JPS63288060A - Manufacture of color image sensing element - Google Patents
Manufacture of color image sensing elementInfo
- Publication number
- JPS63288060A JPS63288060A JP63028928A JP2892888A JPS63288060A JP S63288060 A JPS63288060 A JP S63288060A JP 63028928 A JP63028928 A JP 63028928A JP 2892888 A JP2892888 A JP 2892888A JP S63288060 A JPS63288060 A JP S63288060A
- Authority
- JP
- Japan
- Prior art keywords
- filter
- cap
- sensing element
- image sensing
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Color Television Image Signal Generators (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、固体カラーカメラ、カラーラインセンサー等
のカラー撮像素子の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a color imaging device such as a solid-state color camera or a color line sensor.
従来のカラー撮像素子の製造方法では、第１図に示すよ
うに、撮像素子１をリードフレーム２上の所定位置にダ
イボンディングした後、撮像素子１のポンディングパッ
ド３をリードフレーム２の所定位置と図示のごとくワイ
ヤボンディングにより接続し、その後、撮像素子１を取
り付けたり−ドフレーム２をパッケージ４内に固定して
から、別途製作した色分離用フィルター（以下、フィル
ターと称す）５を透明接着剤（シール剤）層６により撮
像素子１の感光領域部に正確に位置合せして貼り合せ、
しかる後、透明ガラス等からなるキャップ７により、パ
ッケージ４の開口部を封止（シール）してカラー撮像素
子が作製される。このように、従来のカラー撮像素子の
製造方法では。In the conventional method for manufacturing a color image sensor, as shown in FIG. are connected by wire bonding as shown in the figure, and then the image sensor 1 is attached and the frame 2 is fixed in the package 4, and a separately produced color separation filter (hereinafter referred to as a filter) 5 is attached with transparent adhesive. The adhesive (sealant) layer 6 is accurately aligned and bonded to the photosensitive area of the image sensor 1,
Thereafter, the opening of the package 4 is sealed with a cap 7 made of transparent glass or the like to produce a color image sensor. In this way, in the conventional method of manufacturing a color image sensor.
フィルター５を貼り合せた後、キャップ７を気密に封止
する必要があり１作業性が悪い欠点があった。After the filter 5 is attached, the cap 7 must be hermetically sealed, which has the disadvantage of poor workability.
本発明は、従来のカラー撮像素子のように、フィルター
とキャップを別々に作製しないで、これらを一体化し、
撮像素子へのフィルターの貼り合せと、キャップによる
パッケージ開口部への封止を同時に行い得るようにし、
キャップ兼用フィルターの量産を容易にし、かつ、撮像
素子とフィルターの貼り合せの精度向上と作業のし易さ
等の品質面と作業性の改善を図ったものである。The present invention integrates a filter and a cap instead of manufacturing them separately as in conventional color image sensors.
The filter can be attached to the image sensor and the package opening can be sealed with the cap at the same time.
The aim is to facilitate the mass production of filters that also serve as caps, and to improve quality and workability, such as improving the precision of bonding the image sensor and filter together and making the work easier.
本発明は、従来技術の問題点を解決するために、支持板
上に多数個の単体フィルターを所定の間隔で２次元的に
配列して形成する工程と、上記単体フィルターの周囲に
所定の深さで、所定の幅の溝を物理的加工手段により加
工した後、該溝の間で切断してキャップ兼用フィルター
を得る工程と、上記単体フィルターの撮像素子への貼り
合せと、パッケージの開口部のキャップ部による封止と
を同時に行う工程とを具備することを特徴とする。In order to solve the problems of the prior art, the present invention includes a process of two-dimensionally arranging a large number of single filters at predetermined intervals on a support plate, and forming a predetermined depth around the single filters. Now, after processing grooves of a predetermined width by physical processing means, cutting between the grooves to obtain a filter that also serves as a cap, bonding the above-mentioned single filter to an image sensor, and opening of the package. and a step of simultaneously performing sealing with the cap portion.
以下に本発明を実施例により詳細に説明する。The present invention will be explained in detail below using examples.
第２図は１本発明の製造方法によって作製したカラー撮
像素子の構造例を示す断面図である。FIG. 2 is a sectional view showing an example of the structure of a color image sensor manufactured by the manufacturing method of the present invention.
図において、１は撮像素子、２はリードフレーム、３は
ポンディングパッド、４はパッケージ。In the figure, 1 is an image sensor, 2 is a lead frame, 3 is a bonding pad, and 4 is a package.
