯ）。Means for Solving the Problem The present invention provides that the ceramic fibers of the ceramic fiber nonwoven fabric used as the base material of the laminate are made of silicon oxide (8i 0= )
The main component is boron oxide (B2O3),
and aluminum oxide (Aim O,), calcium oxide (OaO).
ｅ化マグネシウム（ＭｇＯ）の含有量の合計が５重ｆｌ
１％以下である点に特徴を有する。The total content of magnesium e-oxide (MgO) is 5 fl
It is characterized in that it is 1% or less.
作用
ＳｉＯ宥は、誘電率か３．５と低く、一方、５ｉＯ１を
含む天然原石に一緒に含まれている匂。The effect of SiO is a low dielectric constant of 3.5, while the odor contained in natural raw stones containing 5iO1.
０、は９〜１０、ＯａＯかｌｌ〜１２．ＭｇＯが９〜１
０と、いずれも誘電率が高い。これら誘電率の高い成分
の含有量の合計を５重量幅以下の少ない量に抑えたセラ
ミック繊維の不織布を基材とすることにより、低誘電率
の積層板を提供することができる。0, 9-10, OaOll-12. MgO is 9-1
0, both have high dielectric constants. By using a ceramic fiber nonwoven fabric as a base material in which the total content of these high dielectric constant components is kept to a small amount of 5 weight width or less, a laminate with a low dielectric constant can be provided.
尚、セラミック繊維の熔融紡糸性からみて。In addition, considering the melt-spinning properties of ceramic fibers.
５ｉＯ＝の含有量を極端に増やすことには限界があり、
Ｂ ＊ ０−の成分比率を高くして、誘電率が高（なる
のを防ぐと共に熔融紡糸性も確保する。Ａ４ｔ Ｏｓ
、ＯａＯｌＭｇＯの含有量は、低誘電率化の面からはＯ
に近い方がよいか、熔融防糸性の面からは少し含む方か
よい。その含有量の合計は５重ｆｆ１４以下、好ましく
は１〜３重量憾である。There is a limit to extremely increasing the content of 5iO=,
By increasing the component ratio of B*0-, the dielectric constant is prevented from becoming high, and melt spinnability is also ensured. A4t Os
, OaOlMgO content is O from the viewpoint of lower dielectric constant.
It is better to have it close to , or it is better to include it a little from the viewpoint of melt-proofing properties. The total content is 5 weights ff14 or less, preferably 1 to 3 weights.
実施例
本発明で、セラミック繊維不織布に含浸乾燥する樹脂に
ついては、特に限定しないか、積層板の耐熱性、絶縁性
の面からエポキシ樹脂が好ましく、更に低誘導率化を図
るため、誘電率か低いポリブタジェン樹脂、フッ素樹脂
、ポリサルフォン樹脂なども使用できる。積層板に用い
る樹脂のみを低誘電率化することについては数多くの検
討例がみられるが、積層板の寸法安定性、耐熱性などに
悪影響か出て実用化に至っていない。Example In the present invention, the resin to be impregnated and dried into the ceramic fiber nonwoven fabric is not particularly limited, but epoxy resin is preferable from the viewpoint of heat resistance and insulation of the laminate. Low polybutadiene resins, fluororesins, polysulfone resins, etc. can also be used. There have been many studies on lowering the dielectric constant of only the resin used in laminates, but this has not been put to practical use because of the negative effects on the dimensional stability, heat resistance, etc. of the laminate.
本発明は、積層板構成材料の残り半分を占める基材の低
誘電率化を狙ったものであり、使用実績かあり、耐熱性
、絶縁性の良好なエポキシ樹脂をそのまま用いても、積
層板の低誘電率かが図れる。The present invention aims to lower the dielectric constant of the base material, which accounts for the remaining half of the laminate constituent material. The low dielectric constant can be estimated.
次に、本発明の実施例について説明する。Next, examples of the present invention will be described.
第１表に示す組成のセラミック繊維を抄造してなる不織
布に、エポキシ樹脂を７０重ｆｉ４になるように含浸乾
燥して得たプリプレグを８枚積層し、これをｔａｏ’ｃ
で３０分間加圧、加熱して厚さ１．６鬼の積層板を作っ
た。Eight sheets of prepreg obtained by impregnating and drying a nonwoven fabric made of ceramic fibers having the composition shown in Table 1 with epoxy resin to a thickness of 70 times fi4 are laminated, and this is
A laminate with a thickness of 1.6mm was made by applying pressure and heating for 30 minutes.
この積層板の特性を第２表に示す。尚、第１表、第２表
の試料磁はそれぞれ対応し、Ｎ１ｋｌ〜２が従来知られ
ていた誘電率に問題のあった従来例であり、Ｎ１１３〜
４が本発明例である。The properties of this laminate are shown in Table 2. The sample magnets in Tables 1 and 2 correspond to each other, and N1kl~2 is a conventional example with a known dielectric constant problem, and N113~
4 is an example of the present invention.
第 １ 表 秦ｌ 紡糸不可：Ｘ、やや悪い：Δ１問題ない：○ 第 ２ 表 秦２ 特性試験はＪＩＳ法によった。Chapter 1 Table Qin l Unable to spin: X, slightly bad: Δ1 No problem: ○ Table 2 Hata 2 Characteristic tests were conducted in accordance with the JIS method.
発明の効果
第２表の結果から明らかなように１本発明の積層板は誘
電率が低く、他の特性も十分満足しており、プリント配
線の高密度化に対応できる絶縁基板として、その価値は
極めて大なるものである。Effects of the Invention As is clear from the results in Table 2, the laminate of the present invention has a low dielectric constant and satisfies other properties, and has great value as an insulating substrate that can accommodate higher density printed wiring. is extremely large.
Claims (1)
積層成形してなる積層板において、前記基材が酸化ケイ
素（ＳｉＯ＿２）を主成分とすると共に酸化ホウ素（Ｂ
＿２Ｏ＿３）を含み、かつ酸化アルミニウム（Ａｌ＿２
Ｏ＿３）、酸化カルシウム（ＣａＯ）、酸化マグネシウ
ム（ＭｇＯ）の含有量の合計が５重量％以下であるセラ
ミック繊維で構成された不織布であることを特徴とする
積層板。In a laminate formed by laminating and molding prepreg obtained by impregnating and drying a sheet-like base material with a resin, the base material contains silicon oxide (SiO_2) as a main component and boron oxide (B).
_2O_3) and contains aluminum oxide (Al_2
A laminate comprising a nonwoven fabric made of ceramic fibers having a total content of O_3), calcium oxide (CaO), and magnesium oxide (MgO) of 5% by weight or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12439987A JPS63288745A (en) | 1987-05-21 | 1987-05-21 | Laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12439987A JPS63288745A (en) | 1987-05-21 | 1987-05-21 | Laminated plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63288745A true JPS63288745A (en) | 1988-11-25 |
| JPH0438769B2 JPH0438769B2 (en) | 1992-06-25 |
Family
ID=14884477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12439987A Granted JPS63288745A (en) | 1987-05-21 | 1987-05-21 | Laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63288745A (en) |
-
1987
- 1987-05-21 JP JP12439987A patent/JPS63288745A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0438769B2 (en) | 1992-06-25 |
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