JPS6328863A - Vacuum treatment device - Google Patents

Abstract

PURPOSE:To eliminate atmospheric pollution and particle contamination and to improve the efficiency of an operation by communicating respective consecutive vacuum treatment chambers via sluice valves to a vacuum conveying chamber and moving substrates successively by using auxiliary conveying means. CONSTITUTION:The substrate A is introduced into the forward prevacuum chamber 8. The inside of the chamber 8 is evacuated and the sluice valve 5 on the lower side thereof is opened. The auxiliary conveying means 7 is moved upward to take the substrate A out thereof into the lower conveying chamber 2 thereof, then the sluice valve 5 is closed. The substrate A is transferred from a substrate receiver 7c on the conveying means 7 side to a substrate receiver 1c on the conveying means 1 side standing by in the upper space thereof. The substrate A is successively guided to right under the succeeding vacuum treatment chambers 4 by the actuation of the conveying means 1. The sluice valve 5 is then opened and the auxiliary conveying means 7 on the lower side thereof is moved upward to introduce the substrate A into the treatment chamber 4. The sluice valve 5 is then closed and the substrate is subjected to the prescribed vacuum treatment. The substrate A is thereafter introduced into the succeeding backward treatment chambers in the same manner and is subjected to respective vacuum treatments.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for continuously applying vacuum processing such as sputtering, dry etching, vacuum evaporation, etc. to silicon wafers and other substrates in multiple stages according to Class 6. The present invention relates to vacuum processing equipment of the type.

(Prior Art) Conventionally, as this type of apparatus, one is known in which a substrate is sequentially introduced into a plurality of vacuum processing chambers v, and each vacuum processing is sequentially performed on the substrate in each processing chamber.

(Problem to be Solved by the Invention) However, in this case, the configuration is generally as shown in FIG. At the same time, two adjacent processing yb are generally communicated with each other through gate valves C in between. After that, process this in the subsequent stage! When conducting the next process by guiding the image into the image processing area ibb, the intermediate gate valve C is temporarily released. In order to prevent this, it is necessary to evacuate each chamber to a high vacuum before opening the valve C, which makes the work inefficient. The transport means for transporting the substrate A along the transport path a must move between both ibbs, which is accompanied by disadvantages such as the possibility of particle contamination between compartments bb. In the figure, O indicates each preliminary vacuum chamber connected to the processing ybb at both ends via each gate valve C.

(Means for Solving the Problems) The object of the present invention is to obtain an apparatus free from the above-mentioned disadvantages, in which a substrate is sequentially guided into a plurality of vacuum processing chambers, and each In a processing chamber in which each vacuum treatment is performed, a vacuum transfer chamber is provided for accommodating a transfer means for guiding the substrate along a transfer path in the front and back direction, and
The plurality of vacuum processing chambers are sequentially arranged on the side thereof, and these are communicated in parallel with each other through gate valves into the vacuum transfer chamber, and furthermore, each vacuum processing chamber is connected to the transfer path through each gate valve. Each branch path extending into the processing chamber is formed, and each auxiliary transport means is provided in the vacuum transfer chamber to allow the substrate to be freely introduced and guided into each vacuum processing chamber along each branch path, and the substrate is moved along each branch path. (repeatedly), and the entire conveyed white is guided forward or back and forth along the conveyance path.

It is a simple explanatory diagram of the second drawing, in which (1) is the base A
(2) is a vacuum transfer chamber that accommodates the transfer means (1), and (3) is a vacuum that evacuates the interior of the intersection (2) to a predetermined degree of vacuum. Shows the exhaust system,
A plurality of vacuum processing chambers (4) for sputtering and other vacuum processing are arranged on the side thereof, and these are connected in parallel to each other through gate valves (5) into the transfer chamber (2). I tried to communicate with . In the drawing, (6) is each processing room (4)
Each vacuum evacuation system that evacuates the interior to a predetermined degree of vacuum is shown. Furthermore, each branch path Y extending into each processing chamber (4) via each gate valve (5) is formed in the above-mentioned transport path Along the path Y, each auxiliary transport means (7) is provided which can be freely introduced into and taken out of each processing chamber (4), so that the substrate A can be transferred along each branch path Y into each vacuum processing chamber (4). While repeating the process of guiding the
) was guided forward along the conveyance path X, so that it could be freely taken out as a product in front of it. In the drawing, (8) is the transfer chamber (
Each preparatory vacuum chamber is connected before and after 2) via each gate valve (5), and (9) shows its evacuation system.

In addition, the one shown is a vacuum! 2! Although a plurality of l-labor rooms (4) are arranged on both the left and right sides of the transfer room (2), the present invention is not limited to this, and it is also possible to arrange them only on the - side, and furthermore, It is also possible to use both sides or one side thereof. Further, although the substrate A is guided and processed in a horizontal state in the illustrated case, it is also possible to have it in a vertical state.

(Function) To explain the function, each vacuum treatment f! (4) is
When introducing and extracting the substrate A, each gate valve (5) opens and communicates with the inside of the vacuum transfer chamber (2) on the side thereof.
) in which the corresponding auxiliary conveyance means (7) are guided, and thus, when the substrate A is sequentially moved, the atmosphere contamination occurs in the type in which the adjacent processing handles are in direct communication with each other. In addition, there is no particle contamination in a type in which the conveyance means moves through a rainy space, and in other words, various inconveniences in the conventional type described above can be eliminated.