５′はフィルターとキャップとを一体化して、フィルタ
ーがキャップ部から突出した図示のような形状のキャッ
プ兼用フィルター、６はキャップ兼用フィルター５′と
撮像素子１の感光領域部とを貼り合せる透明接着剤層で
ある。キャップ兼用フィルター５′の突出高さは、該フ
ィルター５′ をパッケージ４の開口に取り付けたとき
に、キャップ部の内面がポンディングパッド３にワイヤ
ボンディングされたワイヤに接触しない程度とする。Reference numeral 5' denotes a filter that serves as a cap and has a shape as shown in which the filter and the cap are integrated, with the filter protruding from the cap part, and 6 indicates a transparent adhesive for bonding the filter that also serves as a cap 5' and the photosensitive area of the image sensor 1. This is the agent layer. The protruding height of the cap filter 5' is such that when the filter 5' is attached to the opening of the package 4, the inner surface of the cap portion does not come into contact with the wire bonded to the bonding pad 3.
このような構造のカラー撮像素子を作製するには、まず
、第４図に示すように、透明な支持板９上に多数個の単
体フィルター８を所定間隔で２次元的に配列して形成し
た後、単体フィルター８の周囲に所定の深さくこの深さ
は、キャップ部からのキャップ兼用フィルター５′のフ
ィルターの突出高さに等しい）で、所定の幅の溝を機械
的研削、超音波加工１機械的ドリル、レーザ加工等の物
理的加工手段によって加工した後、該溝の中間から切断
して所定形状のキャップ兼用フィルター５′を得る。To manufacture a color image sensor having such a structure, first, as shown in FIG. 4, a large number of single filters 8 are two-dimensionally arranged at predetermined intervals on a transparent support plate 9. After that, a groove of a predetermined width is formed around the single filter 8 to a predetermined depth (this depth is equal to the protrusion height of the cap filter 5' from the cap part) and ultrasonic processing. 1. After being processed by physical processing means such as a mechanical drill or laser processing, the groove is cut from the middle to obtain a cap filter 5' having a predetermined shape.
次に、撮像素子１をリードフレーム２上の所定位置にダ
イボンディングした後、撮像素子１のポンディングパッ
ド３をリードフレーム２の所定位置とワイヤボンディン
グにより接続し、その後。Next, after die-bonding the image sensor 1 to a predetermined position on the lead frame 2, the bonding pad 3 of the image sensor 1 is connected to a predetermined position of the lead frame 2 by wire bonding, and then.
撮像素子１を取り付けたリードフレーム２をパッケージ
４内に固定する。A lead frame 2 to which an image sensor 1 is attached is fixed in a package 4.
次に、上記最初の工程で得られたキャップ兼用フィルタ
ー５′ を透明接着剤層６により撮像素子１の感光領域
部に正確に位置合せして貼り合せると同時に、キャップ
兼用フィルター５′のパッケージ４の開口部への封止を
同時に行ってカラー撮像素子の作製を完了する。Next, the cap filter 5' obtained in the first step is laminated to the photosensitive area of the image sensor 1 using the transparent adhesive layer 6, while simultaneously aligning the cap filter 5' with the package 4 of the cap filter 5'. At the same time, the opening is sealed to complete the fabrication of the color image sensor.
本発明の製造方法は、上記のような構成なので、■多数
個の単体フィルター８を支持板９上に配列形成した状態
で、所定深さ、所定幅の溝が同時に形成できる。０１回
の溝加工により所定のキャップ形状の段付きの溝を形成
できる。■と■から、■キャップ兼用フィルター５′
を同一工程で多数個同時に形成でき、量産に適する。■
フィルターの撮像素子１の感光領域部への貼り合せと、
キャップによるパッケージ４の開口部への封止を同時に
できる。■〜■から、■工程が簡略化でき、■量産に適
する。さらに、■従来は撮像素子１にフィルターを貼り
合せる場合、フィルター−の寸法が小さいため、貼り合
せ時のフィルターの保持が困難であったが１本発明では
、フィルターとキャップとを一体化したので、保持し易
く、撮像素子とフィルターの貼り合せ精度が向上し、し
かも作業性の改善が図れる。Since the manufacturing method of the present invention has the above-described configuration, (1) grooves of a predetermined depth and width can be simultaneously formed with a large number of single filters 8 arranged and formed on the support plate 9; A stepped groove having a predetermined cap shape can be formed by 01 groove machining. From ■ and ■, ■ Cap filter 5'
can be formed in large numbers at the same time in the same process, making it suitable for mass production. ■
Attaching the filter to the photosensitive area of the image sensor 1;
The opening of the package 4 can be sealed with the cap at the same time. From ■ to ■, ■ the process can be simplified, and ■ it is suitable for mass production. Furthermore, in the past, when attaching a filter to the image sensor 1, it was difficult to hold the filter during attachment due to the small size of the filter; however, in the present invention, the filter and the cap are integrated. It is easy to hold, the accuracy of bonding the image sensor and the filter is improved, and workability is improved.
第３図は、本発明の製造方法によって作製した別のカラ
ー撮像素子の構造例を示す断面図である。FIG. 3 is a sectional view showing a structural example of another color image sensor manufactured by the manufacturing method of the present invention.
本図では、第２図のキャップ兼用フィルター５′の断面
形状を多少変えたものである。In this figure, the cross-sectional shape of the cap filter 5' shown in FIG. 2 is slightly changed.
以上説明したように１本発明によれば、撮像素子とフィ
ルターの貼り合せ精度が向上でき、かつ、簡略な工程で
、作業性が良く、しかも量産に適するカラー撮像素子の
製造方法を提供できる。As explained above, according to one aspect of the present invention, it is possible to provide a method for manufacturing a color image sensor, which can improve the bonding accuracy of an image sensor and a filter, has a simple process, has good workability, and is suitable for mass production.
第１図は、従来のカラー撮像素子の構造を示す断面図、
第２図、第３図は、それぞれ本発明の製造方法により作
製したカラー撮像素子の構造例を示す断面図、第４図は
、本発明の製造方法を説明するための図である。
１・・・撮像素子
２・・・リードフレーム
３・・・ボンディングパッド
４・・・パッケージ
５・・・フィルター
５′・・・キャップ兼用フィルター
６・・・透明接着剤層
７・・・キャンプ
８・・・単体フィルター
９・・・支持板FIG. 1 is a cross-sectional view showing the structure of a conventional color image sensor;
FIGS. 2 and 3 are cross-sectional views showing structural examples of color image sensors manufactured by the manufacturing method of the present invention, and FIG. 4 is a diagram for explaining the manufacturing method of the present invention. 1... Imaging element 2... Lead frame 3... Bonding pad 4... Package 5... Filter 5'... Cap filter 6... Transparent adhesive layer 7... Camp 8 ...Single filter 9...Support plate
Claims (1)
２次元的に配列して形成する工程と、上記単体フィルタ
ーの周囲に所定の深さで、所定の幅の溝を物理的加工手
段により加工した後、該溝の間で切断してキャップ兼用
フィルターを得る工程と、上記単体フィルターの撮像素
子への貼り合せと、パッケージの開口部のキャップ部に
よる封止とを同時に行う工程とを具備することを特徴と
するカラー撮像素子の製造方法。1. Forming a large number of single filters two-dimensionally arranged at predetermined intervals on a support plate, and physically forming grooves of a predetermined depth and width around the single filters. a step of cutting between the grooves to obtain a filter that also serves as a cap, and a step of simultaneously bonding the single filter to the image sensor and sealing the opening of the package with the cap portion. A method of manufacturing a color image sensor, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63028928A JPS63288060A (en) | 1988-02-12 | 1988-02-12 | Manufacture of color image sensing element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63028928A JPS63288060A (en) | 1988-02-12 | 1988-02-12 | Manufacture of color image sensing element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63288060A true JPS63288060A (en) | 1988-11-25 |
Family
ID=12262062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63028928A Pending JPS63288060A (en) | 1988-02-12 | 1988-02-12 | Manufacture of color image sensing element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63288060A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5478026A (en) * | 1977-12-05 | 1979-06-21 | Hitachi Ltd | Production of solid color image pickup unit |
-
1988
- 1988-02-12 JP JP63028928A patent/JPS63288060A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5478026A (en) * | 1977-12-05 | 1979-06-21 | Hitachi Ltd | Production of solid color image pickup unit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4894707A (en) | Semiconductor device having a light transparent window and a method of producing same | |
| EP1473777B1 (en) | Solid-state imaging device and method for producing the same | |
| JPH05206354A (en) | Semiconductor pressure sensor and its manufacture | |
| KR20070110831A (en) | Method for collectively producing a superimposed element microstructure | |
| JP2578774B2 (en) | Method for manufacturing module with lens | |
| JP2009086092A (en) | Method of manufacturing optical component and method of manufacturing photographing device | |
| JPS63288060A (en) | Manufacture of color image sensing element | |
| JP3166216B2 (en) | Solid-state imaging device with on-chip lens and method of manufacturing the same | |
| JP4255173B2 (en) | Optical microphone and manufacturing method thereof | |
| JPH03151666A (en) | Manufacture of solid image-pickup device | |
| JP2001024213A (en) | Reflection type optical sensor and its manufacture | |
| JPH0728014B2 (en) | Solid-state imaging device | |
| US7245834B2 (en) | Optical device for optical semiconductor package and fabrication method | |
| JP2569946B2 (en) | Anodic bonding method | |
| JP2000286401A (en) | Solid-state image pickup device and its manufacture | |
| JPS60136254A (en) | Solid-state image pickup device and manufacture thereof | |
| JPH0685097A (en) | Manufacture of solid-state imaging device | |
| JPS6130241B2 (en) | ||
| JPH065717B2 (en) | Solid photography equipment | |
| TW201941447A (en) | Semiconductor device | |
| JPH0518256B2 (en) | ||
| JPH0754974B2 (en) | Solid-state image sensor | |
| JP2687707B2 (en) | Light receiving semiconductor device and assembling method thereof | |
| JPH0245994A (en) | Manufacture of surface light emitting laser element | |
| JPH08316504A (en) | Optical part and manufacturing method thereof |