(Example) FIG. 3 shows an example of its implementation, in which the substrate A is made of a silicon wafer, and the vacuum processing chamber (4) is placed above the vacuum transfer chamber (2). The front and rear RF etching chambers (4a) are provided in the front and rear RF etching processing chambers (4a), and more specifically, these three
), a middle-stage first sputtering processing chamber (4) having a sputtering source (4b) therein;
) and a second sputtering processing chamber (4) at the rear stage, and the preliminary vacuum chambers (8) are arranged before and after the second sputtering processing chamber (4). Further, the conveyance means (1) includes a belt conveyor (1) extending in the front and back direction on the lower side of the conveyance chamber (2).
a) and a motor or other drive source (1b) at the end thereof, and a substrate holder (1b) on the conveyor (1a).
C), and each branch path Y extends upward from the conveyance path X, and each auxiliary conveyance means (7) has a lifting rod (7b ) is equipped with a base holder (7C) at the tip. In the illustrated embodiment, the front and rear preliminary vacuum chambers (8) are also provided with a branch path Y and each auxiliary conveyance means (7) that ascends and descends along the branch path Y in substantially the same way.

To explain its operation, the base A is placed in the preliminary vacuum chamber (
8) After introducing air into the chamber (8), the inside of the chamber (8) is evacuated, and then the lower gate valve (5) is opened, and the lower auxiliary conveying means (7) is moved upward. the base body into its lower conveyor (2), and then the gate valve (
5) Close. At this time, the base A is connected to the conveying means (7).
The substrate A is transferred from the substrate receiver (7C) on the side to the substrate receiver (1C) on the transport means (1) side waiting in the upper space, and then by the operation of the transport means (1), the substrate A is It is guided directly below the next vacuum processing chamber (4). Next, from this state, when the gate valve (5) of the chamber (4) is opened and the auxiliary conveyance means (7) below it is moved upward, the substrate A is guided into the processing chamber (4). Then, the gate valve (5) is closed, and the substrate is subjected to a predetermined vacuum treatment, such as a sputtering treatment, in the opening (4). The substrate A is then installed in each processing chamber (4
) and are sequentially guided through each vacuum treatment, and then taken out to the outside through the preliminary vacuum chamber (8) at the rear.

The movement of the substrate A is, for example, as shown in FIG. The substrates in the vacuum processing chambers (4) at the rear of the vacuum processing chambers (4) are taken out from the bottom after finishing the processing, and the substrates A are placed in each of the processing chambers (4) at the rear of the vacuum processing chambers (4). , each gate valve (5)
is closed and ready for each vacuum treatment.

The above is a case of sputtering processing, but it is not limited to this. For example, it is also possible to perform dry etching processing in each processing chamber (4), and in this case, during the winter solstice (4) It is assumed that each etching gas is introduced by an introduction system (not shown).

(Effects of the Invention) As described above, according to the present invention, a plurality of vacuum processing chambers are communicated with each other in parallel to the vacuum transfer chambers on their sides through the respective gate valves, and each processing chamber is connected to the vacuum transfer chamber on the side thereof. It is possible to eliminate atmospheric contamination in systems that are connected in series, and furthermore, the substrates are guided into each processing chamber via each auxiliary transport means on each branch path, and are transported to each adjacent processing space. It is also possible to eliminate particle contamination in the type in which the substrate is guided by moving means, thereby eliminating the above-mentioned disadvantages of the conventional type, and has the effect of simplifying the work and making it highly efficient.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram of a conventional example, Fig. 2 is an explanatory diagram of the principle of the device of the present invention, Fig. 3 is an explanatory diagram of an example of its implementation, and Fig. 4 is an explanatory diagram of an example of its implementation.
The figure is a diagram explaining its operation. A... Base body X... Conveyance path (1)...
・Transportation means (2)...Vacuum exhaust! (4)・
...Vacuum processing chamber (5)...Gate valve Y...Diversion path (7)...Auxiliary conveyance means Applicant: 2 people other than Japan Vacuum Technology Co., Ltd. - Figure 1 Figure 2 Figure 4 figure

Claims (1)

[Claims] In a system in which a substrate is sequentially introduced into a plurality of vacuum processing chambers and subjected to various vacuum treatments in each processing chamber, a conveyance means for guiding the substrate along a forward and backward conveyance path is housed. A vacuum transfer chamber is provided, and the plurality of vacuum processing chambers are sequentially arranged on the side thereof, and these are connected in parallel to each other through gate valves into the vacuum transfer chamber, and furthermore, a Each branch path extending into each vacuum processing chamber is formed through each gate valve, and each auxiliary transport means is provided in the vacuum transfer chamber to freely introduce and extract the substrate into each vacuum processing chamber along each branch path, A vacuum processing apparatus which repeatedly guides the substrate into each vacuum processing chamber along each branch path, and repeatedly guides the substrate forward or back and forth along the transfer path within the transfer chamber.